Overview of XC3SD3400A-4CS484I FPGA
The XC3SD3400A-4CS484I is a cutting-edge Field Programmable Gate Array (FPGA) from AMD Xilinx’s renowned Spartan-3A DSP family, specifically engineered for demanding digital signal processing applications. This industrial-grade programmable logic device combines exceptional performance with cost-effectiveness, making it an ideal choice for embedded systems, telecommunications infrastructure, industrial automation, and advanced signal processing applications.
As part of the Spartan-3A DSP series, this FPGA delivers superior processing capabilities with 3.4 million system gates and 53,712 logic cells, providing designers with substantial computational resources for complex algorithms and real-time data processing tasks. The device’s -4 speed grade ensures high-performance operation suitable for time-critical applications.
Key Technical Specifications
Core FPGA Specifications Table
| Specification |
Value |
Description |
| Part Number |
XC3SD3400A-4CS484I |
Complete AMD Xilinx identification |
| Product Family |
Spartan-3A DSP |
Optimized for DSP applications |
| Logic Cells |
53,712 cells |
Substantial processing capability |
| System Gates |
3.4 Million gates |
High-density programmable logic |
| Speed Grade |
-4 (High Performance) |
Optimized for time-critical designs |
| Operating Frequency |
Up to 667 MHz |
Maximum system performance |
| Core Voltage |
1.14V – 1.26V (1.2V nominal) |
Low power consumption |
| Process Technology |
90nm |
Proven manufacturing process |
Package and Environmental Specifications
| Parameter |
Specification |
Details |
| Package Type |
CS484 – CSBGA |
Chip Scale Ball Grid Array |
| Pin Count |
484 pins |
Compact footprint design |
| I/O Pins |
309 user I/O |
Extensive connectivity options |
| Package Size |
LCSBGA-484 |
Lead-free compatible |
| Temperature Range |
-40°C to +100°C (Tj) |
Industrial temperature grade |
| Mounting Type |
Surface Mount |
Reflow soldering compatible |
| RoHS Status |
Non-Compliant |
Check for latest compliance |
Advanced Features and Architecture
Digital Signal Processing Capabilities
The XC3SD3400A-4CS484I incorporates dedicated XtremeDSP DSP48A slices that provide hardware-accelerated multiply-accumulate operations essential for digital signal processing tasks. These DSP blocks operate at 250 MHz even in the standard -4 speed grade, delivering exceptional performance for:
- Digital filtering and convolution
- Fast Fourier Transform (FFT) operations
- Correlation and pattern matching
- Image and video processing
- Communications signal processing
- Audio codec implementation
Memory Architecture Specifications
| Memory Type |
Capacity |
Features |
| Embedded Block RAM |
2,322,432 bits total |
Enhanced with output registers |
| Distributed RAM |
Implementation via LUTs |
Flexible memory allocation |
| RAM Performance |
250 MHz operation |
Fast data access |
| Memory Organization |
Dual-port configuration |
Simultaneous read/write |
Configurable Logic Resources
The FPGA’s architecture consists of:
- Configurable Logic Blocks (CLBs) with flexible Look-Up Tables (LUTs) for logic implementation
- Digital Clock Managers (DCMs) for precise clock distribution and frequency synthesis
- I/O Blocks (IOBs) supporting multiple voltage standards including LVTTL, LVCMOS, HSTL, and differential signaling
- Enhanced clocking resources for complex timing requirements
I/O Standards and Interface Capabilities
Supported I/O Standards Table
| Standard Type |
Voltage Levels |
Applications |
| LVTTL |
3.3V |
General purpose I/O |
| LVCMOS |
1.2V, 1.5V, 1.8V, 2.5V, 3.3V |
Low voltage applications |
| HSTL |
High-speed transceiver logic |
DDR memory interfaces |
| SSTL |
Stub series terminated logic |
Memory controllers |
| Differential |
LVDS, mini-LVDS |
High-speed serial communication |
| PCI/PCI-X |
3.3V, 5V tolerant |
System interconnect |
Application Areas and Use Cases
Primary Application Domains
1. Industrial Automation and Control
- Programmable logic controllers (PLCs)
- Motion control systems
- Machine vision processing
- Factory automation protocols
- Real-time monitoring systems
2. Digital Communications
- Software-defined radio (SDR)
- Base station processing
- Protocol converters
- Signal modulation/demodulation
- Channel coding and decoding
3. Consumer Electronics
- Digital television (DTV) systems
- Home networking equipment
- Display and projection systems
- Audio/video processing
- Broadband access equipment
4. Medical Instrumentation
- Diagnostic imaging equipment
- Patient monitoring systems
- Laboratory analyzers
- Portable medical devices
- Signal acquisition systems
5. Aerospace and Defense
- Radar signal processing
- Electronic warfare systems
- Avionics control
- Secure communications
- Navigation systems
Performance Comparison Table
Spartan-3A DSP Family Comparison
| Device |
System Gates |
Logic Cells |
Block RAM (bits) |
DSP48A Slices |
I/O (Max) |
| XC3SD1800A |
1.8M |
37,440 |
1,572,864 |
84 |
519 |
| XC3SD3400A |
3.4M |
53,712 |
2,322,432 |
126 |
519 |
Development and Design Support
Xilinx Development Tools
For optimal development experience with the XC3SD3400A-4CS484I, Xilinx FPGA designers can leverage:
- Vivado Design Suite – Modern FPGA development environment with advanced synthesis and implementation
- ISE Design Suite – Legacy tool chain for Spartan-3A family support
- IP Core Libraries – Pre-verified intellectual property blocks
- ChipScope Pro – Integrated logic analyzer for debugging
- Embedded Development Kit (EDK) – For processor-based designs
Design Resources Available
| Resource Type |
Description |
Access |
| Product Datasheet |
Complete electrical specifications |
Official AMD Xilinx documentation |
| User Guides |
Architecture and design guidelines |
Technical reference manuals |
| Application Notes |
Design best practices |
Implementation examples |
| Reference Designs |
Proven IP implementations |
Starter projects |
| Development Boards |
Evaluation platforms |
Third-party vendors |
Power Management Features
Power Consumption Characteristics
The XC3SD3400A-4CS484I implements several power optimization techniques:
- Multiple voltage domains for selective power reduction
- Clock gating capabilities to reduce dynamic power
- Sleep modes for unused logic blocks
- Optimized I/O buffers for reduced power consumption
- Fine-grained power management throughout the fabric
Estimated Power Consumption Table
| Operating Mode |
Typical Power |
Conditions |
| Active (Full Utilization) |
2.5W – 3.5W |
Maximum frequency, all logic active |
| Active (Moderate) |
1.5W – 2.5W |
Typical application usage |
| Standby |
< 100mW |
Clock disabled, configuration retained |
Programming and Configuration
Configuration Options
| Configuration Mode |
Interface |
Speed |
Applications |
| Master Serial |
SPI Flash |
Fast |
Standalone systems |
| Master Parallel |
Byte-wide |
Fastest |
High-speed boot |
| Slave Serial |
External processor |
Flexible |
System integration |
| JTAG |
Boundary scan |
Debug |
Development and testing |
Configuration Memory Requirements
The XC3SD3400A-4CS484I requires approximately 11 Mbits of configuration data, which can be stored in:
- Serial Flash memory (SPI)
- Parallel NOR Flash
- External processor memory
- JTAG programming cable (development)
Quality and Reliability
Quality Assurance Standards
| Standard |
Compliance |
Details |
| Manufacturing |
ISO 9001 certified |
Quality management system |
| Temperature Grade |
Industrial (-40°C to +100°C) |
Extended operating range |
| ESD Protection |
Human Body Model |
Robust handling characteristics |
| MTBF |
High reliability |
Proven in harsh environments |
Package Dimensions and PCB Considerations
Mechanical Specifications
| Parameter |
Value |
Notes |
| Package Size |
23mm x 23mm |
Compact footprint |
| Ball Pitch |
1.0mm |
Standard BGA spacing |
| Package Height |
1.27mm typical |
Low profile design |
| Weight |
Approximately 0.5g |
Lightweight |
PCB Design Recommendations
- Minimum 6-layer PCB recommended for signal integrity
- Controlled impedance for high-speed signals
- Power plane separation for noise reduction
- Decoupling capacitors per power supply guidelines
- Thermal vias for heat dissipation
- BGA breakout routing following best practices
Ordering Information
Part Number Breakdown
XC3SD3400A-4CS484I
- XC3SD = Spartan-3A DSP family
- 3400 = 3.4M system gates
- A = Advanced version
- -4 = Speed grade (high performance)
- CS484 = 484-pin CSBGA package
- I = Industrial temperature range (-40°C to +100°C)
Alternative Package Options
| Part Number |
Package |
Temperature |
Speed Grade |
| XC3SD3400A-4CS484C |
CS484 |
Commercial (0°C to +85°C) |
-4 |
| XC3SD3400A-5CS484I |
CS484 |
Industrial |
-5 |
| XC3SD3400A-4FG676I |
FG676 |
Industrial |
-4 |
Competitive Advantages
Why Choose XC3SD3400A-4CS484I?
Cost-Effective DSP Processing
The integrated DSP48A slices eliminate the need for external DSP processors in many applications, reducing overall system cost and complexity while improving performance.
Proven Technology
Built on mature 90nm process technology, the Spartan-3A DSP family has established reliability and availability, with extensive field deployment history.
Comprehensive Ecosystem
Extensive third-party IP, development boards, and design support make implementation faster and reduce time-to-market.
Scalability
Pin-compatible with other Spartan-3A DSP devices allows easy migration between family members for cost or performance optimization.
Technical Support and Resources
Getting Started
For engineers beginning development with the XC3SD3400A-4CS484I:
- Download development tools from AMD Xilinx website
- Review product datasheet for electrical specifications
- Explore reference designs for your application domain
- Join community forums for peer support
- Consider evaluation boards for rapid prototyping
Documentation Package
Complete technical documentation includes:
- Product datasheet with AC/DC characteristics
- PCB design guidelines and thermal considerations
- Configuration and programming user guide
- IP core documentation and application notes
- Package drawings and mechanical specifications
Conclusion
The XC3SD3400A-4CS484I represents an excellent choice for engineers developing cost-sensitive, high-performance digital signal processing systems. With its combination of substantial logic resources (53,712 cells), dedicated DSP blocks, ample block RAM (2.3 Mbits), and industrial temperature operation, this FPGA provides the flexibility and performance needed for demanding applications.
Whether you’re designing telecommunications equipment, industrial control systems, or consumer electronics, the XC3SD3400A-4CS484I delivers the processing power and features required for modern embedded systems. Its proven architecture, comprehensive development tool support, and competitive pricing make it a compelling solution for volume production.
For more information about Xilinx FPGA products and solutions, visit the official AMD Xilinx documentation center or contact authorized distributors for pricing and availability.
