The XCZU9EG-2FFVC900I is a high-performance System-on-Chip (SoC) FPGA from AMD Xilinx’s Zynq UltraScale+ MPSoC family. This industrial-grade programmable logic device combines powerful ARM processing capabilities with flexible FPGA fabric, making it ideal for AI, machine learning, 5G wireless, and embedded vision applications.
XCZU9EG-2FFVC900I Key Features and Benefits
The XCZU9EG-2FFVC900I delivers exceptional computational power by integrating a heterogeneous processing system with programmable logic. Engineers choose this device for applications requiring real-time control, graphics processing, and high-bandwidth data handling in a single chip solution.
Why Choose the XCZU9EG-2FFVC900I?
- High Logic Density: 599,550 system logic cells for complex designs
- Industrial Temperature Range: -40°C to +100°C operation
- Integrated Processing: Quad-core ARM Cortex-A53 + Dual-core ARM Cortex-R5
- Advanced GPU: ARM Mali-400 MP2 for graphics acceleration
- 16nm FinFET+ Technology: Superior power efficiency and performance
XCZU9EG-2FFVC900I Technical Specifications
General Specifications Table
| Parameter |
Specification |
| Manufacturer |
AMD Xilinx |
| Part Number |
XCZU9EG-2FFVC900I |
| Family |
Zynq UltraScale+ MPSoC |
| Device Variant |
EG (Enhanced Graphics) |
| Process Technology |
16nm FinFET+ |
| Package Type |
900-Pin FC-BGA (FFVC900) |
| Ball Pitch |
1.0mm |
| Core Voltage |
0.85V |
| Speed Grade |
-2 (Standard Performance) |
| Temperature Grade |
Industrial (I): -40°C to +100°C |
| RoHS Compliance |
Yes |
XCZU9EG-2FFVC900I Programmable Logic (PL) Resources
| Resource |
Quantity |
| System Logic Cells |
599,550 |
| CLB Flip-Flops |
548,160 |
| CLB LUTs |
274,080 |
| Distributed RAM (Kb) |
4,271 |
| Block RAM (Mb) |
32.1 |
| UltraRAM (Mb) |
7.6 |
| DSP Slices |
2,520 |
| Clock Management Tiles (CMTs) |
8 |
Processing System (PS) Specifications
| Component |
Details |
| Application Processing Unit (APU) |
Quad-core ARM Cortex-A53 MPCore with CoreSight (up to 1.5 GHz) |
| Real-Time Processing Unit (RPU) |
Dual-core ARM Cortex-R5F with CoreSight (up to 533 MHz) |
| Graphics Processing Unit (GPU) |
ARM Mali-400 MP2 |
| On-Chip Memory |
256 KB |
| L1 Cache (per A53 core) |
32 KB I-Cache, 32 KB D-Cache |
| L2 Cache (shared) |
1 MB |
| Memory Support |
DDR4, DDR3, DDR3L, LPDDR4, LPDDR3 |
XCZU9EG-2FFVC900I Connectivity and I/O Interfaces
High-Speed Serial Transceivers
| Interface |
Specification |
| PS-GTR Transceivers |
Up to 6.0 Gb/s |
| GTH Transceivers |
Up to 16.3 Gb/s |
| GTH Count |
4 (in FFVC900 package) |
Integrated Peripheral Interfaces
The XCZU9EG-2FFVC900I Processing System includes the following hard IP interfaces:
| Interface Type |
Features |
| PCIe |
Gen2 x4 |
| USB |
2x USB 3.0, 2x USB 2.0 |
| Ethernet |
4x Tri-mode Gigabit Ethernet (RGMII/SGMII) |
| SATA |
SATA 3.1 compliant (AHCI 1.3) |
| DisplayPort |
1.2a, up to 4K resolution |
| SD/SDIO |
2x SD 3.0/SDIO 3.0 |
| CAN |
2x CAN 2.0B |
| I2C |
2x I2C |
| SPI |
2x SPI |
| UART |
2x UART |
| GPIO |
Up to 78 MIO pins |
Programmable Logic I/O
| I/O Type |
Count |
| Maximum HP I/O |
High-performance I/O (1.0V–1.8V) |
| Maximum HD I/O |
High-density I/O (1.2V–3.3V) |
| Total User I/O |
204 |
XCZU9EG-2FFVC900I Part Number Decoder
Understanding the XCZU9EG-2FFVC900I part number helps identify the exact device configuration:
| Code |
Meaning |
| XC |
Xilinx Commercial |
| ZU |
Zynq UltraScale+ |
| 9 |
Logic density tier |
| EG |
Enhanced Graphics (with GPU) |
| -2 |
Speed grade (-2 = standard) |
| FF |
Flip-chip package |
| VC |
Package variant |
| 900 |
Pin count |
| I |
Industrial temperature (-40°C to +100°C) |
Available Temperature and Speed Grade Options
| Variant |
Temperature Range |
Speed Grade |
| XCZU9EG-1FFVC900E |
Extended (0°C to +100°C) |
-1 (Lower) |
| XCZU9EG-2FFVC900E |
Extended (0°C to +100°C) |
-2 (Standard) |
| XCZU9EG-2FFVC900I |
Industrial (-40°C to +100°C) |
-2 (Standard) |
| XCZU9EG-3FFVC900E |
Extended (0°C to +100°C) |
-3 (Highest) |
XCZU9EG-2FFVC900I Target Applications
The XCZU9EG-2FFVC900I is engineered for demanding applications across multiple industries:
Industrial and Automation
- Industrial IoT gateways
- Motor control systems
- Machine vision and inspection
- Programmable logic controllers (PLCs)
- Robotics and automation
Wireless Communications
- 5G wireless infrastructure
- Software-defined radio (SDR)
- Baseband processing
- Massive MIMO systems
- Small cell base stations
Automotive Systems
- Advanced Driver Assistance Systems (ADAS)
- Sensor fusion processing
- In-vehicle networking
- Automotive vision systems
- Lidar and radar processing
Artificial Intelligence and Machine Learning
- Edge AI inference
- Neural network acceleration
- Deep learning processing
- Computer vision
- Natural language processing
Video and Multimedia
- 4K/8K video processing
- Video codec encoding/decoding
- Broadcasting equipment
- Professional video production
- Video surveillance systems
Medical and Scientific
- Medical imaging systems
- Diagnostic equipment
- Laboratory instrumentation
- High-performance computing
- Data acquisition systems
XCZU9EG-2FFVC900I Development Tools and Software
Vivado Design Suite
AMD Xilinx Vivado Design Suite provides comprehensive development support for the XCZU9EG-2FFVC900I:
- Vivado HLS: High-level synthesis for C/C++ to RTL conversion
- Vivado IP Integrator: Block-based system design
- Vivado Simulator: Integrated simulation environment
- Vivado Implementation: Place and route optimization
PetaLinux and Software Development
- PetaLinux SDK for embedded Linux development
- Vitis unified software platform
- Arm Development Studio support
- FreeRTOS support for RPU
Evaluation and Development Boards
Popular development platforms featuring the XCZU9EG include:
- AMD ZCU102 Evaluation Kit
- Third-party SOM (System-on-Module) solutions
- Custom carrier boards with FMC connectivity
XCZU9EG-2FFVC900I vs. Alternative Devices
Comparison with Other Zynq UltraScale+ Devices
| Feature |
XCZU9EG |
XCZU7EV |
XCZU15EG |
| Logic Cells |
599,550 |
504,000 |
747,840 |
| DSP Slices |
2,520 |
1,728 |
3,528 |
| Block RAM (Mb) |
32.1 |
28.8 |
40.5 |
| UltraRAM (Mb) |
7.6 |
9.0 |
31.5 |
| Video Codec Unit |
No |
Yes |
No |
| Package Options |
Multiple |
Multiple |
Multiple |
Ordering Information and Availability
The XCZU9EG-2FFVC900I is available through authorized AMD Xilinx distributors worldwide. For pricing, lead times, and technical support, contact your local distributor or visit our Xilinx FPGA product catalog.
Package Information
| Parameter |
Details |
| Package Style |
FC-BGA (Flip Chip Ball Grid Array) |
| Pin Count |
900 |
| Package Dimensions |
31mm x 31mm |
| Ball Pitch |
1.0mm |
| Moisture Sensitivity Level |
MSL-3 |
| Packaging |
Tray |
XCZU9EG-2FFVC900I Documentation and Resources
Essential Documents
- DS891: Zynq UltraScale+ MPSoC Data Sheet: Overview
- DS925: Zynq UltraScale+ MPSoC Data Sheet: DC and AC Switching Characteristics
- UG1085: Zynq UltraScale+ MPSoC Technical Reference Manual
- UG1075: Zynq UltraScale+ MPSoC Packaging and Pinout Guide
Design Resources
- Reference designs and application notes
- PCB design guidelines
- Power estimation tools
- Schematic symbols and footprints
Frequently Asked Questions About XCZU9EG-2FFVC900I
What is the difference between XCZU9EG and XCZU9CG?
The XCZU9EG includes the ARM Mali-400 MP2 GPU for graphics acceleration, while the XCZU9CG variant does not include the GPU. Choose the EG variant for applications requiring integrated graphics processing.
What temperature range does the “-I” suffix indicate?
The “-I” suffix indicates Industrial temperature grade, supporting operation from -40°C to +100°C junction temperature. This makes the XCZU9EG-2FFVC900I suitable for harsh industrial environments.
Is the XCZU9EG-2FFVC900I footprint compatible with other devices?
Yes, the FFVC900 package is footprint compatible with other Zynq UltraScale+ devices in the same package, allowing for design scalability and migration between different logic densities.
What speed grade should I choose?
The -2 speed grade offers a balance between performance and power consumption. For applications requiring maximum performance, consider the -3 speed grade. For power-sensitive applications, the -1 speed grade may be appropriate.
