How to Export Gerber Files in DesignSpark PCB V11.0.0: A Complete Engineering Guide

Gerber files remain the industry-standard format for PCB manufacturing, serving as the universal language between design engineers and fabrication houses. DesignSpark PCB V11.0.0 provides a streamlined workflow for generating these essential manufacturing files. This comprehensive guide walks you through the complete process of exporting Gerber files, ensuring your designs translate accurately from screen to physical board.

Understanding Gerber File Requirements

Before initiating the export process, engineers must recognize what constitutes a complete Gerber file package. A standard submission includes copper layer files for all conductive layers, solder mask files for both top and bottom surfaces, silkscreen files containing component designators and reference markings, paste mask files for SMT assembly, NC drill files specifying hole locations and dimensions, and critically, a board outline file defining the physical boundary of your PCB.

Each layer serves a distinct purpose in the fabrication process. Copper layers define electrical connectivity, while solder mask layers protect traces from oxidation and prevent solder bridges during assembly. Missing or incorrectly configured layers can result in manufacturing delays, increased costs, or non-functional boards. Therefore, thorough preparation before export significantly reduces revision cycles.

Pre-Export Design Verification

Running a comprehensive design rule check (DRC) before generating Gerber files is essential engineering practice. DesignSpark PCB V11.0.0 includes built-in verification tools that identify potential manufacturing issues before they become expensive problems.

Verify that trace widths meet your fabricator’s minimum specifications, typically 0.15mm for standard processes. Confirm clearances between copper features comply with both electrical requirements and manufacturing capabilities. Additionally, check annular ring dimensions around vias and through-holes to ensure reliable plating adhesion.

Pay particular attention to thermal relief connections on ground and power planes. Insufficient thermal relief can cause soldering difficulties during assembly, while excessive relief compromises electrical performance. Finding the optimal balance requires understanding both your assembly process and electrical requirements.

Accessing the Manufacturing Plots Function

DesignSpark PCB V11.0.0 centralizes all Gerber generation capabilities within the Manufacturing Plots function. To access this feature, navigate to the menu bar and select Output, then choose Manufacturing Plots from the dropdown menu. This action opens the primary export configuration window where all plot settings are managed.

The Manufacturing Plots window presents a comprehensive interface displaying available plot types on the left panel and configuration options on the right. This layout allows engineers to quickly select required layers while maintaining granular control over individual plot parameters.

Configuring Automatic Plot Generation

DesignSpark PCB V11.0.0 offers automatic plot generation that significantly accelerates the export workflow. Within the Manufacturing Plots window, locate and select Auto-Gen plots, then choose Gerbers from the available options. This automated approach ensures consistent output by applying predefined settings optimized for standard manufacturing requirements.

When the auto-generation dialog appears, configure two critical parameters. First, set the Layer/Plot Types dropdown to All, ensuring comprehensive layer coverage. Second, verify that the Side option is also configured to All, generating plots for both top and bottom surfaces simultaneously. Most importantly, enable the NC Drill plot option within this dialog to include drilling data in your output package.

Click OK to confirm these settings and return to the main Manufacturing Plots window. The system automatically populates the Plots checklist with appropriate layer selections based on your design configuration.

Manual Plot Configuration and Verification

While automatic generation handles most scenarios effectively, manual verification ensures nothing is overlooked. Examine the Plots checkboxes in the left panel of the Manufacturing Plots window. Each selected checkbox represents a plot that will be generated during export.

Select any individual plot, such as Top Copper, to review its specific configuration in the right panel. The Layers tab displays which design layers contribute to the selected plot output. For copper layers, only the corresponding copper data should be included. Cross-contamination between layers results in manufacturing errors, so verify these assignments carefully.

The software provides sensible defaults for standard two-layer and four-layer designs. However, complex multilayer boards or designs with special requirements may need manual adjustment. Engineers working with impedance-controlled traces, buried vias, or other advanced features should confirm layer assignments match their stack-up documentation.

Adding Board Outline to Your Gerber Package

Fabricators require a clear board outline definition to determine cutting boundaries. DesignSpark PCB V11.0.0 may not automatically include this element in the default plot configuration. If the system displays a warning about missing board outline when you attempt to run the export, you must add this layer manually.

Access the outline configuration through the Options button within the Manufacturing Plots window. This opens additional settings where you can modify both Gerber and NC Drill parameters. The board outline typically resides on a dedicated mechanical layer and must be explicitly included in your output files.

Alternative approaches exist for generating board outline data depending on your design methodology. Some engineers maintain outline geometry on the board layer itself, while others use dedicated mechanical layers. Consult your fabricator’s requirements to determine the preferred format for board boundary definition.

Proper file organization prevents confusion when submitting manufacturing data. Click the Options button within the Manufacturing Plots window to access output path configuration. Locate the file destination settings and select your preferred storage location.

The recommended approach uses the option labeled “This folder below the design file,” which creates a dedicated Plots subfolder adjacent to your design file. This method maintains clear association between source designs and generated outputs, simplifying revision tracking and file management.

For team environments with centralized file servers, consider establishing standardized folder structures that accommodate version control and review workflows. Consistent organization across projects reduces errors during handoff between design and manufacturing teams.

Executing the Export Process

With all parameters configured, click the Run button to initiate Gerber generation. The system processes each selected plot sequentially, applying the configured settings and writing output files to the specified destination.

Upon completion, DesignSpark PCB V11.0.0 generates a report file summarizing the export operation. Review this report carefully to confirm all expected files were created successfully. The report identifies any warnings or errors encountered during generation, allowing immediate correction before submitting files to your fabricator.

Navigate to the Plots folder created during export to verify the complete file package. A typical two-layer board generates eight to twelve files, including copper layers, masks, silkscreen, drill data, and outline definition. Compare your output against your fabricator’s file checklist to ensure completeness.

Best Practices for Manufacturing Submission

After generating Gerber files, several additional steps improve manufacturing outcomes. First, use a standalone Gerber viewer application to visually verify each layer independently. This verification catches issues that automated checks might miss, such as misaligned apertures or incorrect polarities.

Compress all generated files into a single archive before submission. ZIP format remains universally accepted across fabrication houses. Include your original design files only if specifically requested, as most fabricators work exclusively from Gerber data.

Provide clear documentation specifying your stack-up requirements, material preferences, surface finish specifications, and any special instructions. While Gerber files contain geometric data, they cannot communicate these essential manufacturing parameters.

Conclusion

Exporting Gerber files from DesignSpark PCB V11.0.0 follows a logical workflow that balances automation with engineering control. By understanding each configuration option and verifying outputs before submission, engineers minimize manufacturing risks while maintaining efficient design-to-production cycles. Consistent application of these procedures across projects establishes reliable processes that scale effectively as design complexity increases.