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Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC3SD1800A-4CSG484C: High-Performance Spartan-3A DSP FPGA for Advanced Digital Signal Processing

Product Details

Overview of the XC3SD1800A-4CSG484C FPGA

The XC3SD1800A-4CSG484C is a powerful field-programmable gate array from AMD (formerly Xilinx), engineered to deliver exceptional digital signal processing capabilities for demanding embedded applications. This Spartan-3A DSP family member combines 1.8 million system gates with dedicated DSP resources, making it an ideal solution for communications, industrial automation, and data processing systems. With its 484-pin CSPBGA package and commercial-grade temperature range, this FPGA provides designers with a versatile platform for implementing complex algorithms and high-speed data operations.

Key Technical Specifications

Core Architecture Features

Specification Value
System Gates 1,800,000 gates
Logic Cells 37,440 cells (84,480 equivalent)
Logic Blocks (CLBs) 4,160
DSP48 Slices 84 dedicated slices
Block RAM 3,456 Kbits (1,548,288 bits total)
Distributed RAM 189 KB
Maximum Frequency 667 MHz

Package and Physical Specifications

Feature Details
Package Type 484-FBGA, CSPBGA (Chip Scale BGA)
Pin Count 484 pins
Package Dimensions 19mm x 19mm
Ball Pitch 0.8mm
User I/O Pins 309
Mounting Type Surface Mount

Power and Operating Conditions

Parameter Rating
Core Voltage 1.2V nominal (1.14V – 1.26V range)
Operating Temperature 0°C to 85°C (Commercial grade)
I/O Output Drive 24 mA
Speed Grade -4 (highest performance)
Process Technology 90nm CMOS
RoHS Compliance Yes, Lead-free

Performance Characteristics and DSP Capabilities

DSP48 Slice Architecture

The XC3SD1800A-4CSG484C incorporates 84 dedicated DSP48 slices, purpose-built for high-speed arithmetic operations. These hardware multipliers enable efficient implementation of:

  • Digital filters (FIR, IIR)
  • Fast Fourier Transforms (FFT)
  • Complex multiplication operations
  • Correlation and convolution algorithms
  • Accumulator functions at 667 MHz

Memory Resources

With 1,548,288 bits of block RAM organized in configurable blocks, this FPGA provides substantial on-chip memory for buffering, data storage, and algorithm implementation. The distributed RAM adds another 189 KB of flexible memory resources that can be configured as shift registers or small RAM blocks.

Supported I/O Standards and Interfaces

The XC3SD1800A-4CSG484C supports multiple industry-standard I/O interfaces, ensuring compatibility with various system architectures:

I/O Standard Category Supported Standards
Single-Ended LVCMOS, LVTTL
High-Speed HSTL (SSTL)
Differential LVDS, mini-LVDS, RSDS
Voltage Range 1.5V to 3.3V multi-voltage operation

Application Areas and Use Cases

Digital Signal Processing

The XC3SD1800A-4CSG484C excels in DSP-intensive applications:

  • Software-defined radio (SDR) systems
  • Wireless base station digital front-ends
  • Audio and video processing
  • Radar signal processing
  • Medical imaging equipment

Industrial and Embedded Systems

  • Motor control and automation
  • Industrial protocols (Ethernet, PROFIBUS, Modbus)
  • Machine vision processing
  • Data acquisition systems
  • Real-time control applications

Communications Infrastructure

  • Wireless access points
  • Network processing
  • Protocol conversion
  • Security and surveillance systems
  • Telecommunications equipment

Development and Design Support

Software Tools Compatibility

The XC3SD1800A-4CSG484C is supported by:

  • Xilinx ISE Design Suite (legacy support)
  • Vivado Design Suite (for newer workflows)
  • Third-party synthesis tools
  • Hardware debugging tools (ChipScope, ILA)

Design Resources

Developers have access to comprehensive resources including:

  • Complete datasheets with timing specifications
  • Application notes for DSP implementation
  • Reference designs and example projects
  • IP core libraries (filters, communication protocols, memory controllers)
  • Pin configuration files and package drawings
  • PCB layout guidelines

Pin Configuration and Package Details

The 484-LCSBGA package provides excellent signal integrity characteristics with its 19mm x 19mm footprint and 0.8mm ball pitch. The compact chip-scale design offers:

  • Superior thermal performance
  • Reduced board space requirements
  • High-density pin arrangement
  • Controlled impedance for high-speed signals

Comparison with Related Spartan-3A DSP Devices

Device System Gates Logic Cells DSP Slices Block RAM
XC3SD1800A 1.8M 37,440 84 3,456 Kb
XC3SD3400A 3.4M 53,712 126 5,328 Kb
XC3S1400A 1.4M 29,504 32 2,592 Kb

Ordering Information and Package Options

Part Number: XC3SD1800A-4CSG484C

Breakdown:

  • XC3SD1800A – Device family and gate count
  • -4 – Speed grade (highest performance)
  • CSG484 – Package type (Chip Scale Grid Array, 484 pins)
  • C – Commercial temperature range (0°C to 85°C)

Quality and Compliance Standards

The XC3SD1800A-4CSG484C meets stringent industry standards:

  • RoHS compliant (lead-free)
  • REACH compliant
  • Automotive-grade quality flow available
  • Extended temperature variants available
  • JTAG boundary scan (IEEE 1149.1)
  • In-system programming via IEEE 1532

Power Management Features

This FPGA incorporates advanced power management capabilities:

  • Multiple power domains for I/O flexibility
  • Clock gating for dynamic power reduction
  • Sleep modes for battery-powered applications
  • Thermal monitoring capabilities
  • Voltage scaling support

Prototyping and Evaluation Boards

Several development platforms support the XC3SD1800A-4CSG484C:

  • Spartan-3A DSP Starter Kit
  • Custom carrier boards from third-party vendors
  • Digilent evaluation platforms
  • Prototype boards with standard interfaces (HDMI, Ethernet, USB)

Technical Support and Documentation

Available Resources

Engineers working with the XC3SD1800A-4CSG484C have access to:

  • Comprehensive technical documentation
  • Online community forums
  • Application engineering support
  • Webinars and training materials
  • Design examples and tutorials
  • IBIS models for signal integrity analysis

Why Choose the XC3SD1800A-4CSG484C?

Key Advantages

  1. Proven Architecture: Based on mature Spartan-3A technology with extensive field history
  2. Cost-Effective: Competitive pricing for production volumes
  3. DSP Optimized: Dedicated hardware accelerators for signal processing
  4. Flexible I/O: Support for modern and legacy interface standards
  5. Complete Ecosystem: Extensive tools, IP cores, and design resources

Performance Benefits

  • High-Speed Operation: 667 MHz maximum frequency enables demanding applications
  • Parallel Processing: Thousands of logic cells enable massive parallelism
  • Low Latency: Hardware implementation reduces processing delays
  • Deterministic Performance: Real-time operation for critical applications

Conclusion

The XC3SD1800A-4CSG484C represents an excellent choice for engineers designing digital signal processing systems, embedded controllers, and communications equipment. Its combination of substantial logic resources, dedicated DSP hardware, and flexible I/O capabilities makes it suitable for a wide range of applications. Whether you’re implementing complex algorithms, processing high-speed data streams, or building sophisticated control systems, this Xilinx FPGA provides the performance and features needed for successful project implementation.

With comprehensive tool support, extensive documentation, and a proven track record in industrial applications, the XC3SD1800A-4CSG484C continues to be a reliable solution for demanding FPGA-based designs in communications, industrial, and embedded markets.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.