Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC3SD1800A-5CSG484C: High-Performance Spartan-3A DSP FPGA for Advanced Digital Signal Processing

Product Details

Overview of XC3SD1800A-5CSG484C FPGA

The XC3SD1800A-5CSG484C is a high-performance field-programmable gate array (FPGA) from AMD Xilinx’s Spartan-3A DSP family, specifically engineered for demanding digital signal processing applications. This advanced Xilinx FPGA combines exceptional processing power, cost-effectiveness, and versatile functionality, making it an ideal solution for industrial automation, telecommunications, medical instrumentation, and defense applications.

Built on proven 90nm CMOS process technology, the XC3SD1800A-5CSG484C delivers 1.8 million system gates with 37,440 logic cells, providing designers with substantial computational resources for complex signal processing tasks while maintaining competitive pricing for high-volume production.


Key Technical Specifications

Core Architecture Features

Specification Details
Part Number XC3SD1800A-5CSG484C
Product Family Spartan-3A DSP FPGA
System Gates 1.8 Million gates
Logic Cells 37,440 cells
Speed Grade -5 (High Performance)
Maximum Operating Frequency Up to 500-770MHz (application dependent)
Process Technology 90nm CMOS
Package Type 484-pin CSBGA (Chip Scale Ball Grid Array)
Operating Temperature Range 0°C to 85°C (Commercial Grade)
Supply Voltage 1.2V Core, 3.3V I/O

Memory and DSP Resources

Resource Type Capacity
Block RAM 189kB (1,548,288 bits)
Distributed RAM Integrated within logic fabric
DSP48A Slices Enhanced XtremeDSP blocks
Embedded Multipliers 18×18-bit dedicated multipliers
Configuration Memory Serial Flash/Platform Flash compatible

I/O and Connectivity

Feature Specification
Total User I/O Pins 309 I/O pins
I/O Standards Support LVDS, LVCMOS, SSTL, HSTL, and more
Differential Pairs High-speed differential signaling support
Digital Clock Managers (DCMs) 4 integrated DCMs
Clock Distribution Advanced low-skew clock networks

Advanced Features and Benefits

XtremeDSP DSP48A Slices

The XC3SD1800A-5CSG484C incorporates enhanced DSP48A slices derived from Virtex-4 architecture, delivering superior performance for digital signal processing operations. These dedicated blocks replace traditional 18×18 multipliers and provide an average of 70 percent logic efficiency improvement over standard gates-plus-multipliers implementations, enabling ASIC-equivalent performance without requiring additional co-processor chips.

Low Power Consumption

Optimized for power-sensitive applications, this FPGA features a typical power consumption of only 1.5W during normal operation, making it suitable for battery-powered devices, portable instrumentation, and energy-efficient embedded systems. The device includes advanced power management features and low-power differential I/O capabilities.

Flexible Configuration Options

The XC3SD1800A-5CSG484C supports multiple configuration modes, including:

  • Serial Peripheral Interface (SPI) Flash memory
  • Platform Flash configuration
  • JTAG boundary-scan programming
  • Master Serial and Slave Serial modes

This flexibility allows designers to choose the most cost-effective configuration solution for their specific application requirements.

High-Speed Clock Management

With four integrated Digital Clock Managers, the device provides sophisticated clock distribution and management capabilities including clock multiplication, division, phase shifting, and jitter reduction. This ensures reliable timing across complex designs operating at multiple clock frequencies.


Target Applications and Use Cases

Industrial Automation and Control

The XC3SD1800A-5CSG484C excels in industrial environments requiring real-time signal processing, motion control, and sensor data acquisition. Its robust architecture handles demanding control algorithms while maintaining deterministic timing performance.

Telecommunications Infrastructure

Ideal for telecommunications equipment including base stations, network routers, and protocol converters, this FPGA provides sufficient processing capacity for complex modulation schemes, error correction coding, and high-speed data packet processing.

Medical Imaging and Diagnostics

Medical device manufacturers leverage the XC3SD1800A-5CSG484C for ultrasound imaging, ECG signal processing, and diagnostic equipment requiring high-precision analog-to-digital conversion and real-time image processing capabilities.

Defense and Aerospace Systems

The device meets requirements for radar signal processing, software-defined radio (SDR), cryptographic applications, and secure communications systems where reconfigurability and high computational throughput are essential.

Test and Measurement Equipment

Laboratory instrumentation and automated test equipment benefit from the FPGA’s ability to implement custom measurement algorithms, multi-channel data acquisition, and real-time analysis functions.


Package and Physical Characteristics

CSBGA Package Details

Attribute Specification
Package Type 484-ball CSBGA
Ball Pitch 0.8mm
Package Dimensions Compact chip-scale format
Mounting Type Surface Mount Technology (SMT)
RoHS Compliance RoHS3 Compliant, Lead-Free
Moisture Sensitivity Level MSL 3
Operating Temperature 0°C to +85°C

The compact CSBGA package enables high-density PCB layouts while maintaining excellent thermal performance and signal integrity for high-speed applications.


Design Tools and Development Support

Vivado Design Suite Compatibility

While newer devices use Vivado, the XC3SD1800A-5CSG484C is supported by Xilinx ISE Design Suite, providing comprehensive tools for:

  • HDL synthesis (VHDL, Verilog)
  • Implementation and place-and-route
  • Timing analysis and optimization
  • Power analysis and estimation
  • Hardware debugging with ChipScope Pro

IP Core Library Access

Designers gain access to an extensive intellectual property library including:

  • DSP functions (FFT, FIR filters, DDS)
  • Communication protocols (PCIe, Ethernet, USB)
  • Memory controllers
  • Video processing cores
  • Arithmetic operators

This pre-verified IP accelerates development time and reduces design risk while maximizing logic utilization efficiency.


Performance Characteristics

Speed Grade -5 Performance

The -5 speed grade designation indicates high-performance specifications optimized for applications requiring maximum operating frequencies. Key performance metrics include:

  • System Clock Frequencies: Up to 500-770MHz depending on design complexity
  • DSP Throughput: Multiple GMAC/s (Giga Multiply-Accumulate operations per second)
  • I/O Toggle Rates: Hundreds of MHz for single-ended signals, GHz for differential pairs
  • Propagation Delays: Minimized through advanced routing architecture

Thermal Management

The device features efficient thermal characteristics with proper heat-sinking:

  • Typical power dissipation: 1.5W
  • Recommended heat-sink: Based on application requirements
  • Junction temperature monitoring: Available through internal sensors

Ordering Information and Availability

Part Number Breakdown

XC3SD1800A-5CSG484C

  • XC3SD1800A: Base device (Spartan-3A DSP, 1800K gates)
  • -5: Speed grade (High performance)
  • CSG484: Package type (484-ball CSBGA)
  • C: Commercial temperature grade (0°C to +85°C)

Supply Chain Information

Aspect Details
Manufacturer AMD Xilinx (formerly Xilinx Inc.)
Product Status Active production
Lead Time 8-12 weeks (subject to availability)
Minimum Order Quantity 1 unit (distributor dependent)
Volume Pricing Available for quantities 100+
Package Options Tray packaging for automated assembly

Quality and Reliability Standards

Compliance and Certifications

The XC3SD1800A-5CSG484C meets stringent quality standards:

  • RoHS Compliance: RoHS3 compliant, lead-free manufacturing
  • Quality Standards: ISO 9001 certified manufacturing
  • Reliability Testing: Comprehensive qualification including temperature cycling, humidity exposure, and electrical stress testing
  • Electrostatic Discharge (ESD): Human Body Model (HBM) protection
  • Export Control: Subject to export regulations

Long-Term Availability

As part of the mature Spartan-3A DSP family, AMD Xilinx provides long-term product availability commitments, making this device suitable for projects requiring extended production lifecycles and consistent supply chain support.


Competitive Advantages

Why Choose XC3SD1800A-5CSG484C

Cost-Effective Performance: Delivers exceptional DSP performance at competitive pricing points suitable for high-volume production, significantly reducing total system costs compared to discrete DSP processor solutions.

Proven Architecture: Based on mature 90nm technology with millions of deployed units worldwide, ensuring reliable operation and comprehensive application support from the engineering community.

Flexibility and Reconfigurability: Unlike fixed-function ASICs, this FPGA allows design updates and feature enhancements throughout the product lifecycle without hardware redesign.

Comprehensive Ecosystem: Extensive documentation, reference designs, evaluation boards, and third-party IP cores accelerate time-to-market and reduce development risks.

Future-Proof Design: In-field reconfigurability enables product updates, bug fixes, and feature additions after deployment, extending product lifetime and maximizing ROI.


Frequently Asked Questions

What is the difference between speed grades -4 and -5?

Speed grade -5 offers higher maximum operating frequencies compared to -4, enabling more demanding applications that require faster clock rates and lower propagation delays. The -5 grade is recommended when maximum performance is critical.

Can this FPGA replace a traditional DSP processor?

Yes, the XC3SD1800A-5CSG484C can replace discrete DSP processors in many applications due to its dedicated DSP48A slices, high-speed processing capabilities, and flexible architecture. It often provides superior performance with lower total system cost.

What programming languages are supported?

The device supports VHDL and Verilog HDL for design entry, as well as high-level synthesis tools that accept C/C++ code. Xilinx ISE Design Suite provides comprehensive development environment support.

Is this device suitable for automotive applications?

The XC3SD1800A-5CSG484C is a commercial-grade device (0°C to +85°C). For automotive applications requiring extended temperature ranges (-40°C to +125°C), consider the XA Spartan-3A DSP automotive-grade variants.

What configuration memory options are available?

The device supports various configuration memory options including SPI Flash (Serial Peripheral Interface), Platform Flash, and PROM-based solutions. Configuration file sizes vary based on design complexity, with typical requirements around 5-10 megabits.


Technical Support Resources

Documentation and Resources

  • Datasheet: Complete electrical specifications and timing parameters
  • User Guides: Comprehensive design guidelines and best practices
  • Application Notes: Specific implementation examples and solutions
  • Reference Designs: Pre-built designs for common applications
  • Online Forums: Active community support and knowledge sharing

Contact Information

For technical inquiries, pricing, and availability:

  • Visit authorized AMD Xilinx distributors
  • Consult local sales representatives
  • Access online documentation at AMD documentation portal
  • Engage with community forums for design support

Conclusion

The XC3SD1800A-5CSG484C represents an excellent choice for engineers developing high-performance digital signal processing systems requiring flexibility, reliability, and cost-effectiveness. Its combination of 1.8 million system gates, advanced DSP capabilities, comprehensive I/O support, and proven 90nm technology makes it ideal for demanding applications across industrial, telecommunications, medical, defense, and test equipment markets.

By leveraging the XC3SD1800A-5CSG484C’s powerful architecture and extensive development ecosystem, designers can accelerate time-to-market while maintaining design flexibility for future enhancements. Whether replacing traditional DSP processors, implementing custom signal processing algorithms, or building next-generation embedded systems, this Xilinx FPGA delivers the performance and versatility needed for successful product development.

For the latest technical specifications, pricing information, and design resources, consult authorized distributors and the official AMD Xilinx documentation portal.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.