Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XCZU9EG-L1FFVB1156I: AMD Xilinx Zynq UltraScale+ MPSoC FPGA – Complete Technical Guide

Product Details

The XCZU9EG-L1FFVB1156I is a high-performance System-on-Chip (SoC) from AMD/Xilinx’s renowned Zynq UltraScale+ MPSoC family. This industrial-grade FPGA combines powerful ARM processing cores with flexible programmable logic, making it an ideal solution for demanding embedded applications in telecommunications, industrial automation, automotive systems, and advanced computing platforms.

XCZU9EG-L1FFVB1156I Key Features and Benefits

The XCZU9EG-L1FFVB1156I delivers exceptional performance through its heterogeneous processing architecture. This device integrates multiple processing engines within a single chip, eliminating the need for separate processors and FPGAs in your design.

Why Choose the XCZU9EG-L1FFVB1156I MPSoC?

  • Unified Processing Architecture – Combines quad-core ARM Cortex-A53 application processor with dual-core ARM Cortex-R5 real-time processor
  • Low-Power Industrial Design – -1LI speed grade optimized for reduced power consumption at 0.72V or 0.85V VCCINT
  • 16nm FinFET+ Technology – Advanced process node delivers superior performance-per-watt efficiency
  • Industrial Temperature Range – Operates reliably from -40°C to +100°C
  • Rich Programmable Logic – 599,550 logic cells provide extensive customization capabilities

XCZU9EG-L1FFVB1156I Technical Specifications

Processing System (PS) Architecture

Specification Details
Application Processing Unit (APU) Quad-core ARM Cortex-A53 MPCore with CoreSight™
APU Clock Speed Up to 1.2 GHz
APU Features NEON™ SIMD, Single/Double Precision Floating Point
L1 Cache 32KB Instruction / 32KB Data per core
L2 Cache 1MB shared
Real-Time Processing Unit (RPU) Dual-core ARM Cortex-R5F with CoreSight™
RPU Clock Speed Up to 500 MHz
RPU Features Single/Double Precision Floating Point, 32KB/32KB L1 Cache, TCM
Graphics Processing Unit (GPU) ARM Mali™-400 MP2

Programmable Logic (PL) Resources

Resource Quantity
System Logic Cells 599,550
CLB Flip-Flops 548,160
CLB LUTs 274,080
Block RAM 32.1 Mb
UltraRAM 31.5 Mb
DSP Slices 2,520

Memory and Storage Support

Memory Type Specification
On-Chip Memory 256KB with ECC
DDR4 SDRAM Up to 2,400 MT/s
DDR3/DDR3L Supported
LPDDR4 Supported
LPDDR3 Supported
External Flash Quad-SPI, NAND, eMMC

High-Speed Connectivity and I/O

Interface Specification
GTH Transceivers Up to 16.3 Gb/s
PS I/O Pins 214
HP I/O Banks High-Performance (1.0V to 1.8V)
HD I/O Banks High-Density I/O
DisplayPort 1.2a TX
USB 2.0 Host/Device
PCIe® Gen2 x4

XCZU9EG-L1FFVB1156I Package Information

Parameter Value
Part Number XCZU9EG-L1FFVB1156I
Package Type FCBGA (Flip-Chip Ball Grid Array)
Package Code FFVB1156
Pin Count 1,156 pins
Package Dimensions 35mm x 35mm
Ball Pitch 1.0mm
Speed Grade -1LI (Low Power Industrial)
Temperature Grade Industrial (-40°C to +100°C)
Process Technology 16nm FinFET+
Core Voltage (VCCINT) 0.72V or 0.85V

XCZU9EG-L1FFVB1156I Integrated Peripherals

Communication Interfaces

  • UART – Multiple universal asynchronous receiver-transmitters
  • CAN 2.0B – Controller Area Network for automotive and industrial applications
  • I²C – Inter-Integrated Circuit bus
  • SPI – Serial Peripheral Interface
  • USB 2.0 – Universal Serial Bus with OTG support
  • Gigabit Ethernet – RGMII/SGMII MAC with IEEE 1588 support
  • SDIO 3.0 – SD card interface

System Management Features

  • 32-bit GPIO – General-purpose input/output
  • Real-Time Clock (RTC) – Battery-backed timekeeping
  • Watchdog Timers – System monitoring and recovery
  • Triple Timer Counters (TTC) – Precision timing
  • System Monitor (SYSMON) – On-chip voltage and temperature monitoring

XCZU9EG-L1FFVB1156I Target Applications

The XCZU9EG-L1FFVB1156I Zynq UltraScale+ MPSoC is engineered for demanding applications requiring heterogeneous computing:

Industrial Automation and Control

Motor control systems, programmable logic controllers (PLCs), industrial IoT gateways, and machine vision systems benefit from the combination of real-time processing and flexible I/O.

Telecommunications Infrastructure

5G wireless infrastructure, software-defined radio (SDR), network packet processing, and baseband processing applications leverage the high-bandwidth connectivity and parallel processing capabilities.

Automotive Systems

Advanced driver assistance systems (ADAS), infotainment platforms, and automotive networking require the XCZU9EG’s reliability across industrial temperature ranges.

Aerospace and Defense

Radar signal processing, electronic warfare systems, and secure communications utilize the device’s processing power and programmable logic flexibility.

Medical Imaging Equipment

Ultrasound systems, CT scanners, and medical diagnostic equipment benefit from real-time image processing and data acquisition capabilities.

Video and Broadcast

4K/8K video processing, broadcast encoders/decoders, and professional video production equipment utilize the GPU and high-speed interfaces.


XCZU9EG-L1FFVB1156I Development Tools and Software

AMD Vivado™ Design Suite

The primary development environment for XCZU9EG-L1FFVB1156I provides RTL synthesis, implementation, and debugging capabilities for programmable logic design.

Vitis™ Unified Software Platform

Enables software development for ARM processors, including Linux application development and bare-metal programming.

PetaLinux Tools

Customized Linux distribution optimized for Zynq UltraScale+ MPSoC development with built-in drivers and middleware.

Evaluation Hardware

The ZCU102 Evaluation Kit features the XCZU9EG device, providing a complete development platform with connectivity interfaces and expansion options.


XCZU9EG-L1FFVB1156I vs. Related Part Numbers

Part Number Speed Grade Temperature Voltage
XCZU9EG-L1FFVB1156I -1LI Industrial 0.72V/0.85V
XCZU9EG-1FFVB1156I -1I Industrial 0.85V
XCZU9EG-1FFVB1156E -1E Extended 0.85V
XCZU9EG-2FFVB1156I -2I Industrial 0.85V
XCZU9EG-2FFVB1156E -2E Extended 0.85V

Order XCZU9EG-L1FFVB1156I Xilinx FPGA Today

Looking for competitive pricing on the XCZU9EG-L1FFVB1156I AMD Xilinx Zynq UltraScale+ MPSoC? Browse our complete selection of Xilinx FPGA products for your next embedded system design.


Frequently Asked Questions About XCZU9EG-L1FFVB1156I

What is the XCZU9EG-L1FFVB1156I?

The XCZU9EG-L1FFVB1156I is a System-on-Chip (SoC) FPGA from AMD/Xilinx’s Zynq UltraScale+ MPSoC family, combining quad-core ARM Cortex-A53 processors with programmable logic in a 1156-pin FCBGA package.

What does the “L1” in XCZU9EG-L1FFVB1156I mean?

The “L1” designation indicates this is a low-power variant (-1LI speed grade) that can operate at reduced core voltage (0.72V) for lower power consumption while maintaining industrial temperature range operation.

What is the operating temperature range?

The XCZU9EG-L1FFVB1156I operates across the industrial temperature range from -40°C to +100°C junction temperature.

How many logic cells does the XCZU9EG have?

The XCZU9EG device contains approximately 599,550 system logic cells, along with 2,520 DSP slices and extensive block RAM and UltraRAM resources.

What software is needed to program the XCZU9EG-L1FFVB1156I?

AMD Vivado Design Suite is required for programmable logic development, while Vitis Unified Software Platform and PetaLinux Tools support ARM processor software development.

Is the XCZU9EG-L1FFVB1156I RoHS compliant?

Yes, the XCZU9EG-L1FFVB1156I is RoHS compliant and meets environmental regulations for restricted substances.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.