Product Overview: AMD XC3SD1800A-4CS484I FPGA Solution
The XC3SD1800A-4CS484I is a powerful Field Programmable Gate Array (FPGA) from AMD’s renowned Spartan-3A DSP series. This advanced programmable logic device delivers exceptional performance for embedded applications, featuring 309 I/O pins in a compact 484-CSBGA package. Designed for engineers seeking reliable digital signal processing capabilities, this FPGA IC represents cutting-edge technology in reconfigurable computing.
Key Specifications Table
| Specification |
Details |
| Manufacturer |
AMD (Xilinx) |
| Part Number |
XC3SD1800A-4CS484I |
| Series |
Spartan-3A DSP |
| Package Type |
484-FBGA, CSPBGA |
| Number of I/O |
309 |
| Logic Elements/Cells |
37,440 |
| Total RAM Bits |
1,548,288 |
| Number of LABs/CLBs |
4,160 |
| Total Gates |
1,800,000 |
| Operating Temperature |
-40°C ~ 100°C (TJ) |
| Mounting Type |
Surface Mount |
Advanced FPGA Architecture and Logic Capabilities
Comprehensive Logic Resource Breakdown
The XC3SD1800A-4CS484I FPGA delivers substantial computational resources for complex digital designs:
| Resource Type |
Quantity |
Application Benefits |
| Logic Elements |
37,440 cells |
Supports complex state machines and control logic |
| Configurable Logic Blocks |
4,160 CLBs |
Enables parallel processing architectures |
| Total Logic Gates |
1,800,000 gates |
Accommodates large-scale system integration |
| Embedded RAM |
1,548,288 bits |
Sufficient for data buffering and local storage |
| DSP48A Slices |
Integrated |
Optimized for signal processing algorithms |
Memory and Storage Architecture
This Xilinx FPGA features extensive on-chip memory resources:
- Block RAM: Distributed throughout the device for flexible memory hierarchy
- RAM Configuration: Dual-port, single-port, and FIFO modes supported
- Memory Bandwidth: High-speed internal interconnect for low-latency access
- User-Configurable: Programmable memory depth and width ratios
Electrical Characteristics and Performance Parameters
Power Supply Requirements
| Parameter |
Specification |
| Core Voltage (VCCINT) |
1.2V typical |
| I/O Voltage (VCCO) |
Multiple standards supported |
| Auxiliary Voltage (VCCAUX) |
2.5V |
| Power Consumption |
Optimized for low-power applications |
Speed Grade and Timing Performance
The -4 speed grade designation indicates this device offers:
- Standard performance timing characteristics
- Balanced power consumption and speed
- Suitable for most embedded system applications
- Maximum operating frequencies up to 300+ MHz (design-dependent)
I/O Capabilities and Interface Standards
Versatile I/O Bank Configuration
With 309 user I/O pins, the XC3SD1800A-4CS484I supports:
- Multiple I/O standards (LVTTL, LVCMOS, LVDS, SSTL, HSTL)
- Programmable drive strength and slew rates
- Differential signaling support
- Hot-swappable I/O capability
Package and Pin Configuration
| Package Feature |
Specification |
| Package Type |
484-ball CSPBGA |
| Ball Pitch |
1.0mm |
| Package Dimensions |
23mm x 23mm |
| Total Balls |
484 |
| Thermal Performance |
Enhanced heat dissipation |
Target Applications and Use Cases
Industrial and Commercial Applications
This FPGA excels in diverse applications:
- Digital Signal Processing (DSP)
- Audio/video processing
- Communications systems
- Software-defined radio
- Embedded Control Systems
- Motor control algorithms
- Industrial automation
- Process control
- Data Acquisition Systems
- High-speed data capture
- Sensor interfacing
- Test equipment
- Communication Infrastructure
- Protocol conversion
- Network processing
- Telecommunications
Development Tools and Design Support
FPGA Design Software Compatibility
The XC3SD1800A-4CS484I is fully supported by AMD’s development ecosystem:
- Vivado Design Suite: Complete FPGA design flow
- ISE Design Suite: Legacy tool support
- IP Core Library: Pre-verified functional blocks
- Simulation Tools: ModelSim, VCS compatibility
Programming and Configuration Options
| Configuration Method |
Description |
| JTAG |
Industry-standard boundary scan |
| Master Serial |
Direct SPI flash programming |
| Slave Serial |
External processor configuration |
| Master SelectMAP |
Parallel configuration interface |
Product Status and Availability Information
Important Notice: The XC3SD1800A-4CS484I is currently listed as obsolete and is no longer in production by AMD. Design engineers should consider available substitutes for new projects.
Recommended Alternative Solutions
| Alternative Part |
Manufacturer |
Key Features |
| LFE3-35EA-6FN484I |
Lattice Semiconductor |
Similar I/O count, modern architecture |
| T55F484I4 |
Efinix, Inc. |
Quantum™ compute fabric, lower power |
Technical Documentation and Resources
Essential Design Resources
- Datasheet: Complete electrical specifications and AC/DC parameters
- User Guide: Detailed architecture reference
- Application Notes: Design implementation best practices
- PCB Layout Guidelines: Package-specific routing recommendations
Thermal Management Considerations
Operating across an extended temperature range (-40°C to +100°C junction temperature), proper thermal design is essential:
- Calculate power dissipation based on design utilization
- Implement adequate PCB copper planes
- Consider heatsink requirements for high-utilization designs
- Monitor junction temperature during operation
Design Considerations for FPGA Implementation
Resource Utilization Best Practices
When designing with this FPGA:
- Logic Optimization: Use synthesis tools to minimize resource usage
- Timing Closure: Account for routing delays in critical paths
- Power Management: Implement clock gating where appropriate
- I/O Planning: Pre-assign critical signals to optimal pins
Signal Integrity and PCB Layout
Critical layout considerations for the 484-CSBGA package:
- Decoupling Capacitors: Place multiple values close to power balls
- Power Plane Design: Separate analog and digital supplies
- Length Matching: Critical for high-speed differential pairs
- Via Management: Minimize vias in critical signal paths
Competitive Advantages of Spartan-3A DSP Architecture
DSP Processing Capabilities
The integrated DSP48A slices provide:
- 18×18 multipliers with accumulator
- Pre-adder for efficient filter implementations
- Cascade connections for multi-precision arithmetic
- Low-latency MAC (Multiply-Accumulate) operations
Cost-Effective System Integration
The Spartan-3A DSP family offers:
- Reduced external component count
- Lower total system cost
- Single-chip solution for complex algorithms
- Proven reliability in field deployments
Compliance and Quality Standards
Manufacturing and Reliability
- RoHS Compliant: Lead-free package available
- MSL Rating: Moisture sensitivity level classification
- Quality Assurance: Manufactured under ISO 9001 standards
- Reliability Testing: HTOL, temp cycling, and moisture resistance
Conclusion: Selecting the Right FPGA for Your Design
While the XC3SD1800A-4CS484I represents mature FPGA technology with proven performance, its obsolescence status necessitates careful evaluation for new designs. Engineers should assess current alternatives that offer:
- Enhanced performance per watt
- Improved tool support and IP availability
- Long-term product availability
- Better cost-performance ratios
For existing designs utilizing this device, consult with AMD or authorized distributors regarding last-time-buy opportunities and migration strategies to ensure continuity of supply for your production requirements.
