Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XCZU9EG-3FFVB1156E: AMD Xilinx Zynq UltraScale+ MPSoC FPGA

Product Details

The XCZU9EG-3FFVB1156E is a high-performance System-on-Chip (SoC) from the AMD Xilinx Zynq UltraScale+ MPSoC family. This advanced programmable device combines a powerful 64-bit quad-core ARM Cortex-A53 processor with industry-leading FPGA programmable logic, making it ideal for AI, machine learning, 5G wireless, and embedded vision applications. With the highest -3 speed grade and extended temperature range, this IC delivers exceptional performance for demanding industrial and commercial designs.


XCZU9EG-3FFVB1156E Key Features and Benefits

The XCZU9EG-3FFVB1156E Zynq UltraScale+ MPSoC offers an unmatched combination of processing power and programmable flexibility. Engineers choose this device for applications requiring heterogeneous computing, real-time control, and hardware acceleration in a single integrated solution.

Heterogeneous Processing System Architecture

This MPSoC integrates multiple processing elements to handle diverse workloads efficiently:

  • Quad-core ARM Cortex-A53 application processor running up to 1.5GHz
  • Dual-core ARM Cortex-R5F real-time processor at up to 600MHz
  • Mali-400 MP2 graphics processing unit for display applications
  • Advanced cache coherency and memory management unit support

High-Performance Programmable Logic Resources

The XCZU9EG delivers substantial FPGA resources for custom hardware acceleration:

  • 599K+ System Logic Cells for complex digital designs
  • 2,520 DSP Slices for signal processing and AI inference
  • 32.1 Mb Block RAM and 8.8 Mb Distributed RAM
  • Up to 24 GTH Transceivers supporting 16.3 Gb/s data rates

XCZU9EG-3FFVB1156E Technical Specifications

Parameter Specification
Manufacturer Part Number XCZU9EG-3FFVB1156E
Manufacturer AMD (formerly Xilinx)
Product Family Zynq UltraScale+ MPSoC EG
Device Type System-on-Chip (SoC) IC
Process Technology 16nm FinFET+
Speed Grade -3 (Highest Performance)
Temperature Grade E (Extended: -40°C to +100°C)
Package Type 1156-FCBGA
Package Dimensions 35mm × 35mm
Ball Pitch 1.0mm
RoHS Status Compliant

XCZU9EG-3FFVB1156E Programmable Logic Specifications

Resource Quantity
System Logic Cells 599,550
CLB Flip-Flops 548,160
CLB Look-Up Tables (LUTs) 274,080
DSP48E2 Slices 2,520
Block RAM (36Kb each) 912 Blocks
Total Block RAM 32.1 Mb
Distributed RAM 8.8 Mb
Clock Management Tiles (CMT) 4
Maximum HP I/O Pins 208
Maximum HD I/O Pins 120

Processing System Specifications

Feature Description
Application Processor Quad-core ARM Cortex-A53 (64-bit)
APU Clock Speed Up to 1.5 GHz
Real-Time Processor Dual-core ARM Cortex-R5F (32-bit)
RPU Clock Speed Up to 600 MHz
GPU ARM Mali-400 MP2
On-Chip Memory 256 KB OCM
L1 Cache (per A53 core) 32 KB I-Cache + 32 KB D-Cache
L2 Cache (shared) 1 MB
External Memory Interface DDR4, DDR3, DDR3L, LPDDR4

High-Speed Connectivity and I/O Interfaces

The XCZU9EG-3FFVB1156E provides comprehensive connectivity options for modern system designs:

Integrated High-Speed Interfaces

Interface Specification
PS-GTR Transceivers 4× supporting up to 6.0 Gb/s
PL GTH Transceivers Up to 24× at 16.3 Gb/s
PCIe Gen2 ×4
USB 3.0 2× SuperSpeed ports
USB 2.0 2× High-Speed ports
SATA 3.1 compliant
DisplayPort 1.2a, 4K support
Gigabit Ethernet 4× Tri-mode MACs

General-Purpose Peripherals

  • 2× UART, 2× CAN 2.0B, 2× I2C, 2× SPI
  • SD/SDIO 3.0 controller
  • NAND Flash controller
  • Quad SPI Flash controller
  • 78 Multiplexed I/O (MIO) pins
  • 96 Extended MIO (EMIO) through PL

XCZU9EG-3FFVB1156E Part Number Decoder

Understanding the AMD Xilinx part number helps engineers select the right device variant:

Code Meaning
XC Xilinx Commercial
ZU Zynq UltraScale+
9 Device Size (Logic Density)
EG Device Variant (EG = with GPU)
-3 Speed Grade (Fastest)
FF Flip-Chip, Fine-pitch Package
VB Package Body Size Code
1156 Ball Count
E Extended Temperature Range

Target Applications for XCZU9EG-3FFVB1156E

The XCZU9EG-3FFVB1156E excels in applications demanding high computational throughput, real-time processing, and system integration:

Industrial and Embedded Systems

  • 5G Wireless Infrastructure – Baseband processing and beamforming
  • Next-Gen ADAS – Sensor fusion and object detection
  • Industrial Automation – Motor control and machine vision
  • Medical Imaging – Ultrasound and CT/MRI processing

Data Center and Networking

  • Network Acceleration – Packet processing at 100G+
  • Video Transcoding – Real-time 4K/8K encoding
  • Storage Controllers – NVMe and RAID acceleration

AI and Machine Learning

  • Edge AI Inference – CNN and DNN acceleration
  • Computer Vision – Object recognition and tracking
  • Embedded Vision – Smart camera systems

Development Tools and Software Support

AMD provides comprehensive development resources for the XCZU9EG:

  • Vivado Design Suite – FPGA synthesis, implementation, and debug
  • Vitis Unified Platform – Application development and AI tools
  • PetaLinux – Embedded Linux distribution
  • Xilinx Runtime (XRT) – Standardized runtime for acceleration

Why Choose XCZU9EG-3FFVB1156E for Your Design

The XCZU9EG-3FFVB1156E stands out as a premier choice for system architects requiring:

  1. Maximum Performance – The -3 speed grade delivers the fastest timing specifications
  2. Extended Temperature Operation – Reliable from -40°C to +100°C
  3. Integrated Processing – ARM processors + FPGA fabric reduce BOM and board space
  4. Future-Proof Architecture – 16nm FinFET+ technology with long-term availability
  5. Scalability – Pin-compatible with other Zynq UltraScale+ devices

Related Zynq UltraScale+ MPSoC Devices

Part Number Logic Cells DSP Slices Block RAM
XCZU7EG-FFVB1156 504K 1,728 28.3 Mb
XCZU9EG-3FFVB1156E 599K 2,520 32.1 Mb
XCZU11EG-FFVC1156 649K 2,928 33.4 Mb
XCZU15EG-FFVB1156 747K 3,528 41.4 Mb

Order XCZU9EG-3FFVB1156E Today

Looking for reliable supply of AMD Xilinx Zynq UltraScale+ MPSoC devices? Browse our complete selection of Xilinx FPGA products including the XCZU9EG-3FFVB1156E and other Zynq UltraScale+ family members. We offer competitive pricing, fast shipping, and technical support for your FPGA design projects.


Frequently Asked Questions About XCZU9EG-3FFVB1156E

What is the difference between XCZU9EG and XCZU9CG?

The XCZU9EG includes the ARM Mali-400 MP2 GPU for graphics and display applications, while the XCZU9CG variant excludes the GPU. Both devices share identical programmable logic resources.

What does the -3 speed grade mean?

The -3 speed grade represents the fastest timing specifications available for the XCZU9EG family. It offers approximately 15-20% better performance compared to the -1 speed grade, ideal for maximum clock frequency designs.

Is the XCZU9EG-3FFVB1156E suitable for automotive applications?

The “E” suffix indicates Extended temperature range (-40°C to +100°C). For automotive-grade requirements, consider the XCZU9EG variants with “I” (Industrial) or “Q” (Automotive AEC-Q100) qualifications.

What memory types does the XCZU9EG support?

The Processing System supports DDR4 (up to 2400 MT/s), DDR3/DDR3L, and LPDDR4. The Programmable Logic can interface with additional memory through HP and HD I/O banks.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.