Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

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XC3SD3400A-4CS484LI: High-Performance Spartan-3A DSP FPGA for Advanced Digital Signal Processing Applications

Product Details

Overview of XC3SD3400A-4CS484LI FPGA

The XC3SD3400A-4CS484LI is a powerful Field-Programmable Gate Array (FPGA) from AMD (formerly Xilinx), belonging to the renowned Spartan-3A DSP family. This advanced programmable logic device delivers exceptional performance for high-volume, cost-sensitive DSP applications, offering 3.4 million system gates and 53,712 logic cells in a compact 484-pin BGA package.

Designed for engineers and system integrators seeking optimal DSP price-to-performance ratios, this FPGA combines cutting-edge 90nm process technology with enhanced DSP capabilities, making it ideal for consumer electronics, industrial automation, telecommunications, and embedded systems applications.

Key Technical Specifications

Core Performance Specifications

Specification Details
Part Number XC3SD3400A-4CS484LI
Manufacturer AMD (Xilinx)
Product Family Spartan-3A DSP
System Gates 3.4 Million
Logic Cells 53,712
Speed Grade -4 (Standard)
Operating Frequency Up to 667 MHz
Process Technology 90nm
Operating Voltage 1.2V Core
Package Type 484-Pin CSBGA (Chip Scale Ball Grid Array)
Temperature Grade Industrial (-40°C to +100°C)
I/O Pins 309 User I/O

Memory and DSP Resources

Resource Type Quantity
Block RAM 648 Kbits (Enhanced)
Distributed RAM Available in logic cells
XtremeDSP DSP48A Slices 126 Slices
18×18 Multipliers Integrated in DSP48A
Maximum Block RAM Speed 250 MHz

Package and Pin Configuration

Package Detail Specification
Package Style BGA (Ball Grid Array)
Pin Count 484 Pins
Package Dimensions 23mm x 23mm
Lead-Free Yes (RoHS Compliant)
Mounting Type Surface Mount

Advanced Features and Capabilities

XtremeDSP DSP48A Architecture

The XC3SD3400A-4CS484LI features 126 XtremeDSP DSP48A slices, based on proven Virtex-4 DSP48 block architecture. These high-performance DSP blocks provide:

  • 25×18 Multipliers for enhanced precision
  • 48-bit Accumulator for extended dynamic range
  • Cascade Connections for efficient multi-tap filter implementation
  • Built-in Pre-adder for optimized symmetric filter designs
  • 250 MHz Operation in standard speed grade

Enhanced Block RAM Features

Block RAM modules in the Spartan-3A DSP family include output registers for improved performance, enabling:

  • Faster clock-to-output times
  • Reduced routing congestion
  • Simplified timing closure
  • 250 MHz operation capability

Flexible I/O Architecture

The 484-pin CSBGA package provides 309 user I/O pins supporting:

  • Multiple I/O standards (LVTTL, LVCMOS, LVDS, and more)
  • Programmable drive strength
  • Input delay compensation
  • Output edge-rate control
  • Digitally Controlled Impedance (DCI)

Primary Application Areas

Digital Signal Processing

The XC3SD3400A-4CS484LI excels in DSP-intensive applications including:

  • Digital filtering (FIR/IIR filters)
  • FFT/IFFT processing
  • Image and video processing
  • Audio codec implementation
  • Software-defined radio (SDR)
  • Radar signal processing

Consumer Electronics

Ideal for next-generation consumer products:

  • Digital television systems
  • Set-top boxes
  • Home networking equipment
  • Display and projection systems
  • Broadband access equipment
  • Audio/video processing

Industrial and Automotive

Robust performance for demanding environments:

  • Industrial automation controllers
  • Machine vision systems
  • Motor control applications
  • Automotive infotainment
  • Safety-critical systems
  • Industrial communication protocols

Telecommunications

High-speed communication applications:

  • Baseband processing
  • Channel coding/decoding
  • Protocol processing
  • Network packet processing
  • Wireless infrastructure

Why Choose XC3SD3400A-4CS484LI?

Cost-Effective DSP Performance

The Spartan-3A DSP family delivers more DSP functionality and memory bandwidth per dollar than previous generations, making it an economical alternative to dedicated DSP processors and ASICs.

Proven Technology

Built on mature 90nm process technology, the XC3SD3400A-4CS484LI offers reliable performance with high yields and excellent power characteristics.

Design Flexibility

Full reprogrammability allows for:

  • Rapid prototyping
  • Field upgrades
  • Design optimization
  • Future-proofing investments

Development Tool Support

Compatible with industry-standard design tools:

  • Xilinx ISE Design Suite
  • Vivado Design Suite (for migration)
  • Third-party synthesis tools
  • IP core integration

Technical Comparison Table

Spartan-3A DSP Family Comparison

Feature XC3SD1800A XC3SD3400A
System Gates 1.8M 3.4M
Logic Cells 37,440 53,712
Block RAM 360 Kbits 648 Kbits
DSP48A Slices 84 126
Max User I/O 311 519

Power Specifications

Operating Conditions

Parameter Typical Maximum
Core Voltage (VCCINT) 1.2V 1.26V
Auxiliary Voltage (VCCAUX) 2.5V 2.625V
I/O Voltage (VCCO) Variable 3.3V
Static Power Device-dependent
Dynamic Power Design-dependent

Package and Environmental Information

Mechanical Specifications

  • Package Height: 1.27mm (typical)
  • Ball Pitch: 1.0mm
  • Moisture Sensitivity Level: MSL 3
  • Storage Temperature: -55°C to +150°C
  • Operating Temperature: -40°C to +100°C (Industrial grade)

Design Resources and Support

Getting Started with XC3SD3400A-4CS484LI

Engineers can leverage comprehensive resources for successful implementation:

  1. Documentation: Complete datasheets and user guides
  2. IP Cores: Pre-verified DSP and interface IP
  3. Reference Designs: Application-specific starting points
  4. Development Boards: Evaluation platforms for prototyping
  5. Technical Support: Community forums and direct engineering support

Compatible Development Platforms

Popular development boards supporting Spartan-3A DSP FPGAs include:

  • Nexys series boards
  • Basys development platforms
  • Custom carrier boards

Quality and Compliance

Certifications and Standards

  • RoHS Compliant: Lead-free package
  • REACH Compliant: European chemical regulations
  • Industrial Grade: Extended temperature operation
  • Quality Assurance: ISO-certified manufacturing

Ordering Information

Part Number Breakdown

XC3SD3400A-4CS484LI breaks down as:

  • XC3SD: Spartan-3A DSP family
  • 3400A: Device density (3.4M gates)
  • 4: Speed grade
  • CS484: Package type (484-pin CSBGA)
  • LI: Industrial temperature grade, Lead-free

Available Variants

Related part numbers in the family:

  • XC3SD3400A-4CSG484C (Commercial grade)
  • XC3SD3400A-4FG676I (676-pin package, Industrial)
  • XC3SD3400A-5CS484I (Higher speed grade)

Learn More About Xilinx FPGA

For comprehensive information about Xilinx FPGA solutions, design methodologies, and application support, visit our dedicated Xilinx FPGA resource center.

Frequently Asked Questions

What is the difference between XC3SD3400A-4CS484LI and XC3SD3400A-4CS484C?

The “LI” suffix indicates industrial temperature grade (-40°C to +100°C), while “C” denotes commercial grade (0°C to +85°C). Both are lead-free packages.

Can I use this FPGA for machine learning applications?

While primarily designed for DSP applications, the XC3SD3400A-4CS484LI can implement basic machine learning algorithms, particularly for inference. However, newer FPGA families are better optimized for AI/ML workloads.

What development tools are required?

You’ll need Xilinx ISE Design Suite (version 14.7 or compatible) for synthesis, implementation, and bitstream generation. Free WebPACK editions support Spartan devices.

How does power consumption compare to similar FPGAs?

The 90nm process technology provides efficient power consumption for its performance class. Actual power depends on design utilization, clock frequencies, and I/O activity.

Is this FPGA suitable for safety-critical applications?

The industrial-grade version offers extended temperature operation, but for safety-critical applications, additional qualification and testing may be required per industry standards (ISO 26262, DO-254, etc.).

Conclusion

The XC3SD3400A-4CS484LI represents an excellent balance of DSP performance, cost-effectiveness, and design flexibility. With 3.4 million system gates, 126 DSP48A slices, and 648 Kbits of block RAM, this Spartan-3A DSP FPGA delivers exceptional value for high-volume DSP applications. Whether you’re developing consumer electronics, industrial control systems, or telecommunications equipment, the XC3SD3400A-4CS484LI provides the programmable logic resources and DSP capabilities needed for successful product implementation.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.