Overview of XC3SD3400A-4CSG484CES FPGA
The XC3SD3400A-4CSG484CES is a powerful Field Programmable Gate Array (FPGA) from the Spartan-3A DSP Family, featuring 3.4 million gates, 53,712 cells, and operating at 667MHz with advanced 90nm technology at 1.2V. Manufactured by AMD Xilinx (formerly Xilinx), this advanced programmable logic device delivers exceptional performance for embedded systems, digital signal processing, and complex logic applications.
This comprehensive guide explores the technical specifications, key features, applications, and benefits of the XC3SD3400A-4CSG484CES, helping engineers and designers make informed decisions for their next-generation electronic projects.
Key Technical Specifications
Core Performance Features
| Specification |
Details |
| Product Family |
Spartan-3A DSP |
| Logic Gates |
3.4 Million Gates |
| Logic Cells |
53,712 Cells |
| Operating Frequency |
667 MHz |
| Manufacturing Process |
90nm Technology |
| Supply Voltage |
1.14V ~ 1.26V (Nominal 1.2V) |
| Package Type |
484-Pin LCSBGA (CSBGA) |
| I/O Pins |
309 User I/O |
| Total RAM Bits |
2,322,432 bits |
| Mounting Type |
Surface Mount |
| Operating Temperature |
-40°C to +100°C (Commercial) |
Memory and DSP Capabilities
| Feature |
Specification |
| Block RAM |
126 Blocks (18Kb each) |
| Total Embedded RAM |
2.268 Mb |
| DSP48A Slices |
126 Slices |
| Multiplier Blocks |
Built-in 18×18 multipliers |
| Clock Management |
DCM (Digital Clock Manager) |
Product Features and Benefits
Advanced FPGA Architecture
The XC3SD3400A-4CSG484CES combines traditional FPGA flexibility with enhanced DSP capabilities, making it ideal for signal processing applications. The Spartan-3A DSP architecture includes dedicated DSP48A slices that accelerate multiplication and accumulation operations essential for digital filters, transforms, and other computational-intensive tasks.
High-Density Logic Resources
With 53,712 configurable logic cells organized in a flexible architecture, this FPGA provides ample resources for implementing complex digital designs. The device supports both combinatorial and sequential logic, enabling designers to create sophisticated state machines, data paths, and control circuits.
Extensive I/O Capabilities
The 484-pin CSBGA package offers 309 user-configurable I/O pins supporting multiple voltage standards including LVTTL, LVCMOS, SSTL, HSTL, and differential signaling standards like LVDS. This versatility ensures compatibility with various interface protocols and peripherals.
Enhanced Memory Architecture
The device features 2,322,432 total RAM bits distributed across 126 block RAM modules, each providing 18 Kb of dual-port memory. This substantial on-chip memory eliminates the need for external memory in many applications, reducing system cost and complexity.
Applications and Use Cases
Digital Signal Processing
The XC3SD3400A-4CSG484CES excels in DSP applications including:
- Digital filters (FIR/IIR)
- Fast Fourier Transforms (FFT)
- Video and image processing
- Audio encoding/decoding
- Software-defined radio (SDR)
- Wireless communication baseband processing
Embedded System Development
This Xilinx FPGA serves as an excellent platform for embedded systems requiring:
- Custom processor implementations
- Hardware acceleration
- Protocol converters
- Motor control systems
- Industrial automation
- IoT edge computing devices
Communication Systems
The high-speed I/O and DSP capabilities make it suitable for:
- Ethernet switches and routers
- Optical networking equipment
- Telecommunications infrastructure
- Data acquisition systems
- High-speed serial communication
Test and Measurement
Engineers utilize this FPGA in:
- Arbitrary waveform generators
- Logic analyzers
- Oscilloscope front-ends
- Spectrum analyzers
- Protocol analyzers
Package and Pin Configuration
CSBGA484 Package Details
| Package Attribute |
Value |
| Package Code |
CSG484 |
| Total Pins |
484 |
| Package Dimensions |
23mm x 23mm |
| Ball Pitch |
1.0mm |
| Package Height |
Suitable for high-density PCB designs |
The chip-scale ball grid array (CSBGA) package provides excellent thermal performance and reduced parasitic inductance, making it ideal for high-frequency designs. The compact footprint enables space-efficient board layouts while maintaining robust electrical characteristics.
Design Resources and Support
Development Tools
Engineers working with the XC3SD3400A-4CSG484CES have access to comprehensive design tools:
- Vivado Design Suite: Industry-leading FPGA design environment
- ISE Design Suite: Legacy support for Spartan-3A devices
- IP Core Libraries: Pre-verified DSP, communication, and interface IP
- Simulation Tools: ModelSim, ISIM for functional verification
- Programming Tools: iMPACT, ChipScope for debugging
Design Considerations
When implementing designs with this FPGA, consider:
- Power Management: Implement proper voltage regulation for 1.2V core and I/O banks
- Clock Distribution: Utilize DCMs for clock synthesis and phase alignment
- Thermal Management: Ensure adequate cooling for high-utilization designs
- Signal Integrity: Follow PCB layout guidelines for high-speed signals
- Configuration: Select appropriate configuration mode (JTAG, SPI, BPI)
Performance Specifications
Speed Grade Analysis
The “-4” speed grade indicates this is a high-performance variant with:
- Maximum Toggle Rate: 667 MHz on global clock networks
- Logic Delay: Optimized for timing-critical paths
- Setup/Hold Times: Minimal clock-to-output delays
- Routing Resources: Enhanced interconnect for reduced propagation delay
Power Consumption
Typical power consumption characteristics:
| Power Type |
Typical Value |
| Static Power |
200-300 mW (device dependent) |
| Dynamic Power |
Varies with design utilization |
| I/O Power |
Depends on drive strength and toggle rate |
| Total Power |
Application-specific (use Xilinx Power Estimator) |
Quality and Reliability
Manufacturing Standards
The XC3SD3400A-4CSG484CES is manufactured according to:
- ISO 9001 quality management standards
- Automotive-grade quality processes (when specified)
- RoHS compliance for environmental regulations
- Moisture sensitivity level (MSL) rating for proper handling
Reliability Features
Built-in reliability features include:
- ECC (Error Correction Code) for block RAM
- CRC (Cyclic Redundancy Check) for configuration verification
- SEU (Single Event Upset) mitigation techniques
- Temperature monitoring and management
Comparison with Alternative Solutions
Spartan-3A DSP Family Comparison
| Device |
Logic Cells |
DSP Slices |
Block RAM |
I/O Pins |
| XC3SD1800A |
37,440 |
84 |
1.512 Mb |
519 |
| XC3SD3400A |
53,712 |
126 |
2.268 Mb |
469 |
| XC6SLX Series |
Higher |
Varies |
More |
More (Newer Family) |
Procurement and Availability
Ordering Information
- Part Number: XC3SD3400A-4CSG484CES
- Package Marking: Device code and date code printed on package
- Lead Time: Consult authorized distributors
- MOQ: Varies by distributor
Quality Assurance
Each device undergoes rigorous testing including:
- Functional testing at speed
- Temperature cycling
- Burn-in (for automotive/aerospace grades)
- Visual inspection
- Electrical parameter verification
Getting Started Guide
Initial Setup Steps
- Hardware Requirements:
- FPGA development board or custom PCB
- JTAG programming cable
- Power supply (1.2V core + I/O voltages)
- Software Installation:
- Download Vivado or ISE Design Suite
- Install device support files
- Configure license (if required)
- First Design:
- Create new project targeting XC3SD3400A-4CSG484C
- Implement simple LED blinker or counter
- Synthesize, implement, and generate bitstream
- Program device via JTAG
Example Design Templates
Common starter projects include:
- UART communication interface
- SPI/I2C controller
- PWM generator
- Simple processor core
- Video pattern generator
Frequently Asked Questions
Q: What is the difference between XC3SD3400A-4CSG484C and XC3SD3400A-4CSG484CES?
A: The “ES” suffix typically indicates an Engineering Sample or specific revision. For production designs, verify the exact part specification with the manufacturer.
Q: Can this FPGA be used for real-time video processing?
A: Yes, with 126 DSP slices and substantial block RAM, it can handle video processing tasks including scaling, filtering, and format conversion at standard video rates.
Q: What configuration modes are supported?
A: The device supports Master/Slave Serial, Master/Slave SelectMAP, JTAG, and Boundary Scan configuration modes.
Q: Is this FPGA suitable for aerospace applications?
A: Standard commercial-grade devices are not qualified for aerospace. Contact AMD Xilinx for space-grade or radiation-hardened variants.
Conclusion
The XC3SD3400A-4CSG484CES represents a powerful, cost-effective solution for embedded systems requiring substantial logic resources, DSP capabilities, and flexible I/O. Its combination of 3.4 million gates, 126 DSP slices, and extensive memory makes it ideal for signal processing, communication, and control applications.
Whether you’re developing industrial automation systems, telecommunications equipment, or advanced digital circuits, this Spartan-3A DSP FPGA provides the performance, flexibility, and reliability needed for demanding applications. With comprehensive development tools and extensive documentation, engineers can quickly prototype and deploy innovative solutions using this versatile programmable logic device.
For detailed technical specifications, reference designs, and application notes, consult the official AMD Xilinx documentation and consider partnering with authorized distributors for technical support and volume pricing.
