Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

0.5mm PCB: Complete Guide to Thin Circuit Board Design & Manufacturing

When engineers ask me about thin PCB options, the conversation often comes down to finding the right balance. Go too thin and you’re fighting warpage, limited surface finishes, and assembly headaches. Go too thick and you waste precious space in compact products. That’s why 0.5mm PCB has become my go-to recommendation for many projects—it delivers the thinness modern devices demand while avoiding the manufacturing complications of ultra-thin boards.

This guide covers everything you need to know about 0.5mm PCB design, from stack-up configurations to surface finish options. Whether you’re developing wearables, IoT sensors, or portable consumer electronics, understanding this versatile thickness will help you make smarter design decisions.

What is a 0.5mm PCB?

A 0.5mm PCB is a printed circuit board with a total finished thickness of 0.5 millimeters (approximately 0.020 inches or 20 mils). This measurement encompasses all layers—substrate material, copper, plating, solder mask, and surface finish—combined into the final board.

The 20-mil imperial equivalent makes 0.5mm a convenient specification that’s easy to communicate across international teams. Unlike 0.4mm (16 mils) or 0.6mm (24 mils), the round number simplifies documentation and reduces specification errors.

SpecificationValue
Finished Thickness0.5mm (±0.1mm tolerance)
Raw Material Thickness0.4mm typical
Imperial Equivalent0.020″ / 20 mils
Maximum Practical Layers4-6 layers
Minimum Via Diameter0.15mm mechanical

When you order a 0.5mm finished thickness board, manufacturers typically start with 0.4mm raw material. The additional 0.1mm comes from copper plating, surface finish, and solder mask layers applied during fabrication.

Why 0.5mm PCB is the Practical Thin Board Choice

The 0.5mm thickness occupies a strategic position in the PCB thickness spectrum. It’s thin enough to fit space-constrained designs while thick enough to avoid the PCB manufacturing challenges that plague thinner boards.

Better handling than ultra-thin options. Boards at 0.4mm and below require special carriers and careful handling throughout manufacturing and assembly. At 0.5mm, standard production equipment handles the boards without significant modification.

All surface finishes available. Unlike 0.4mm boards (which can’t use some finishes) or 0.3mm boards (which are limited to ENIG and OSP), 0.5mm thickness supports virtually every surface finish except lead-free HASL, which requires 0.6mm minimum.

Comfortable multilayer capability. You can reliably build 4-layer and even 6-layer boards at 0.5mm without pushing manufacturing limits. The extra 0.1mm over 0.4mm provides meaningful flexibility in stack-up design.

0.5mm PCB Materials and Substrate Options

Material selection significantly impacts the performance and reliability of thin PCBs. At 0.5mm, you have access to most standard materials, though some consideration of thermal and mechanical properties is necessary.

FR-4 for 0.5mm PCB Production

Standard FR-4 remains the workhorse material for 0.5mm PCB fabrication. Thin FR-4 cores in 0.2mm, 0.3mm, and 0.1mm thicknesses combine with prepreg layers to achieve target thickness while maintaining good electrical and mechanical properties.

FR-4 PropertyStandardMid-TgHigh-Tg
Glass Transition (Tg)130-140°C150-160°C170-180°C
Dielectric Constant (Dk)4.2-4.54.2-4.54.2-4.5
Dissipation Factor (Df)0.020-0.0250.018-0.0220.016-0.020
CTE (Z-axis)50-70 ppm/°C45-55 ppm/°C40-50 ppm/°C
Decomposition Temp (Td)300°C320°C340°C

For lead-free assembly processes, specify at least mid-Tg FR-4 (Tg 150°C+). The higher reflow temperatures of SAC305 and similar alloys can stress standard FR-4, particularly in thin constructions where heat penetrates quickly through the board.

Alternative Materials for Thin PCB Applications

When standard FR-4 won’t meet your requirements, several alternatives work well at 0.5mm thickness:

High-Speed Laminates: Materials like Isola FR408HR or Panasonic Megtron offer lower Dk (3.6-3.8) and reduced loss tangent for high-frequency applications. These are common in 5G devices and high-speed digital designs where signal integrity is critical.

BT Resin (Bismaleimide Triazine): With Dk around 3.4-3.6 and excellent dimensional stability, BT resin is popular for smartphone and tablet applications. Many IC substrate manufacturers standardize on BT for chip-scale packages.

Polyimide: For applications requiring extreme temperature cycling or semi-flex capability, polyimide substrates offer Tg above 250°C and excellent fatigue resistance. Common in automotive and aerospace applications.

MaterialDkDfTg (°C)Best Application
Standard FR-44.2-4.50.020130-140General purpose, cost-sensitive
High-Tg FR-44.2-4.50.018170-180Lead-free assembly
Isola FR408HR3.650.009180High-speed digital
BT Resin3.4-3.60.010185+Mobile devices, IC substrates
Polyimide3.2-3.50.008250+Automotive, aerospace, flex-rigid
Rogers 4350B3.480.004280+RF, microwave, antenna

0.5mm PCB Stack-Up Configurations

Stack-up design determines what you can achieve with your 0.5mm board. The extra thickness compared to 0.4mm provides more flexibility in layer arrangement and dielectric spacing.

2-Layer 0.5mm PCB Stack-Up

For simpler designs, a 2-layer 0.5mm board offers excellent value. The single core provides good mechanical stability while keeping costs low.

LayerFunctionMaterialThickness
TopSignal/ComponentCopper (1oz)35μm
Solder MaskLPI20μm
CoreFR-40.4mm
Solder MaskLPI20μm
BottomSignal/ComponentCopper (1oz)35μm

This configuration works well for:

  • LED lighting modules
  • Simple sensor boards
  • Power distribution boards
  • Low-frequency analog circuits

4-Layer 0.5mm PCB Stack-Up

The 4-layer configuration is where 0.5mm thickness really shines. You get dedicated ground and power planes with room for comfortable dielectric spacing.

LayerFunctionMaterialThickness
L1Signal/ComponentCopper (1oz)35μm
Prepreg21160.1mm
L2Ground PlaneCopper (1oz)35μm
CoreFR-40.2mm
L3Power PlaneCopper (1oz)35μm
Prepreg21160.1mm
L4Signal/ComponentCopper (1oz)35μm

This stack-up provides:

  • Dedicated reference planes for signal integrity
  • Symmetric construction to prevent warpage
  • Adequate dielectric spacing for impedance control
  • Good EMI shielding with internal planes

6-Layer 0.5mm PCB Stack-Up

Yes, you can fit 6 layers into 0.5mm, though it requires thinner materials and careful design. This configuration suits high-density designs that need additional routing layers.

LayerFunctionMaterialThickness
L1SignalCopper (0.5oz)18μm
Prepreg10800.065mm
L2GroundCopper (0.5oz)18μm
CoreFR-40.1mm
L3SignalCopper (0.5oz)18μm
CoreFR-40.1mm
L4SignalCopper (0.5oz)18μm
CoreFR-40.1mm
L5PowerCopper (0.5oz)18μm
Prepreg10800.065mm
L6SignalCopper (0.5oz)18μm

Note the reduced copper weight (0.5oz) to accommodate more layers. This limits current capacity, so verify power distribution requirements carefully.

Read more Different PCB Thickness:

Manufacturing Process for 0.5mm PCB

Manufacturing 0.5mm boards requires attention to process parameters, though the challenges are less severe than with ultra-thin boards. Understanding these factors helps you design boards that fabricators can build reliably.

Drilling and Via Formation

Via design in 0.5mm PCBs follows standard practices with some consideration for aspect ratio. The board thickness allows reasonable hole sizes without pushing manufacturing limits.

Drill TypeMinimum DiameterAspect RatioApplication
Mechanical0.15mm3.3:1Standard through-holes
Mechanical0.2mm2.5:1General vias (recommended)
CO2 Laser0.1mmBlind onlyBlind vias to copper
UV Laser0.075mmBlind onlyMicrovias for HDI

For through-hole vias in 0.5mm boards:

  • 0.2mm holes give a 2.5:1 aspect ratio (easy for most fabricators)
  • 0.15mm holes give a 3.3:1 aspect ratio (within standard capability)
  • 0.1mm holes give a 5:1 aspect ratio (requires advanced process)

My recommendation: use 0.2mm minimum hole size for standard production. Reserve smaller holes for HDI designs where you’re already paying for advanced processes.

Lamination Considerations

Thin board lamination requires controlled pressure and temperature profiles to prevent resin starvation and ensure proper layer bonding.

ParameterStandard (1.6mm)Thin (0.5mm)
Lamination Pressure250-350 psi200-300 psi
Cure Temperature175-185°C175-185°C
Pressure RampStandardSlower ramp
Thickness Tolerance±0.1mm±0.08mm
Warpage Spec<0.75%<1.0%

The lower pressure for thin boards prevents excessive resin squeeze-out while still achieving proper bonding. Some fabricators use vacuum lamination for better void elimination in thin constructions.

Registration and Tolerances

Layer alignment in 0.5mm boards follows similar tolerances to standard boards, though thermal expansion during processing can affect registration more noticeably in thin material.

ParameterTypical Tolerance
Layer-to-layer registration±0.075mm
Drill-to-copper registration±0.05mm
Solder mask registration±0.05mm
Outline tolerance±0.1mm
Minimum annular ring0.075mm

Design with 0.1mm annular ring minimum to provide manufacturing margin. This means pad diameters should be at least 0.2mm larger than drill size.

Design Guidelines for 0.5mm PCB

Good design practices ensure your 0.5mm PCB can be manufactured reliably and assembled without issues. These guidelines reflect real production experience.

Trace Width and Spacing Rules

At 0.5mm thickness, standard trace rules apply. You’re not forced into fine-line territory unless your density requires it.

FeatureMinimum (Standard)Minimum (Advanced)Recommended
Trace width0.1mm (4 mil)0.075mm (3 mil)0.125mm (5 mil)
Trace spacing0.1mm (4 mil)0.075mm (3 mil)0.125mm (5 mil)
Pad-to-trace0.1mm0.075mm0.1mm
Copper-to-edge0.25mm0.2mm0.3mm

Via Design Parameters

Via sizing for 0.5mm boards balances density needs against manufacturing reliability.

Via TypeDrill SizePad SizeAnnular RingUse Case
Standard PTH0.25mm0.5mm0.125mmGeneral routing
Small PTH0.2mm0.4mm0.1mmDense areas
Fine PTH0.15mm0.35mm0.1mmBGA fanout
Microvia0.1mm0.25mm0.075mmHDI designs

Impedance Control in 0.5mm Stack-Ups

Controlled impedance is achievable in 0.5mm boards, though trace widths will be narrower than in thicker constructions for the same target impedance.

Target ImpedanceDielectric HeightTrace Width (1oz Cu)
50Ω single-ended0.1mm0.18mm
50Ω single-ended0.08mm0.14mm
100Ω differential0.1mm0.12mm/0.12mm, 0.15mm gap
90Ω differential0.1mm0.14mm/0.14mm, 0.18mm gap

Always verify impedance calculations with your fabricator’s actual material Dk values. Published values vary between manufacturers and even between production lots.

Surface Finish Options for 0.5mm PCB

One of the advantages of 0.5mm over thinner boards is broader surface finish compatibility. Most finishes work well at this thickness.

Surface FinishMin ThicknessFlatnessShelf Life0.5mm Compatible
ENIG0.2mmExcellent12+ monthsYes
Immersion Silver0.4mmExcellent6-12 monthsYes
Immersion Tin0.4mmExcellent6 monthsYes
OSP0.2mmExcellent3-6 monthsYes
Lead-Free HASL0.6mmPoor12+ monthsNo
ENEPIG0.3mmExcellent12+ monthsYes

ENIG (Electroless Nickel Immersion Gold): The most popular choice for 0.5mm PCBs. Provides flat surface for fine-pitch components, excellent shelf life, and good solderability. Watch for black pad issues with cheap suppliers.

Immersion Silver: Good alternative to ENIG at lower cost. Excellent for high-frequency applications due to silver’s conductivity. Requires careful handling and storage to prevent tarnishing.

Immersion Tin: Works well for press-fit applications and automotive electronics. The 0.5mm thickness meets the 0.4mm minimum requirement. Watch for tin whisker formation in long-term storage.

OSP (Organic Solderability Preservative): Lowest cost option with excellent flatness. Best for high-volume production where boards are assembled quickly after fabrication. Not suitable for multiple reflow cycles.

Applications for 0.5mm PCB

The 0.5mm thickness enables compact designs across numerous market segments. Here’s where this thickness excels:

Wearable Devices and Medical Electronics

Fitness Trackers and Smartwatches: The slim profile fits modern wearable enclosures while providing enough rigidity for component mounting. A typical 4-layer 0.5mm board accommodates Bluetooth, sensors, and power management in a compact footprint.

Medical Monitoring Patches: Continuous glucose monitors, ECG patches, and other body-worn sensors benefit from 0.5mm boards that conform to curved surfaces without excessive flexibility. The thickness provides a good balance between compliance and structural stability.

Hearing Aids: Modern hearing devices require extremely compact PCBs. The 0.5mm thickness allows complex circuitry in minimal space while maintaining handleability during assembly.

IoT and Sensor Applications

Environmental Sensors: IoT sensor nodes deployed in tight spaces benefit from thin PCBs. A 0.5mm 4-layer board easily accommodates microcontroller, wireless module, sensors, and power management.

Smart Home Devices: Light switches, thermostats, and other in-wall devices need thin PCBs to fit standard electrical boxes. The 0.5mm thickness provides routing density for WiFi/Zigbee/Z-Wave connectivity.

Industrial IoT: Edge computing devices in industrial settings need compact PCBs that still handle temperature extremes. High-Tg FR-4 at 0.5mm meets these requirements.

Consumer Electronics

True Wireless Earbuds: The tiny PCBs in earbud cases use 0.5mm or thinner boards to maximize battery space. Complex audio processing and Bluetooth fit in remarkably small areas.

Portable Gaming Devices: Handheld gaming systems need thin main boards to accommodate larger batteries and displays. A 6-layer 0.5mm board can handle modern ARM processors and memory.

Camera Modules: Smartphone camera modules often use 0.5mm flex-rigid PCBs to connect image sensors to main boards while fitting behind thin lens assemblies.

Comparison: 0.5mm PCB vs Other Thicknesses

Parameter0.3mm0.4mm0.5mm0.6mm0.8mm
Max Practical Layers44-64-66-88-10
Surface FinishesLimitedMostAll except HASLAllAll
Via OptionsLimitedStandardStandardAllAll
Relative Cost+40-60%+20-30%+10-15%+5-10%Baseline
Warpage RiskHighModerateLow-ModerateLowVery Low
HandlingDifficultModerateEasyEasyEasy
Best ForUltra-compactMultilayer thinBalanced thinStandard thinGeneral

Challenges and Solutions for 0.5mm PCB Production

Managing Warpage

While 0.5mm boards warp less than thinner options, attention to warpage prevention remains important:

Design-level mitigation:

  • Maintain symmetric copper distribution across all layers
  • Balance copper pours on opposing layers
  • Avoid large unbroken copper areas on single layers
  • Use cross-hatched fills instead of solid pours where possible

Manufacturing considerations:

  • Specify proper panel support during storage and handling
  • Request fabricator’s thin-board process for panels
  • Consider stiffeners for very large boards (>100mm in any dimension)

Assembly Process Adjustments

Assembling 0.5mm boards requires some process modifications:

Reflow profile optimization:

  • Reduce ramp rates to 1.5-2°C/second (versus 2.5-3°C/second for standard boards)
  • Use longer soak zones to equalize temperature
  • Consider reduced peak temperature if component mass is low

Board support during reflow:

  • Use edge rails in reflow oven
  • Consider bottom-side support for boards >80mm width
  • Avoid wave soldering if possible; use selective soldering for through-hole

Stencil considerations:

  • Standard stencil thickness (0.12mm) works for most components
  • Reduce to 0.1mm for 0.4mm-pitch fine-pitch devices
  • Aperture modifications may help prevent bridging on fine-pitch

How to Order 0.5mm PCB: Specification Checklist

When requesting quotes or placing orders for 0.5mm PCB production, include these specifications to ensure accurate pricing and avoid manufacturing issues:

ParameterCommon Options
Finished thickness0.5mm ±0.08mm
Layer count2 / 4 / 6
MaterialFR-4 Standard / High-Tg / BT Resin
Copper weight (outer)1oz / 0.5oz
Copper weight (inner)1oz / 0.5oz
Minimum trace/space0.1mm/0.1mm / 0.075mm/0.075mm
Minimum drill size0.2mm / 0.15mm
Surface finishENIG / Imm Ag / Imm Sn / OSP
Solder maskGreen / Black / White / Other
Impedance controlYes (specify values) / No
PanelizationTab-routed / V-scored / Individual

Request the fabricator’s standard stack-up document for 0.5mm boards and verify layer thicknesses meet your impedance requirements before finalizing design.

Useful Resources for 0.5mm PCB Design

Industry Standards

  • IPC-2221B: Generic Standard on Printed Board Design
  • IPC-6012: Qualification and Performance Specification for Rigid PCBs
  • IPC-4101: Specification for Base Materials for Rigid PCBs
  • IPC-A-600: Acceptability of Printed Boards

Design Tools and Calculators

Material Datasheets

PCB Design Software

Frequently Asked Questions About 0.5mm PCB

What is the maximum layer count possible in a 0.5mm PCB?

The practical maximum is 6 layers for a 0.5mm PCB. While 8 layers are theoretically possible, the resulting dielectric spacing becomes too thin for reliable impedance control and manufacturing. Most 0.5mm designs use 4 layers, which provides dedicated power and ground planes while leaving comfortable dielectric spacing between layers. For designs requiring more than 6 layers, consider increasing thickness to 0.6mm or 0.8mm, which significantly expands layer count options.

Can I use HASL surface finish on a 0.5mm PCB?

No, standard HASL (Hot Air Solder Leveling) requires a minimum board thickness of 0.6mm. The thermal shock from molten solder contact causes unacceptable warpage in boards thinner than 0.6mm. For 0.5mm PCBs, use ENIG, Immersion Silver, Immersion Tin, or OSP instead. These finishes provide flat surfaces suitable for fine-pitch component assembly and operate at lower process temperatures that 0.5mm boards can tolerate without warping.

How does 0.5mm PCB compare to 0.4mm in terms of cost and manufacturability?

A 0.5mm PCB typically costs 5-10% less than equivalent 0.4mm boards and offers better manufacturability. The extra 0.1mm thickness reduces handling damage, improves lamination yield, and allows more surface finish options. While both thicknesses support similar layer counts (4-6 layers), 0.5mm provides more comfortable dielectric spacing for impedance control. Choose 0.4mm only when the additional 0.1mm thickness genuinely won’t fit your enclosure—for most applications, 0.5mm delivers better overall value.

What applications are best suited for 0.5mm PCB thickness?

The 0.5mm thickness excels in wearable devices (smartwatches, fitness trackers, hearing aids), IoT sensors, medical monitoring equipment, camera modules, and portable consumer electronics. It’s particularly well-suited for products that need thin profiles but don’t require the extreme thinness of 0.3mm or 0.4mm boards. The thickness provides enough rigidity for standard assembly processes while fitting compact enclosures. Automotive and industrial applications also use 0.5mm for daughterboards and sensor modules where space is constrained but reliability requirements are high.

How do I prevent warpage in 0.5mm PCB during assembly?

Preventing warpage requires attention throughout design and manufacturing. During design, ensure symmetric copper distribution across all layers and balance copper pours between top and bottom surfaces. During assembly, reduce reflow ramp rates to 1.5-2°C/second and use board support rails in the oven. Store boards flat in controlled humidity before assembly. For larger boards (>100mm), consider edge stiffeners or request your assembler’s thin-board handling procedure. Specifying proper panelization with adequate support rails also helps maintain flatness through the assembly process.

Conclusion

The 0.5mm PCB represents a practical sweet spot for thin circuit board applications. It delivers the compact profile that modern devices demand while avoiding many of the manufacturing complications associated with ultra-thin boards. With support for up to 6 layers, compatibility with most surface finishes, and reasonable handling characteristics, this thickness works well across a wide range of applications.

For wearables, IoT devices, medical electronics, and portable consumer products, 0.5mm provides an excellent balance of thinness, manufacturability, and cost. The 10-15% cost premium over standard 1.6mm boards is often justified by the space savings and design flexibility it enables.

When deciding between 0.5mm and thinner options like 0.4mm, consider whether the extra 0.1mm genuinely impacts your product design. In many cases, the improved manufacturability and broader finish options at 0.5mm outweigh the minimal thickness difference. Save the ultra-thin specifications for applications where every tenth of a millimeter truly matters.

Work with your fabricator early in the design process. Request their standard 0.5mm stack-ups, verify impedance calculations against their material parameters, and confirm their process capabilities. This collaboration ensures your boards meet requirements while remaining manufacturable at acceptable yields and costs.

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Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.