Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XCZU9EG-2FFVC900E: High-Performance Zynq UltraScale+ MPSoC FPGA

Product Details

The XCZU9EG-2FFVC900E is a premium System-on-Chip (SoC) integrated circuit from AMD (formerly Xilinx) that combines powerful ARM processors with programmable logic. This advanced Xilinx FPGA delivers exceptional performance for demanding applications including 5G wireless infrastructure, AI/machine learning, industrial automation, and embedded vision systems.


XCZU9EG-2FFVC900E Key Features and Benefits

The XCZU9EG-2FFVC900E belongs to the acclaimed Zynq UltraScale+ MPSoC EG family, offering a unique combination of heterogeneous processing capabilities. This device integrates quad-core ARM Cortex-A53 application processors, dual-core ARM Cortex-R5 real-time processors, and a Mali-400 MP2 GPU within a single chip architecture.

Why Choose the XCZU9EG-2FFVC900E for Your Design?

Engineers select the XCZU9EG-2FFVC900E for projects requiring both high-speed processing and hardware acceleration. The device offers remarkable flexibility through its programmable logic fabric while maintaining low power consumption through advanced 20nm FinFET+ technology.


XCZU9EG-2FFVC900E Technical Specifications

Parameter Specification
Part Number XCZU9EG-2FFVC900E
Manufacturer AMD (Xilinx)
Family Zynq UltraScale+ MPSoC EG
Technology 20nm FinFET+
Core Voltage 0.85V
Speed Grade -2 (Medium Performance)
Temperature Range Extended (E): 0°C to +100°C
Package Type 900-FCBGA (Flip-Chip BGA)
Package Dimensions 31mm x 31mm
Lead-Free Yes (RoHS Compliant)

XCZU9EG-2FFVC900E Processing System Specifications

ARM Processor Architecture

Processing Unit Details
Application Processor Quad ARM Cortex-A53 MPCore with CoreSight
APU Clock Speed Up to 1.3 GHz
Real-Time Processor Dual ARM Cortex-R5 with CoreSight
RPU Clock Speed Up to 533 MHz
Graphics Processor ARM Mali-400 MP2 GPU
GPU Clock Speed Up to 600 MHz

Memory Interface Capabilities

Memory Type Support
DDR4 Support Yes, up to 2400 Mbps
DDR3/DDR3L Yes
LPDDR4 Yes
LPDDR3 Yes
ECC Support Yes
Memory Width Up to 64-bit (PS), 32-bit (PL)

XCZU9EG-2FFVC900E Programmable Logic Resources

FPGA Fabric Specifications

Resource Quantity
System Logic Cells 599,550
CLB Flip-Flops 548,160
CLB LUTs 274,080
DSP Slices (DSP48E2) 2,520
Block RAM (36Kb) 912 Blocks
Total Block RAM 32.1 Mb
Maximum Distributed RAM 8.8 Mb
Clock Management Tiles 8
Global Clock Buffers 4

High-Speed Connectivity Options

XCZU9EG-2FFVC900E Interface Support

Interface Capability
PCIe Gen2 x4
USB 3.0 2 Ports
USB 2.0 2 Ports
SATA 3.1 Support
DisplayPort 1.2a Support
Gigabit Ethernet 4x Tri-mode
UART 2 Channels
CAN 2.0B x2
I2C 2 Channels
SPI 2 Channels
GPIO 4x 32-bit
SD/SDIO 2 Ports

I/O Bank Configuration

I/O Type Pins Available
HP (High-Performance) I/O 96 Pins
HD (High-Density) I/O 66 Pins
Total User I/O 162 Pins

XCZU9EG-2FFVC900E Application Areas

Industrial and Commercial Applications

The XCZU9EG-2FFVC900E MPSoC excels in numerous demanding applications:

  • 5G Wireless Infrastructure: Base station processing and beamforming
  • Advanced Driver Assistance Systems (ADAS): Sensor fusion and object detection
  • Artificial Intelligence & Machine Learning: Neural network acceleration
  • Industrial Internet of Things (IIoT): Edge computing and real-time control
  • Video Processing: 4K encoding/decoding and image processing
  • Medical Imaging: Ultrasound and diagnostic equipment
  • Aerospace & Defense: Radar processing and secure communications
  • Test & Measurement: High-speed data acquisition systems

XCZU9EG-2FFVC900E Development Tools

Supported Software Platforms

Tool Function
Vivado Design Suite FPGA synthesis, implementation, and debugging
Vitis Unified Platform Embedded software development and AI acceleration
PetaLinux Embedded Linux development
Yocto Project Custom Linux distribution building
FreeRTOS Real-time operating system support

XCZU9EG-2FFVC900E Part Number Decoder

Understanding the XCZU9EG-2FFVC900E part number helps identify device specifications:

Segment Meaning
XC Xilinx Commercial
ZU Zynq UltraScale+
9 Device Size (Mid-Range)
EG EG Variant (Quad A53 + Dual R5 + GPU)
-2 Speed Grade 2 (Medium Performance)
FF Flip-Chip Fine-Pitch
V Lead-Free Package
C Ceramic Package
900 900 Ball Count
E Extended Temperature Range

XCZU9EG-2FFVC900E Ordering Information

Available Speed Grade Variants

Part Number Speed Grade Temperature
XCZU9EG-1FFVC900E -1 (Standard) Extended
XCZU9EG-2FFVC900E -2 (Medium) Extended
XCZU9EG-3FFVC900E -3 (High Performance) Extended
XCZU9EG-2FFVC900I -2 (Medium) Industrial

XCZU9EG-2FFVC900E Power Specifications

Typical Operating Conditions

Supply Rail Voltage
VCCINT (Core) 0.85V
VCCAUX 1.8V
VCCO (I/O) 1.0V – 3.3V (Configurable)
VCCBRAM 0.85V
VCCPS 0.85V

Related Zynq UltraScale+ MPSoC Devices

Device Logic Cells DSP Slices Block RAM
XCZU3EG 154K 360 7.6 Mb
XCZU5EV 256K 1,248 13.7 Mb
XCZU7EV 504K 1,728 24.0 Mb
XCZU9EG 600K 2,520 32.1 Mb
XCZU15EG 726K 3,528 46.2 Mb

Frequently Asked Questions About XCZU9EG-2FFVC900E

What is the difference between EG and EV variants?

The XCZU9EG-2FFVC900E (EG variant) includes quad ARM Cortex-A53 processors, dual ARM Cortex-R5 processors, and a Mali-400 MP2 GPU. The EV variants additionally include an H.264/H.265 video codec capable of 4K60 encode/decode.

What development boards support the XCZU9EG?

Several evaluation boards support XCZU9EG devices, including the ZCU102 evaluation kit from AMD and various third-party development platforms from ALINX, Avnet, and others.

Is the XCZU9EG-2FFVC900E suitable for automotive applications?

The extended temperature variant (-E) operates from 0°C to +100°C. For automotive applications requiring -40°C to +125°C operation, consider the industrial (-I) or qualified automotive (-Q) variants.


Conclusion

The XCZU9EG-2FFVC900E represents AMD’s commitment to delivering cutting-edge heterogeneous processing solutions. With its powerful combination of ARM processors, extensive programmable logic resources, and comprehensive connectivity options, this MPSoC enables engineers to create sophisticated embedded systems that meet the demanding requirements of modern applications.

Whether you’re designing 5G infrastructure, implementing AI at the edge, or building next-generation industrial controls, the XCZU9EG-2FFVC900E provides the performance, flexibility, and reliability your project demands.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.