Contact Sales & After-Sales Service

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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

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XC3SD3400A-4FG676I: High-Performance Spartan-3A DSP FPGA for Advanced Digital Signal Processing Applications

Product Details

Overview of the XC3SD3400A-4FG676I FPGA

The XC3SD3400A-4FG676I is an advanced Field Programmable Gate Array (FPGA) from AMD Xilinx’s renowned Spartan-3A DSP family. This powerful programmable logic device delivers exceptional DSP performance with 3.4 million system gates and 53,712 logic cells, making it the ideal solution for cost-sensitive, high-performance digital signal processing applications.

Engineered with cutting-edge 90nm process technology, this Xilinx FPGA combines superior functionality, enhanced memory architecture, and dedicated DSP resources to meet the demanding requirements of modern embedded systems.


Key Technical Specifications

Core Architecture and Performance

Specification Details
Part Number XC3SD3400A-4FG676I
Family Spartan-3A DSP
System Gates 3.4 Million
Logic Cells 53,712
Configurable Logic Blocks (CLBs) 5,968
Maximum Operating Frequency 667 MHz
DSP48A Slices 126 XtremeDSP slices
Speed Grade -4 (250 MHz block RAM/DSP)
Process Technology 90nm CMOS
Operating Voltage 1.2V core

Memory Configuration

Memory Type Capacity
Block RAM 2,322,432 bits (2.27 Mbit)
Distributed RAM Available in CLBs
Total I/O Pins 469 user I/Os

Package Information

Package Details Specification
Package Type FBGA (Fine Pitch Ball Grid Array)
Pin Count 676 pins
Package Dimensions 27mm x 27mm
Ball Pitch 1.0mm
Temperature Range Industrial (-40°C to +100°C)

Advanced Features and Capabilities

XtremeDSP DSP48A Slices

The XC3SD3400A-4FG676I features 126 dedicated XtremeDSP DSP48A slices, providing high-performance arithmetic processing capabilities. These enhanced DSP blocks offer:

  • 18×18-bit multipliers for efficient multiplication operations
  • Pre-adder for implementing multiply-accumulate (MAC) functions
  • 48-bit accumulator for extended precision calculations
  • Pattern detector for convergent rounding and overflow detection
  • Operating frequency of 250 MHz in standard -4 speed grade

Enhanced Block RAM Architecture

The device incorporates enhanced block RAM with additional output registers, delivering:

  • Dual-port RAM configurations for simultaneous read/write operations
  • True dual-port mode supporting independent read and write operations
  • FIFO implementation capabilities for data buffering
  • 250 MHz operation in -4 speed grade
  • Flexible memory configurations from 18Kb to 256 bits wide

Advanced Configuration Options

  • Multiple configuration modes including Master/Slave Serial, SelectMAP, and JTAG
  • Boundary-scan test capabilities for manufacturing and field testing
  • IEEE 1149.1 (JTAG) compliant boundary-scan architecture
  • Configuration memory encryption for IP security
  • Bitstream compression to reduce configuration time

Primary Application Areas

Digital Signal Processing Applications

The XC3SD3400A-4FG676I excels in DSP-intensive applications requiring high computational throughput:

  • Software-Defined Radio (SDR) systems
  • Digital filtering and signal conditioning
  • Fast Fourier Transform (FFT) implementations
  • Audio and speech processing
  • Adaptive filtering and equalization

Communications and Networking

Ideal for modern communication infrastructure:

  • Broadband access equipment and modems
  • Home networking routers and gateways
  • Protocol conversion and packet processing
  • Wireless base station signal processing
  • Ethernet switching and routing

Consumer Electronics

Perfect for high-volume consumer products:

  • Digital television receivers and set-top boxes
  • Display and projection systems
  • High-definition video processing
  • Gaming consoles and multimedia devices
  • Audio/video receivers with advanced processing

Industrial and Automotive Systems

Robust performance for demanding environments:

  • Motor control and drive systems
  • Industrial automation controllers
  • Automotive infotainment systems
  • Advanced driver assistance systems (ADAS)
  • Machine vision and inspection systems

Performance Advantages Over Standard FPGAs

Superior DSP Performance

Feature XC3SD3400A-4FG676I Advantage
DSP Slices 126 dedicated DSP48A blocks vs. simple multipliers
Memory/Logic Ratio Optimized for DSP with enhanced block RAM
MAC Performance Up to 31.5 GMAC/s at 250 MHz
Power Efficiency 90nm technology reduces power consumption
Cost Efficiency Superior performance per dollar ratio

Development and Design Benefits

  • ISE Design Suite compatibility for comprehensive development tools
  • Extensive IP core library for rapid prototyping
  • ChipScope Pro integration for real-time debugging
  • Proven 90nm technology with high reliability
  • Pin-compatible with other Spartan-3A DSP devices

Design Considerations and Best Practices

Power Management

The XC3SD3400A-4FG676I supports advanced power management features:

  • Static power optimization through unused block shutdown
  • Dynamic frequency scaling for adaptive power control
  • Multiple voltage domains for flexible power distribution
  • Low-power modes during idle periods

Thermal Management

Thermal Specification Value
Junction Temperature Range -40°C to +100°C
Thermal Resistance (θJA) Device-specific (refer to thermal guide)
Recommended Operating Range 0°C to +85°C for commercial applications

Clock Management Resources

  • Digital Clock Managers (DCMs) for frequency synthesis and phase management
  • Up to 8 DCMs per device
  • Clock frequency synthesis from 5 MHz to 400+ MHz
  • Phase shifting and duty-cycle correction
  • Clock domain crossing support

Comparison with Alternative FPGA Solutions

XC3SD3400A vs. Standard Spartan-3A

Feature XC3SD3400A-4FG676I Standard Spartan-3A
DSP Resources 126 DSP48A slices 18×18 multipliers only
Block RAM Enhanced with output registers Standard block RAM
DSP Performance 250 MHz operation Lower frequency operation
Memory/Logic Ratio Optimized for DSP General purpose ratio
Target Applications DSP-intensive General programmable logic

Spartan-3A DSP vs. Competing FPGAs

The XC3SD3400A-4FG676I offers distinct advantages:

  • Higher DSP density compared to general-purpose FPGAs
  • Better price/performance ratio for DSP applications
  • Proven technology with extensive design support
  • Lower power consumption than comparable devices
  • Comprehensive tool support and IP library

Development Tools and Resources

Xilinx ISE Design Suite

Complete development environment supporting:

  • Synthesis and implementation for FPGA design
  • Simulation tools for functional verification
  • Timing analysis and constraint management
  • Power analysis and optimization
  • IP catalog with pre-verified cores

ChipScope Pro Debugging

Real-time hardware debugging capabilities:

  • Logic analyzer functionality
  • Virtual I/O for real-time parameter adjustment
  • Integrated bus analyzer for protocol debugging
  • Trigger capabilities for event capture

Popular Development Boards

Compatible evaluation platforms include:

  • Nexys4 DDR FPGA trainer board
  • Basys 3 entry-level development board
  • Custom carrier boards for specific applications
  • Digilent Arty S7 for rapid prototyping

Ordering Information and Package Options

Part Number Breakdown

XC3SD3400A-4FG676I

  • XC3SD = Spartan-3A DSP family
  • 3400A = 3.4 million system gates
  • -4 = Speed grade (standard commercial)
  • FG676 = Fine-pitch BGA, 676 balls
  • I = Industrial temperature range (-40°C to +100°C)

Available Variants

Part Number Temperature Range Speed Grade
XC3SD3400A-4FG676C Commercial (0°C to +85°C) -4
XC3SD3400A-4FG676I Industrial (-40°C to +100°C) -4
XC3SD3400A-5FG676I Industrial (-40°C to +100°C) -5 (faster)

Quality and Reliability Standards

Industry Certifications

The XC3SD3400A-4FG676I meets stringent quality standards:

  • RoHS compliant for environmental safety
  • ISO 9001 certified manufacturing
  • Automotive-grade versions available (AEC-Q100)
  • Military/aerospace grades for critical applications

Reliability Metrics

  • MTBF (Mean Time Between Failures) exceeds industry standards
  • ESD protection on all I/O pins
  • Latch-up resistant design
  • Extended temperature testing for industrial variants

Technical Support and Documentation

Available Resources

  • Complete datasheets with electrical specifications
  • User guides for architecture and features
  • Application notes for specific design scenarios
  • Reference designs for common applications
  • Technical forum community support

Design Services

Professional support options include:

  • Design consultation for complex implementations
  • Custom IP development services
  • Training and workshops on FPGA design
  • Technical support via email and phone

Frequently Asked Questions

What makes the XC3SD3400A-4FG676I suitable for DSP applications?

The device features 126 dedicated XtremeDSP DSP48A slices optimized for multiply-accumulate operations, enhanced block RAM with 250 MHz performance, and a high memory-to-logic ratio specifically designed for signal processing workloads.

What is the difference between the -4 and -5 speed grades?

The -4 speed grade offers 250 MHz performance on DSP and block RAM resources, while the -5 speed grade provides higher maximum frequencies with correspondingly higher power consumption and cost.

Can this FPGA be used in automotive applications?

Yes, the industrial temperature range (-40°C to +100°C) makes it suitable for automotive environments. Automotive-grade versions meeting AEC-Q100 qualification are available for safety-critical applications.

What development tools are required?

The Xilinx ISE Design Suite (free WebPACK edition available) provides all necessary tools for design entry, synthesis, implementation, and programming of the XC3SD3400A-4FG676I.

How does this compare to newer FPGA families?

While newer families like Artix-7 offer more advanced features, the Spartan-3A DSP provides excellent value for cost-sensitive DSP applications with proven, reliable 90nm technology and comprehensive design resources.


Conclusion

The XC3SD3400A-4FG676I represents an optimal balance of performance, cost, and functionality for digital signal processing applications. With 3.4 million system gates, 126 XtremeDSP slices, and enhanced block RAM architecture, this Spartan-3A DSP FPGA delivers exceptional value for high-volume consumer electronics, communications equipment, and industrial systems.

Whether you’re developing next-generation consumer electronics, implementing complex DSP algorithms, or building industrial control systems, the XC3SD3400A-4FG676I provides the performance, flexibility, and cost-efficiency required for successful product development.

Ready to integrate the XC3SD3400A-4FG676I into your design? Contact authorized distributors for pricing, availability, and technical support to begin your development today.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.