Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XCZU9EG-L2FFVB1156E: AMD Xilinx Zynq UltraScale+ MPSoC FPGA

Product Details

The XCZU9EG-L2FFVB1156E is a high-performance System-on-Chip (SoC) from AMD’s Zynq UltraScale+ MPSoC family. This advanced FPGA combines powerful ARM processing capabilities with flexible programmable logic, making it ideal for 5G wireless infrastructure, advanced driver assistance systems (ADAS), industrial IoT, artificial intelligence, and embedded vision applications.


XCZU9EG-L2FFVB1156E Key Features and Benefits

The XCZU9EG-L2FFVB1156E delivers exceptional heterogeneous processing power by integrating multiple processor cores with high-density programmable logic. This low-power variant operates at 0.85V VCCINT, providing optimized power consumption for thermally constrained designs while maintaining excellent performance characteristics.

Processing System Architecture

The processing system of the XCZU9EG-L2FFVB1156E includes a sophisticated multi-core architecture designed for diverse workloads:

  • Application Processing Unit (APU): Quad-core ARM Cortex-A53 MPCore with CoreSight technology, operating at up to 1.3GHz
  • Real-Time Processing Unit (RPU): Dual-core ARM Cortex-R5F with CoreSight technology, running at up to 533MHz
  • Graphics Processing Unit (GPU): ARM Mali-400 MP2 for efficient graphics rendering at up to 600MHz

XCZU9EG-L2FFVB1156E Technical Specifications

Parameter Specification
Manufacturer AMD (Xilinx)
Part Number XCZU9EG-L2FFVB1156E
Family Zynq UltraScale+ MPSoC EG
Package 1156-FCBGA (35mm x 35mm)
Process Technology 16nm FinFET+
Core Voltage (VCCINT) 0.85V
Speed Grade -L2 (Low Power)
Temperature Range Extended (E): 0°C to +100°C

Programmable Logic Resources

Resource Quantity
System Logic Cells 599,550
CLB Flip-Flops 548,160
Look-Up Tables (LUTs) 274,080
DSP Slices 2,520
Block RAM 32.1 Mb
Max Distributed RAM 8.8 Mb

Connectivity and Interface Options

The XCZU9EG-L2FFVB1156E provides comprehensive connectivity options for modern system designs:

High-Speed Interfaces

  • PCIe Gen2 x4 support
  • USB 3.0 dual controllers
  • SATA 3.1 interface
  • DisplayPort 1.2a support
  • Quad Gigabit Ethernet MAC

General Purpose Interfaces

  • USB 2.0 dual ports
  • SD/SDIO controllers
  • UART, SPI, I2C interfaces
  • CAN 2.0B bus support
  • GPIO with 32-bit width

XCZU9EG-L2FFVB1156E Applications

This versatile Xilinx FPGA is engineered for demanding applications across multiple industries:

Industrial and Automation

  • Industrial Internet of Things (IIoT) gateways
  • Motor control and drives
  • Machine vision systems
  • Programmable logic controllers

Communications and Networking

  • 5G wireless infrastructure
  • Software-defined networking
  • Packet processing engines
  • Network security appliances

Automotive and Transportation

  • Advanced Driver Assistance Systems (ADAS)
  • In-vehicle infotainment
  • Sensor fusion platforms
  • Vehicle-to-everything (V2X) communication

Artificial Intelligence and Machine Learning

  • Edge AI inference
  • Convolutional neural network acceleration
  • Real-time video analytics
  • Deep learning preprocessing

Memory and Storage Support

The XCZU9EG-L2FFVB1156E features advanced memory controller capabilities:

Memory Type Supported Standards
DDR Memory DDR4, DDR3, DDR3L
Low-Power DDR LPDDR4, LPDDR3
ECC Support Yes (64-bit with ECC)
Max Data Rate Up to 2400 MT/s

Flash Memory Support

  • Quad SPI NOR Flash
  • NAND Flash (ONFI 3.1)
  • eMMC 5.1
  • SD/SDIO 3.0

Development Tools and Software Support

AMD provides comprehensive development resources for the XCZU9EG-L2FFVB1156E:

Design Software

  • Vivado Design Suite: Complete FPGA development environment
  • Vitis Unified Software Platform: Embedded software and acceleration development
  • PetaLinux Tools: Linux-based embedded OS development

Documentation and Resources

  • Zynq UltraScale+ MPSoC Data Sheet: Overview (DS891)
  • DC and AC Switching Characteristics (DS925)
  • Technical Reference Manual (UG1085)
  • PCB Design Guide (UG583)

XCZU9EG-L2FFVB1156E Ordering Information

Order Code Description
XCZU9EG-L2FFVB1156E Low Power, -2 Speed Grade, Extended Temp, 1156 FCBGA

Related Part Numbers

  • XCZU9EG-2FFVB1156E (Standard Power)
  • XCZU9EG-2FFVB1156I (Industrial Temperature)
  • XCZU9EG-1FFVB1156E (-1 Speed Grade)

Why Choose the XCZU9EG-L2FFVB1156E?

The XCZU9EG-L2FFVB1156E stands out as a premier choice for engineers designing next-generation embedded systems. Its combination of quad-core ARM Cortex-A53 application processors, dual-core ARM Cortex-R5F real-time processors, Mali-400 MP2 GPU, and 600K logic cells provides unmatched flexibility for compute-intensive applications.

The low-power L2 variant is specifically optimized for applications requiring reduced thermal dissipation without sacrificing performance. With support for DDR4 memory, PCIe Gen2, USB 3.0, and extensive programmable logic resources, this SoC enables designers to consolidate multiple functions into a single device, reducing system complexity and overall BOM costs.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.