The XC3SD3400A-4CSG484C is a powerful field-programmable gate array (FPGA) from AMD’s (formerly Xilinx) renowned Spartan-3A DSP family, engineered to deliver exceptional performance for demanding digital signal processing and embedded system applications. This versatile FPGA combines cost-effectiveness with robust processing capabilities, making it an ideal choice for engineers and designers developing next-generation electronic systems.
Product Overview: XC3SD3400A-4CSG484C FPGA Specifications
The XC3SD3400A-4CSG484C represents the pinnacle of the Extended Spartan-3A FPGA series, offering impressive logic density and processing power in a compact 484-pin CSBGA package. Built on proven 90nm process technology, this FPGA delivers reliability and performance for high-volume, cost-sensitive applications across multiple industries.
Key Technical Specifications
| Specification |
Value |
| Logic Capacity |
3.4 Million System Gates |
| Logic Elements |
53,712 Cells |
| I/O Pins |
309 User I/Os |
| Operating Frequency |
Up to 667 MHz |
| Package Type |
484-Pin LCSBGA (CSBGA-484) |
| Speed Grade |
-4 (Standard Performance) |
| Supply Voltage |
1.2V Core (VCCINT) |
| Process Technology |
90nm CMOS |
| Operating Temperature |
0°C to +85°C (Commercial) |
Advanced Features of XC3SD3400A-4CSG484C
Digital Signal Processing Capabilities
The XC3SD3400A-4CSG484C incorporates dedicated XtremeDSP DSP48A slices that accelerate complex mathematical operations essential for signal processing applications. These hardware-accelerated blocks enable:
- High-speed multiply-accumulate operations
- Efficient implementation of digital filters
- Real-time signal processing with minimal latency
- Power-efficient computation compared to software solutions
Memory Architecture
This <a href=”https://pcbsync.com/xilinx-fpga/”>Xilinx FPGA</a> features a sophisticated memory hierarchy designed for data-intensive applications:
| Memory Type |
Capacity |
| Distributed RAM |
373 Kbit |
| Embedded Block RAM |
2,268 Kbit (2.21 Mbit) |
| Total Memory Resources |
2,641 Kbit |
The generous embedded memory enables efficient buffering, data storage, and implementation of complex state machines without requiring external memory components in many applications.
Performance Characteristics
Speed and Timing
The -4 speed grade designation indicates standard performance characteristics optimized for a wide range of applications:
- Maximum System Clock: 667 MHz internal frequency
- External I/O Performance: 250 MHz typical operation
- Low Propagation Delay: Fast signal routing through configurable logic blocks
- Deterministic Timing: Predictable performance for critical real-time systems
Power Efficiency
Built on 90nm technology, the XC3SD3400A-4CSG484C offers excellent power-per-performance characteristics:
- Low static power consumption
- Dynamic power scaling with clock gating
- Multiple power domains (VCCINT, VCCAUX, VCCO)
- Optimized for battery-powered and energy-conscious applications
Application Areas for XC3SD3400A-4CSG484C
Industrial Automation and Control
The robust architecture makes this FPGA ideal for:
- Programmable logic controllers (PLCs)
- Motor control systems
- Industrial communication protocols
- Real-time monitoring and control systems
Communications Infrastructure
High-speed I/O and DSP capabilities support:
- Software-defined radio implementations
- Protocol processing and bridging
- Data encryption and security
- Network packet processing
Consumer Electronics
Cost-effective performance enables:
- High-definition video processing
- Audio signal processing and effects
- Image processing and computer vision
- Gaming and entertainment systems
Automotive Systems
Reliability and performance support:
- Advanced driver assistance systems (ADAS)
- In-vehicle infotainment
- Sensor fusion and processing
- CAN bus and automotive networking
Package Information: 484-Pin CSBGA
Physical Characteristics
| Parameter |
Specification |
| Package Type |
Chip Scale Ball Grid Array (CSBGA) |
| Total Pins |
484 |
| Mounting Style |
Surface Mount Technology (SMT) |
| Body Size |
Compact footprint for space-constrained designs |
| Ball Pitch |
Industry-standard spacing |
Thermal Management
The CSBGA package provides excellent thermal performance through:
- Direct thermal path to PCB
- Efficient heat dissipation
- Compatibility with standard cooling solutions
- Junction-to-ambient thermal resistance optimized for reliability
Design Resources and Development Tools
Software Support
The XC3SD3400A-4CSG484C is supported by AMD’s comprehensive development ecosystem:
- Vivado Design Suite: Modern FPGA design flow with advanced synthesis and implementation
- ISE Design Suite: Legacy support for existing designs
- IP Core Library: Pre-verified intellectual property blocks
- Simulation Tools: Industry-standard verification environments
Development Boards
While specific development kits may vary, compatible evaluation platforms typically include:
- Spartan-3A DSP starter kits
- Third-party development boards
- Custom carrier board designs
- Educational platform support
Ordering and Availability
Part Number Breakdown
XC3SD3400A-4CSG484C
- XC3SD3400A: Device family and density
- -4: Speed grade (standard performance)
- CSG484: Package type (484-pin CSBGA)
- C: Commercial temperature range (0°C to +85°C)
Quality and Compliance
| Certification |
Status |
| RoHS Compliant |
Yes |
| Moisture Sensitivity |
MSL (Moisture Sensitivity Level) rated |
| ESD Protection |
Industry-standard handling precautions |
| Quality Standards |
ISO 9001 manufacturing |
Technical Comparison Table
XC3SD3400A vs. Other Spartan-3A Devices
| Device |
Logic Cells |
System Gates |
Block RAM |
DSP Slices |
| XC3SD1800A |
37,440 |
1.8M |
1,512 Kbit |
84 |
| XC3SD3400A |
53,712 |
3.4M |
2,268 Kbit |
126 |
Design Considerations
Power Supply Requirements
Proper power sequencing and regulation ensure reliable operation:
- VCCINT (1.2V): Core logic supply – highest current requirement
- VCCAUX (2.5V): Auxiliary circuits and clock management
- VCCO (1.2V to 3.3V): I/O banks – voltage depends on I/O standards
Configuration Options
The device supports multiple configuration modes:
- Master Serial configuration
- Slave Serial configuration
- JTAG boundary scan
- SelectMAP parallel configuration
Why Choose XC3SD3400A-4CSG484C?
Competitive Advantages
- Cost-Effective Performance: Optimal price-to-performance ratio for high-volume production
- Proven Technology: 90nm process with extensive field deployment history
- Rich Feature Set: DSP slices, abundant memory, flexible I/O
- Broad Ecosystem: Mature development tools and IP libraries
- Scalability: Pin-compatible family members for design migration
Long-Term Reliability
AMD (Xilinx) products are known for:
- Extensive qualification testing
- High mean time between failures (MTBF)
- Automotive-grade options available
- Comprehensive technical support
Getting Started with XC3SD3400A-4CSG484C
Design Flow Overview
- Requirements Analysis: Define system specifications and constraints
- Architecture Design: Partition functionality between hardware and software
- HDL Coding: Implement logic in VHDL or Verilog
- Simulation: Verify functionality using testbenches
- Synthesis: Convert HDL to gate-level netlist
- Implementation: Place and route design
- Timing Analysis: Verify timing closure
- Bitstream Generation: Create programming file
- Testing: Validate on actual hardware
Best Practices
- Follow AMD design guidelines for optimal results
- Utilize IP cores to accelerate development
- Implement proper clock domain crossing techniques
- Consider power optimization from early design stages
- Plan for testability and debug access
Conclusion
The XC3SD3400A-4CSG484C stands as a versatile and powerful FPGA solution for modern digital design challenges. Whether you’re developing industrial control systems, communications equipment, consumer electronics, or automotive applications, this device provides the processing power, flexibility, and cost-effectiveness needed for successful product development.
With its combination of 3.4 million system gates, dedicated DSP resources, substantial embedded memory, and 309 user I/Os, the XC3SD3400A-4CSG484C delivers professional-grade performance in a compact 484-pin CSBGA package. Backed by AMD’s industry-leading development tools and extensive ecosystem support, this FPGA enables engineers to bring innovative designs to market efficiently and reliably.
For procurement inquiries, technical specifications, datasheets, and design support for the XC3SD3400A-4CSG484C, contact authorized AMD distributors or visit the official AMD documentation portal.