The XC2C256-7FTG256C is a high-performance Complex Programmable Logic Device (CPLD) from the renowned Xilinx CoolRunner-II family. This advanced semiconductor device combines exceptional processing capabilities with industry-leading power efficiency, making it an ideal choice for engineers designing portable electronics, communication systems, and industrial control applications. Furthermore, the XC2C256-7FTG256C delivers reliable performance in a compact 256-pin FTBGA package.
XC2C256-7FTG256C Key Specifications
The following table provides essential technical specifications for the XC2C256-7FTG256C CPLD device:
| Parameter |
Value |
| Manufacturer |
AMD (formerly Xilinx) |
| Part Number |
XC2C256-7FTG256C |
| Family |
CoolRunner-II |
| Device Type |
CPLD (Complex Programmable Logic Device) |
| Number of Macrocells |
256 |
| System Gates |
6,000 (6K) |
| Maximum User I/O |
184 |
| Operating Frequency |
152 MHz / 256 MHz |
| Core Voltage (VCC) |
1.8V (1.7V – 1.9V) |
| Process Technology |
0.18µm CMOS |
| Package Type |
256-FTBGA (Fine-Pitch Thin Ball Grid Array) |
| Package Dimensions |
17mm × 17mm |
| Pin Pitch |
1.0mm |
| Operating Temperature |
0°C to +70°C (Commercial Grade) |
| RoHS Status |
Compliant |
XC2C256-7FTG256C Electrical Characteristics
Understanding the electrical parameters of the XC2C256-7FTG256C is crucial for successful circuit design. The table below outlines the key electrical specifications:
| Electrical Parameter |
Min |
Typ |
Max |
Unit |
| Core Supply Voltage (VCC) |
1.7 |
1.8 |
1.9 |
V |
| I/O Supply Voltage (VCCIO) |
1.4 |
– |
3.6 |
V |
| JTAG Programming Voltage (VAUX) |
1.7 |
– |
3.6 |
V |
| Standby Current (ICCSB) |
– |
13 |
100 |
µA |
| Propagation Delay (Tpd) |
– |
5.7 |
– |
ns |
| Global Clock Setup Time |
– |
2.4 |
– |
ns |
CoolRunner-II XC2C256-7FTG256C Features and Benefits
The XC2C256-7FTG256C incorporates several advanced features that set it apart from competing CPLD solutions. As a result, engineers can achieve optimal performance while maintaining minimal power consumption.
Ultra-Low Power Consumption
One of the most significant advantages of the XC2C256-7FTG256C is its exceptional power efficiency. The device utilizes Xilinx’s proprietary Fast Zero Power (FZP) technology, which significantly reduces both static and dynamic power consumption. Consequently, this makes the XC2C256-7FTG256C perfect for battery-powered applications where energy efficiency is paramount.
Advanced I/O Banking Technology
The XC2C256-7FTG256C features two independent I/O banks that support multi-voltage interfacing. Therefore, designers can easily connect to devices operating at different voltage levels:
| I/O Voltage Level |
Standard Supported |
| 3.3V |
LVCMOS33, LVTTL |
| 2.5V |
LVCMOS25 |
| 1.8V |
LVCMOS18 |
| 1.5V |
LVCMOS15 (with Schmitt-trigger inputs) |
DataGATE Technology for Power Management
Additionally, the XC2C256-7FTG256C incorporates DataGATE technology, which allows designers to block input signals when not needed. This feature prevents unnecessary switching activity and further reduces power consumption in standby modes.
CoolCLOCK Technology
The CoolCLOCK feature combines clock gating with a clock divider, enabling dynamic power reduction during operation. As a result, the XC2C256-7FTG256C achieves an ultra-low power of just 28.8µW in certain operating conditions.
XC2C256-7FTG256C Architecture Overview
The internal architecture of the XC2C256-7FTG256C consists of several key components that work together to deliver high-performance programmable logic functionality.
Function Block Structure
The XC2C256-7FTG256C contains eight Function Blocks interconnected through a low-power Advanced Interconnect Matrix (AIM). Each Function Block includes:
| Component |
Specification |
| PLA Configuration |
40 × 56 Product Term Array |
| Macrocells per Function Block |
16 |
| Product Terms per Macrocell |
56 |
| Global Clocks |
3 |
| Product Term Clocks per FB |
16 |
| AIM Inputs |
40 (true and complement) |
Clock Resources
The XC2C256-7FTG256C provides comprehensive clocking options to accommodate various design requirements:
| Clock Feature |
Capability |
| Global Clock Networks |
3 |
| Product Term Clocks |
16 per Function Block |
| Clock Division |
Supported via CoolCLOCK |
| Clock Gating |
Integrated |
XC2C256-7FTG256C Package Information
The 256-FTBGA package offers excellent thermal performance and reliable soldering characteristics. Below are the detailed package specifications:
| Package Attribute |
Specification |
| Package Code |
FTG256 |
| Package Type |
Fine-Pitch Thin Ball Grid Array |
| Total Pins |
256 |
| Ball Pitch |
1.0mm |
| Package Length |
17mm |
| Package Width |
17mm |
| Package Height |
1.0mm |
| Seated Plane Height |
1.4mm |
| Mounting Type |
Surface Mount |
| JEDEC Standard |
MS-034AAF-1 |
| MSL Rating |
MSL 3 – 168 hours |
XC2C256-7FTG256C Applications
Due to its unique combination of high performance and low power consumption, the XC2C256-7FTG256C is well-suited for numerous applications:
Consumer Electronics
- Portable handheld devices
- Smart home controllers
- Wearable technology
Industrial Applications
- Remote monitoring systems
- Industrial automation controllers
- Sensor interface modules
Communications
- Wireless interface modules
- Protocol bridging
- High-speed data routing
Automotive
- Vehicle diagnostics
- Dashboard electronics
- Infotainment systems
For more programmable logic solutions, explore our complete Xilinx FPGA product catalog.
XC2C256-7FTG256C I/O Standards Compatibility
The XC2C256-7FTG256C supports a wide range of I/O interface standards, ensuring seamless integration with various system components:
| Interface Standard |
Output Drive Voltage |
| LVTTL |
3.3V |
| LVCMOS33 |
3.3V |
| LVCMOS25 |
2.5V |
| LVCMOS18 |
1.8V |
| LVCMOS15 |
1.5V |
| HSTL |
Variable |
| SSTL |
Variable |
XC2C256-7FTG256C Development Tools
Engineers working with the XC2C256-7FTG256C have access to comprehensive development resources:
Software Tools
- Xilinx ISE Design Suite
- Vivado Design Suite (for newer designs)
- WebPACK (free download available)
Development Boards
- CoolRunner-II CPLD Starter Board
- Compatible evaluation platforms with Pmod connectivity
Documentation Resources
- Complete datasheet in PDF format
- Application notes and design guides
- Reference designs and example projects
XC2C256-7FTG256C Ordering Information
The following table shows the part number breakdown for the XC2C256-7FTG256C:
| Part Number Segment |
Meaning |
| XC2C |
CoolRunner-II Family |
| 256 |
256 Macrocells |
| -7 |
Speed Grade (-7 = Commercial) |
| FT |
Fine-pitch Thin BGA |
| G |
Lead-Free (Green) |
| 256 |
256-Pin Package |
| C |
Commercial Temperature (0°C to +70°C) |
Related Part Numbers
| Part Number |
Package |
Temperature Grade |
| XC2C256-7FTG256C |
256-FTBGA |
Commercial |
| XC2C256-7FTG256I |
256-FTBGA |
Industrial |
| XC2C256-7TQ144C |
144-TQFP |
Commercial |
| XC2C256-7PQ208C |
208-PQFP |
Commercial |
| XC2C256-7CP132C |
132-CSBGA |
Commercial |
XC2C256-7FTG256C Quality and Compliance
The XC2C256-7FTG256C meets stringent quality and environmental standards:
| Compliance Standard |
Status |
| RoHS |
Compliant |
| REACH |
Compliant |
| Lead-Free |
Yes (Pb-free) |
| Moisture Sensitivity |
MSL 3 |
| ESD Protection |
Built-in |
Why Choose the XC2C256-7FTG256C?
In conclusion, the XC2C256-7FTG256C offers an exceptional balance of performance, power efficiency, and flexibility. With its 256 macrocells, 6K system gates, and ultra-low power consumption, this CoolRunner-II CPLD is an excellent choice for both high-performance and battery-powered applications. Moreover, the multi-voltage I/O support and comprehensive development tool ecosystem make the XC2C256-7FTG256C a versatile solution for modern electronic designs.
