Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC3SD1800A-5CS484I: High-Performance Spartan-3A DSP FPGA for Advanced Digital Signal Processing Applications

Product Details

Overview of XC3SD1800A-5CS484I FPGA

The XC3SD1800A-5CS484I represents a cutting-edge field-programmable gate array (FPGA) from the renowned Spartan-3A DSP family, engineered specifically for high-volume, cost-sensitive digital signal processing applications. This powerful programmable logic device combines exceptional DSP performance with cost-effective pricing, making it an ideal solution for engineers and designers working on complex embedded systems.

Manufactured using advanced 90nm process technology, this Xilinx FPGA delivers 1.8 million system gates with 37,440 logic cells, offering substantial computational power for demanding applications in telecommunications, industrial automation, and consumer electronics.

Key Technical Specifications

Core Architecture Features

Specification Value
System Gates 1.8 Million
Logic Cells 37,440 (15,552 CLBs)
Operating Frequency 770MHz
Speed Grade -5 (Enhanced Performance)
Process Technology 90nm
Supply Voltage 1.2V Core
Package Type 484-Pin CSBGA (CS484)
I/O Pins 309 User I/O

DSP and Memory Resources

Resource Type Specifications
DSP48A Slices 84 Dedicated Units
Multiplier Performance 18×18 bits at 250MHz
Block RAM 1,188 Kb (189 kB total)
Block RAM Blocks 84 × 18Kb
Distributed RAM Enhanced per logic cell

Package and Environmental Specifications

Parameter Details
Package Marking XC3SD1800A-5CS484I
Package Style Chip Scale Ball Grid Array
Total Pins 484
MSL Level MSL 3 (Moisture Sensitivity)
Operating Temperature Industrial (-40°C to +100°C)
RoHS Compliance Lead-free options available

Advanced DSP Capabilities

XtremeDSP DSP48A Architecture

The XC3SD1800A-5CS484I incorporates 84 XtremeDSP DSP48A slices, representing a significant advancement over traditional multiplier architectures. These dedicated DSP blocks, derived from Virtex-4 technology, provide:

  • High-speed 18×18 bit multiplication operations
  • Built-in accumulator functionality
  • Cascadable architecture for complex filtering
  • 250MHz operation in standard speed grades
  • Optimal resource utilization for DSP algorithms

Memory Enhancement Features

Enhanced block RAM architecture with integrated output registers enables faster operation and improved timing closure. The device offers 1,188 Kb of total block RAM distributed across 84 blocks, providing ample buffering and data storage for signal processing applications.

Performance Optimization

Speed Grade -5 Advantages

The -5 speed grade designation indicates superior performance characteristics:

  • Maximum operating frequency of 770MHz
  • Reduced propagation delays
  • Enhanced setup and hold time margins
  • Improved timing closure for complex designs
  • Higher system clock rates

Power Efficiency

Engineered for power-conscious applications, the XC3SD1800A-5CS484I features:

  • 1.2V core voltage operation
  • Advanced power management capabilities
  • Static and dynamic power optimization
  • Efficient resource utilization
  • Low standby power consumption

Target Application Areas

Digital Signal Processing

The XC3SD1800A-5CS484I excels in DSP-intensive applications including:

  • Digital filter implementation (FIR, IIR)
  • FFT/IFFT processing engines
  • Audio and video codec development
  • Software-defined radio systems
  • Adaptive signal processing algorithms

Communications Infrastructure

Ideal for telecommunications equipment requiring:

  • Broadband access solutions
  • Base station signal processing
  • Protocol conversion engines
  • Network packet processing
  • Wireless communication systems

Industrial and Embedded Systems

Perfect for demanding industrial applications:

  • Motor control and drive systems
  • Industrial imaging and vision systems
  • Real-time control applications
  • Data acquisition systems
  • Measurement and test equipment

Consumer Electronics

Well-suited for high-volume consumer products:

  • Home networking equipment
  • Digital television receivers
  • Display and projection systems
  • Set-top box solutions
  • Audio processing equipment

Development and Design Support

Software Tools Compatibility

The XC3SD1800A-5CS484I is supported by comprehensive development tools:

  • Xilinx ISE Design Suite: Complete design environment for synthesis, implementation, and bitstream generation
  • Vivado Design Suite: Modern design flow with enhanced user experience
  • ChipScope Pro: Integrated logic analyzer for real-time debugging
  • IP Core Library: Extensive pre-verified IP for rapid development

Configuration Options

Multiple configuration methods supported:

  • JTAG boundary scan configuration
  • Master Serial configuration mode
  • Slave Serial configuration mode
  • Platform Flash PROM support
  • SPI Flash configuration support

Package Information: CS484 CSBGA

Physical Characteristics

The 484-pin Chip Scale Ball Grid Array package offers:

  • Compact footprint (23mm × 23mm typical)
  • Excellent thermal performance
  • Superior signal integrity
  • Industry-standard pitch (1.0mm)
  • Optimal for high-density PCB designs

Pin Assignment Features

  • 309 user-configurable I/O pins
  • Multiple I/O standards support (LVCMOS, LVTTL, LVDS)
  • Dedicated configuration pins
  • Power and ground pins optimized for low impedance
  • Bank organization for flexible voltage domains

Competitive Advantages

Cost-Effective DSP Performance

The Spartan-3A DSP family provides exceptional value:

  • Higher DSP capability per dollar than competing solutions
  • Lower total system cost compared to ASIC alternatives
  • Reduced development time and NRE costs
  • Field upgradeable functionality
  • Proven 90nm process technology reliability

ASIC Replacement Strategy

Superior alternative to mask-programmed ASICs offering:

  • Elimination of high upfront tooling costs
  • Shortened development cycles
  • Design flexibility and field updates
  • Risk reduction in product development
  • Volume production readiness

Quality and Reliability

Manufacturing Standards

  • ISO 9001 certified manufacturing processes
  • Comprehensive quality assurance testing
  • Automotive-grade reliability options available
  • Extended temperature range variants
  • Long-term availability commitment

Compliance and Certifications

  • RoHS compliant versions available
  • Lead-free compatible with modern assembly processes
  • REACH regulation compliance
  • Export control classification: ECCN 3A991.d
  • Industry-standard quality testing protocols

Ordering and Availability

Part Number Breakdown

XC3SD1800A-5CS484I decodes as:

  • XC3SD1800A: Device family and density (1.8M gates)
  • -5: Speed grade (enhanced performance)
  • CS484: Package type (484-pin CSBGA)
  • I: Industrial temperature range

Alternative Package Options

Related part numbers in the XC3SD1800A family:

  • XC3SD1800A-4CS484I (Standard speed grade)
  • XC3SD1800A-5FGG676C (676-pin FBGA package)
  • XC3SD1800A-4CSG484C (Commercial temperature)
  • XC3SD1800A-5CS484C (Commercial temperature variant)

Design Considerations

Thermal Management

Proper thermal design ensures optimal performance:

  • Calculate power dissipation based on utilization
  • Implement adequate cooling solutions
  • Monitor junction temperature during operation
  • Consider airflow requirements
  • Utilize thermal vias in PCB design

PCB Design Guidelines

Best practices for XC3SD1800A-5CS484I implementation:

  • Follow manufacturer’s footprint recommendations
  • Implement proper power supply decoupling
  • Maintain signal integrity for high-speed interfaces
  • Plan for configuration and programming access
  • Consider impedance-controlled routing for critical signals

Support Resources

Documentation Access

Comprehensive technical documentation available:

  • Complete datasheet with electrical characteristics
  • User guides for configuration and operation
  • Application notes for specific use cases
  • Reference designs for common applications
  • Errata documents for known issues

Technical Support Channels

  • Xilinx community forums for peer assistance
  • Direct technical support from authorized distributors
  • Application engineering consultation services
  • Online training resources and webinars
  • Extensive knowledge base articles

Conclusion

The XC3SD1800A-5CS484I delivers outstanding DSP performance, flexibility, and value for engineers developing next-generation embedded systems. With its robust 1.8 million gate capacity, 84 dedicated DSP48A slices, and industrial-grade reliability, this FPGA provides an optimal solution for applications ranging from telecommunications infrastructure to consumer electronics.

Its -5 speed grade ensures maximum performance at 770MHz, while the compact 484-pin CSBGA package enables high-density designs. Backed by comprehensive development tools and extensive support resources, the XC3SD1800A-5CS484I represents the ideal choice for cost-sensitive, high-performance digital signal processing applications.

Whether you’re designing advanced communication systems, implementing complex digital filters, or developing innovative consumer products, the XC3SD1800A-5CS484I offers the perfect balance of performance, features, and affordability to bring your vision to reality.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.