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Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC3SD3400A-4CSG484LI: High-Performance Spartan-3A DSP FPGA for Advanced Digital Signal Processing Applications

Product Details

Product Overview: XC3SD3400A-4CSG484LI FPGA Solutions

The XC3SD3400A-4CSG484LI is a cutting-edge Field Programmable Gate Array (FPGA) from AMD Xilinx’s Spartan-3A DSP family, designed to deliver exceptional performance in cost-sensitive, high-volume digital signal processing applications. This advanced FPGA combines 3.4 million system gates with 53,712 logic cells, making it an ideal solution for engineers seeking powerful programmable logic capabilities without compromising on budget constraints.

As part of AMD’s renowned Xilinx FPGA product line, this device represents the perfect balance between performance, flexibility, and affordability for modern embedded systems.


Key Technical Specifications

Core FPGA Characteristics

Specification Details
Part Number XC3SD3400A-4CSG484LI
Manufacturer AMD Xilinx (formerly Xilinx Inc.)
Product Family Spartan-3A DSP FPGA
System Gates 3.4 Million
Logic Cells 53,712 Cells
Process Technology 90nm CMOS
Operating Voltage 1.2V Core Voltage
Speed Grade -4 (Standard Performance)
Package Type 484-Pin CSBGA (Chip Scale Ball Grid Array)
Temperature Range Industrial (-40°C to +100°C)
Lead Status Lead (Pb)-Free, RoHS Compliant

Performance Metrics

Parameter Specification
Maximum Clock Frequency 667MHz
I/O Pins 309 User I/O
DSP Slices Enhanced XtremeDSP DSP48A Slices
Block RAM Distributed and Dedicated Block RAM
Configuration Options JTAG, Master/Slave Serial, SPI
Power Consumption Optimized for Low-Power Applications

XC3SD3400A-4CSG484LI Features and Capabilities

Advanced DSP Architecture

The XC3SD3400A-4CSG484LI incorporates AMD Xilinx’s XtremeDSP technology, featuring dedicated DSP48A slices that enable:

  • High-performance multiply-accumulate operations
  • 18-bit x 18-bit multipliers with 48-bit accumulator
  • Efficient implementation of FIR filters, FFTs, and digital filters
  • Reduced logic resource consumption for DSP functions
  • Enhanced signal processing throughput

Memory Resources

Memory Type Capacity Description
Distributed RAM Configurable Implemented using CLB LUTs
Block RAM Multiple 18Kb blocks Dedicated dual-port RAM blocks
Total Memory High-density storage Optimized for data buffering and storage

Configurable Logic Blocks (CLBs)

The FPGA features flexible CLBs containing:

  • 4-input Look-Up Tables (LUTs) for logic implementation
  • Dedicated flip-flops for sequential logic
  • Fast carry logic for arithmetic operations
  • Distributed RAM and shift register capabilities
  • Optimized routing resources

Clock Management

Advanced clock management features include:

  • Digital Clock Manager (DCM) for frequency synthesis
  • Clock de-skew and phase shifting
  • Programmable clock division and multiplication
  • Multiple clock domains support
  • Low-jitter clock distribution network

XC3SD3400A-4CSG484LI Applications

Industrial Automation and Control

The XC3SD3400A-4CSG484LI excels in industrial environments:

  • Motor control systems with precise PWM generation
  • Real-time data acquisition and processing
  • Machine vision and image processing
  • Industrial communication protocols (EtherCAT, PROFINET)
  • Sensor interfacing and signal conditioning

Communications and Networking

Ideal for telecommunications infrastructure:

  • Software-defined radio (SDR) implementations
  • Digital signal processing for wireless systems
  • Protocol conversion and packet processing
  • Baseband processing for 4G/5G applications
  • Network traffic analysis and filtering

Consumer Electronics

Perfect for multimedia and consumer products:

  • High-definition video processing and encoding
  • Audio signal processing and enhancement
  • Display controller implementations
  • Camera interface and image processing
  • Gaming and entertainment systems

Medical Devices

Suitable for medical imaging and diagnostics:

  • Ultrasound signal processing
  • Medical imaging algorithms
  • Patient monitoring systems
  • Diagnostic equipment interfaces
  • Real-time data analysis

Automotive Electronics

Automotive-grade applications include:

  • Advanced Driver Assistance Systems (ADAS)
  • In-vehicle infotainment systems
  • Camera and sensor fusion
  • CAN/LIN bus interfaces
  • Dashboard display controllers

Development and Design Resources

Software and Tools

Tool Purpose
Vivado Design Suite Comprehensive FPGA design environment
ISE Design Suite Legacy design tool (supported)
ChipScope Pro Integrated logic analyzer
EDK/SDK Embedded development kit
IP Core Library Pre-verified IP cores

Programming and Configuration

The XC3SD3400A-4CSG484LI supports multiple configuration modes:

  • JTAG Configuration: Direct programming via JTAG interface
  • Master Serial Mode: FPGA controls configuration PROM
  • Slave Serial Mode: External controller manages configuration
  • Master SPI Mode: Serial Peripheral Interface configuration
  • BPI Mode: Byte Peripheral Interface for fast configuration

Package and Pin Configuration

484-CSBGA Package Details

Package Feature Specification
Pin Count 484 Pins
Package Type Chip Scale Ball Grid Array (CSBGA)
Ball Pitch 1.0mm
Package Size 23mm x 23mm
Height Low-profile design
Thermal Performance Enhanced thermal dissipation

Pin Distribution

  • User I/O: 309 configurable I/O pins
  • Power Pins: Multiple VCCINT, VCCAUX, and VCCO pins
  • Ground Pins: Extensive ground plane for noise reduction
  • Configuration Pins: JTAG and programming interface pins
  • Special Function Pins: Clock inputs, reset, and control signals

Electrical Characteristics

Operating Conditions

Parameter Min Typ Max Unit
Core Voltage (VCCINT) 1.14 1.2 1.26 V
Auxiliary Voltage (VCCAUX) 2.375 2.5 2.625 V
I/O Voltage (VCCO) 1.2 3.3 V
Junction Temperature -40 +100 °C

Power Consumption

The XC3SD3400A-4CSG484LI features optimized power consumption:

  • Static power: Low quiescent current
  • Dynamic power: Depends on design utilization
  • Power management: Multiple power domains
  • Sleep modes: Reduced power states available

Ordering Information and Availability

Part Number Breakdown

XC3SD3400A-4CSG484LI decodes as:

  • XC3S: Spartan-3 Family
  • D3400A: DSP variant with 3.4M gates
  • -4: Speed grade (standard performance)
  • CSG484: 484-pin CSBGA package
  • L: Lead-free (RoHS compliant)
  • I: Industrial temperature range

Package Options

Package Code Description Pin Count
CSG484 Chip Scale BGA 484
FG676 Fine-Pitch BGA 676 (alternate)

Competitive Advantages

Why Choose XC3SD3400A-4CSG484LI?

Cost-Effective Performance

  • Optimal price-to-performance ratio for DSP applications
  • Lower total system cost compared to ASIC solutions
  • Reduced bill of materials through integration

Design Flexibility

  • Reprogrammable architecture allows design iterations
  • In-field updates and feature enhancements possible
  • Quick time-to-market compared to custom silicon

Proven Technology

  • Based on mature 90nm process technology
  • Extensive design ecosystem and support
  • Large installed base with proven reliability

Enhanced DSP Capabilities

  • Dedicated DSP slices reduce logic consumption
  • Higher performance for signal processing algorithms
  • Efficient implementation of complex mathematical operations

Design Considerations

PCB Layout Recommendations

When designing with the XC3SD3400A-4CSG484LI:

  1. Power Supply Decoupling: Place multiple decoupling capacitors close to power pins
  2. Thermal Management: Ensure adequate cooling for high-utilization designs
  3. Signal Integrity: Use controlled impedance traces for high-speed signals
  4. Ground Plane: Implement solid ground plane for noise reduction
  5. Configuration Circuit: Follow reference design for configuration interface

Best Practices

  • Clock Distribution: Use dedicated clock resources for timing-critical paths
  • I/O Banking: Group I/O pins by voltage standard
  • Constraint Files: Implement comprehensive timing constraints
  • Simulation: Thoroughly simulate design before hardware implementation
  • Power Estimation: Use Xilinx Power Estimator (XPE) for power analysis

Comparison with Similar Products

Spartan-3A DSP Family Comparison

Device System Gates Logic Cells User I/O DSP Slices
XC3SD1800A 1.8M 37,440 519 84
XC3SD3400A 3.4M 53,712 309-519 126

Migration Path

The XC3SD3400A-4CSG484LI offers seamless migration options:

  • Scalability: Pin-compatible with other Spartan-3A DSP devices
  • Upward Migration: Move to larger density devices with minimal redesign
  • Downward Migration: Cost-optimize by moving to smaller devices

Quality and Reliability

Manufacturing Standards

  • ISO 9001 Certified: Quality management system compliance
  • Automotive Grade: AEC-Q100 qualified variants available
  • RoHS Compliant: Lead-free and environmentally friendly
  • REACH Compliant: Meets European chemical regulations

Reliability Metrics

Metric Specification
MTBF >1,000,000 hours
ESD Protection Human Body Model (HBM) compliant
Latch-up Immunity JEDEC standard compliant
Operating Life 20+ years at rated conditions

Support and Documentation

Available Resources

  • Product Datasheet: Comprehensive technical specifications
  • User Guides: Design and implementation guidelines
  • Application Notes: Specific application examples
  • Reference Designs: Proven design starting points
  • Community Forums: Technical support and discussions
  • Training Materials: Video tutorials and webinars

Technical Support

AMD Xilinx provides comprehensive support:

  • Online knowledge base and FAQs
  • Technical support hotline
  • Field Application Engineers (FAE)
  • Design consultation services
  • Training and workshops

Conclusion: XC3SD3400A-4CSG484LI for Your Next Project

The XC3SD3400A-4CSG484LI represents an excellent choice for engineers developing cost-sensitive, high-performance digital signal processing applications. With its robust feature set, proven reliability, and comprehensive development ecosystem, this FPGA delivers exceptional value for industrial, communications, consumer, medical, and automotive applications.

Whether you’re implementing complex DSP algorithms, building advanced control systems, or developing next-generation embedded products, the XC3SD3400A-4CSG484LI provides the flexibility, performance, and reliability your project demands.

Ready to Get Started?

Contact authorized distributors for pricing, availability, and technical support. Download the complete datasheet and design resources to begin your development today.


Frequently Asked Questions (FAQ)

Q: What development tools are required for the XC3SD3400A-4CSG484LI? A: The Vivado Design Suite or ISE Design Suite from AMD Xilinx are the primary development environments.

Q: Can this FPGA be used in automotive applications? A: Yes, automotive-grade versions are available with AEC-Q100 qualification.

Q: What is the difference between speed grades? A: Speed grade -4 is standard performance, while -5 offers higher maximum clock frequencies.

Q: How many DSP slices does this device contain? A: The XC3SD3400A contains 126 dedicated DSP48A slices for high-performance signal processing.

Q: Is in-system programming supported? A: Yes, through JTAG and various serial configuration modes.

Q: What external memory interfaces are supported? A: DDR2, DDR3, QDR2 SRAM, and other standard memory interfaces can be implemented.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.