Overview of XC3SD3400A-5CSG484I FPGA
The XC3SD3400A-5CSG484I represents a cutting-edge solution in the Spartan-3A DSP FPGA family, designed specifically for high-volume, cost-sensitive, and performance-critical digital signal processing applications. Manufactured by AMD Xilinx using advanced 90nm process technology, this field-programmable gate array delivers exceptional DSP capabilities while maintaining cost-effectiveness for embedded systems, telecommunications, and consumer electronics applications.
As part of the proven Xilinx FPGA product line, the XC3SD3400A-5CSG484I offers designers the flexibility and performance needed for modern digital designs without the limitations of traditional ASICs.
Key Technical Specifications
Core Architecture Features
| Specification |
Value |
| System Gates |
3.4 Million Gates |
| Logic Cells |
53,712 Configurable Cells |
| Maximum Operating Frequency |
770 MHz |
| Process Technology |
90nm CMOS |
| Core Voltage |
1.2V (1.14V to 1.26V) |
| Package Type |
484-Pin LCSBGA/CSPBGA |
| Package Dimensions |
19mm x 19mm |
| Speed Grade |
-5 (High Performance) |
| Temperature Range |
Industrial (-40°C to +100°C) |
Memory Resources
| Memory Type |
Capacity |
Performance |
| Block RAM |
Up to 2,268 Kbits |
250-280 MHz operation |
| Distributed RAM |
Up to 373 Kbits |
Fast logic-integrated storage |
| Total RAM Bits |
2,322,432 bits |
Byte-write enable support |
DSP Processing Capabilities
| DSP Feature |
Specification |
| XtremeDSP DSP48A Slices |
High-performance 250 MHz operation |
| Multiplier |
Dedicated 18-bit × 18-bit multiplier |
| Accumulator |
48-bit for MAC operations |
| Pre-adder |
Integrated 18-bit pre-adder |
| Operation Modes |
Cascaded multiply, MAC, complex multiply |
XC3SD3400A-5CSG484I Advanced Features
Digital Signal Processing Excellence
The XC3SD3400A-5CSG484I incorporates XtremeDSP DSP48A slices operating at 250 MHz even in the standard speed grade, providing superior computational capabilities for demanding DSP applications. These DSP48A slices replace traditional multipliers and deliver enhanced performance for:
- Multiply-Accumulate (MAC) Operations: 48-bit accumulator with integrated adder
- Complex Arithmetic: Built-in support for complex multiply and multiply-add operations
- Pipeline Architecture: Multiple pipeline stages for enhanced throughput
- Frequency Processing: Synthesis, multiplication, and division capabilities
Enhanced Memory Architecture
The hierarchical SelectRAM memory architecture offers exceptional flexibility:
- Block RAM with Output Registers: Enhanced block RAM runs at 280 MHz with improved latency
- Processor Application Support: Byte-write enables for embedded processor designs
- Dual-Port Configuration: Concurrent read/write operations for high-bandwidth applications
- Distributed RAM: Logic-integrated memory for low-latency data access
I/O and Connectivity Features
| I/O Specification |
Details |
| Total I/O Pins |
Up to 469 user I/O pins |
| Differential Pairs |
Up to 227 differential signal pairs |
| I/O Standards |
LVCMOS, LVTTL, HSTL, SSTL |
| Memory Interfaces |
DDR/DDR2 SDRAM support up to 333 Mb/s |
| Multi-Standard Support |
SelectIO with multi-voltage capability |
| Hot Swap |
Full 3.3V ±10% compatibility |
XC3SD3400A-5CSG484I Application Areas
Target Industries and Use Cases
The XC3SD3400A-5CSG484I excels in diverse application domains:
Consumer Electronics
- Broadband Access Equipment: High-speed data processing for internet infrastructure
- Home Networking Devices: Router and gateway implementations
- Digital Television: Video processing and encoding/decoding
- Display and Projection Systems: Real-time image processing
Telecommunications
- Base Station Equipment: Signal processing for wireless communications
- Network Infrastructure: Packet processing and protocol handling
- Voice Processing: Echo cancellation and noise reduction
Industrial Applications
- Automation Systems: Control and monitoring equipment
- Test and Measurement: High-speed data acquisition systems
- Motor Control: Precise PWM generation and feedback processing
- Machine Vision: Real-time image analysis and pattern recognition
Configuration and Development Support
Design Tools and Software
| Tool/Resource |
Description |
| Vivado Design Suite |
Modern synthesis and implementation platform |
| ISE Design Tools |
Legacy development environment (supported) |
| Platform Flash |
Low-cost JTAG configuration solution |
| SPI Flash Support |
Alternative configuration memory option |
Embedded Processor Support
- MicroBlaze Soft Processor: 32-bit RISC processor core integration
- PicoBlaze Microcontroller: Compact 8-bit controller for system management
- Processor Peripherals: Standard bus interfaces and peripheral IP
Power Management and Efficiency
Advanced Power Features
The XC3SD3400A-5CSG484I incorporates intelligent power management:
- Low-Power Operating Modes: Reduced quiescent current for battery applications
- Suspend Mode: Minimal power consumption during standby
- Hibernate Mode: Deep sleep for maximum energy savings
- Dual-Range VCCAUX: Simplified 3.3V-only designs
Clocking Architecture
| Clock Resource |
Specification |
| Global Clock Networks |
8 low-skew global clocks |
| Regional Clocks |
8 additional clocks per device half |
| Digital Clock Managers |
Phase shifting and frequency synthesis |
| Clock Resolution |
High-resolution phase shifting capability |
Package and Physical Specifications
LCSBGA/CSPBGA Package Details
| Physical Parameter |
Value |
| Pin Count |
484 pins |
| Package Type |
Chip Scale Ball Grid Array |
| Body Size |
19mm × 19mm |
| Mounting Type |
Surface Mount Technology (SMT) |
| Moisture Sensitivity |
MSL 3 (168 hours floor life) |
| RoHS Compliance |
Lead-free, environmentally compliant |
| ESD Protection |
ESD sensitive device – proper handling required |
XC3SD3400A-5CSG484I vs Traditional ASICs
Advantages Over Mask-Programmed ASICs
The XC3SD3400A-5CSG484I provides a superior alternative to mask-programmed ASICs by eliminating several critical limitations:
| Comparison Factor |
XC3SD3400A-5CSG484I FPGA |
Traditional ASIC |
| Initial Development Cost |
Low (no mask charges) |
High (NRE costs) |
| Development Time |
Rapid prototyping |
Lengthy cycles |
| Design Flexibility |
Fully reprogrammable |
Fixed functionality |
| Field Updates |
Software upgrades possible |
Hardware replacement required |
| Time to Market |
Fast |
Extended |
| Volume Economics |
Cost-effective for medium volumes |
Only economical at high volumes |
Quality and Reliability Standards
Manufacturing and Compliance
| Standard/Certification |
Status |
| ISO 9001 |
Qualified manufacturing |
| RoHS Directive |
Fully compliant |
| ECCN Classification |
Export controlled (US regulations) |
| Automotive Grade |
XA automotive version available |
| Operating Temperature |
Industrial (-40°C to +100°C) |
| Quality Assurance |
Comprehensive testing protocols |
Migration and Compatibility
Device Family Compatibility
The XC3SD3400A-5CSG484I offers seamless migration paths:
- Common Footprints: Pin-compatible with family members for density scaling
- Software Compatibility: Design reuse across Spartan-3A DSP family
- Upward Migration: Path to higher-density Virtex families
- Package Options: Multiple package choices within speed grade
Alternative Part Numbers
| Related Part Number |
Difference |
| XC3SD3400A-4CSG484I |
Speed grade -4 (standard performance) |
| XC3SD3400A-5FGG676C |
676-pin package option |
| XC3SD1800A-5CSG484I |
Lower density (1.8M gates) |
Ordering Information and Availability
Part Number Breakdown
XC3SD3400A-5CSG484I decoding:
- XC3S = Spartan-3 family
- D3400A = DSP variant, 3.4M gates
- -5 = Speed grade (high performance)
- CSG484 = 484-pin chip scale BGA package
- I = Industrial temperature range
Stock and Lead Time Considerations
Current market conditions indicate moderate availability for the XC3SD3400A-5CSG484I. Customers should note:
- End-of-Life Status: Device in Last Time Buy (LTB) phase
- Recommended Action: Secure long-term inventory requirements
- Migration Planning: Consider newer Xilinx/AMD FPGA alternatives
- Authorized Distributors: Multiple sources available globally
Technical Support and Documentation
Available Resources
| Document Type |
Access |
| Datasheet DS610 |
Complete electrical specifications |
| User Guides |
Architecture and design guidelines |
| Application Notes |
Implementation examples |
| Reference Designs |
Pre-validated IP cores |
| Development Kits |
Evaluation boards available |
Online Support Channels
- AMD Xilinx Support Portal: Technical documentation library
- Community Forums: Designer knowledge sharing
- Training Resources: Video tutorials and webinars
- FAE Support: Field application engineer assistance
Conclusion: Why Choose XC3SD3400A-5CSG484I
The XC3SD3400A-5CSG484I delivers exceptional value for demanding DSP applications requiring:
✓ High-Performance DSP Processing: 250 MHz DSP48A slices with integrated multipliers ✓ Substantial Logic Resources: 53,712 logic cells for complex designs ✓ Flexible Memory Architecture: 2.2+ Mb total embedded memory ✓ Cost-Effective Solution: Superior price/performance ratio for volume production ✓ Proven Technology: Mature 90nm process with extensive field deployment ✓ Comprehensive Ecosystem: Complete development tools and support resources
Whether designing telecommunications equipment, industrial control systems, or consumer electronics products, the XC3SD3400A-5CSG484I provides the processing power, flexibility, and reliability required for successful product development.
Frequently Asked Questions
Q: What development tools support the XC3SD3400A-5CSG484I? A: Both Xilinx Vivado Design Suite and legacy ISE tools fully support this device, with Vivado offering modern features and improved workflows.
Q: Can I use this FPGA for automotive applications? A: Yes, an automotive-grade XA version is available for applications requiring AEC-Q100 qualification.
Q: What is the difference between -4 and -5 speed grades? A: The -5 speed grade offers higher maximum operating frequencies (770 MHz vs 667 MHz) for timing-critical applications.
Q: Is the device RoHS compliant? A: Yes, the XC3SD3400A-5CSG484I is manufactured using lead-free processes and meets RoHS requirements.
Q: What is the recommended operating temperature range? A: The ‘I’ suffix indicates industrial temperature range: -40°C to +100°C junction temperature.
