Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC3SD3400A-4CSG484I: High-Performance Spartan-3A DSP FPGA for Embedded Systems

Product Details

Complete Technical Overview and Specifications

The XC3SD3400A-4CSG484I from AMD (formerly Xilinx) represents a powerful solution in the Spartan-3A DSP family, delivering exceptional programmable logic capabilities for demanding digital signal processing applications. This advanced FPGA combines high gate density, integrated DSP blocks, and cost-effective architecture to meet the requirements of modern embedded systems.

Product Specifications at a Glance

Specification Details
Manufacturer AMD (Xilinx)
Part Number XC3SD3400A-4CSG484I
Product Family Spartan-3A DSP
System Gates 3.4 Million
Logic Cells 53,712
Package Type 484-Pin LCSBGA (CSPBGA)
Operating Temperature -40°C to +100°C (TJ)
Supply Voltage 1.14V ~ 1.26V (1.2V nominal)
Speed Grade -4 (Standard Performance)

Advanced Technical Features

Core Architecture Specifications

Feature Specification
Total RAM Bits 2,322,432 bits (283.5 kB)
Logic Blocks (LABs) 5,968
User I/O Pins 309
Maximum Frequency 667 MHz
Process Technology 90nm
DSP48A Slices Integrated XtremeDSP blocks
DCMs 8 Digital Clock Managers

Key Performance Advantages

The XC3SD3400A-4CSG484I FPGA delivers outstanding value for high-volume applications requiring sophisticated digital signal processing capabilities. Built on proven 90nm technology, this programmable logic device offers:

  • Enhanced DSP Performance: Integrated DSP48A slices provide dedicated multiply-accumulate functionality
  • Flexible Memory Architecture: Distributed RAM and block RAM resources totaling over 2.3 million bits
  • Cost-Effective Solution: Optimized for high-volume, cost-sensitive applications
  • Reliable Operation: Extended industrial temperature range from -40°C to +100°C

Package and Pin Configuration Details

Package Information Specification
Package Style LCSBGA / CSPBGA
Total Pins 484
Mounting Type Surface Mount
Pin Pitch Compatible with standard reflow soldering
ESD Protection Built-in ESD protection circuits

Primary Applications and Use Cases

Industrial and Embedded Systems

The XC3SD3400A-4CSG484I excels in applications requiring programmable logic with integrated DSP capabilities:

  • Digital Signal Processing: Audio/video processing, image enhancement, and filtering
  • Communications Equipment: Wireless infrastructure, software-defined radio, signal modulation
  • Industrial Automation: Motor control, sensor interfacing, real-time data acquisition
  • Consumer Electronics: Digital television (DTV), DVD players, multimedia devices
  • Medical Devices: Diagnostic equipment, imaging systems, patient monitoring
  • Automotive Systems: Advanced driver assistance systems (ADAS), infotainment platforms

Development and Configuration Support

Compatible Development Tools

  • Xilinx ISE Design Suite: Complete design environment for synthesis and implementation
  • Vivado Design Suite: Advanced development platform with enhanced productivity features
  • EDK/SDK: Embedded development kit for system-level design

Configuration Options

The device supports multiple configuration modes including:

  • Master Serial mode
  • Slave Serial mode
  • JTAG configuration
  • SPI Flash configuration

Technical Comparison: Speed Grade Options

Parameter -4 Speed Grade -5 Speed Grade
Performance Level Standard High Performance
Maximum Frequency 667 MHz 770 MHz
Temperature Range Commercial & Industrial Commercial Only
Power Consumption Lower Higher

Power Supply Requirements

Supply Rail Voltage Range Function
VCCINT 1.14V ~ 1.26V Core logic power
VCCAUX 2.5V or 3.3V Auxiliary circuits
VCCO 1.2V ~ 3.3V I/O bank power

Why Choose Xilinx FPGA Solutions?

AMD Xilinx FPGA technology provides unmatched flexibility and performance for embedded applications. The Spartan-3A DSP family specifically addresses the needs of DSP-intensive designs while maintaining cost effectiveness. This makes the XC3SD3400A-4CSG484I an ideal choice for production designs requiring programmable hardware acceleration.

Memory Architecture Overview

Memory Type Capacity Configuration
Block RAM 126 blocks Dual-port 18Kb blocks
Distributed RAM Flexible LUT-based memory
Total Memory 283.5 kB Combined resources

Quality and Reliability Standards

  • RoHS Compliant: Lead-free package options available
  • Manufacturing Quality: Rigorous testing and quality control procedures
  • Long-Term Availability: Supported by AMD’s product longevity program
  • ESD Rating: Meets or exceeds industry standards

Ordering Information and Part Number Breakdown

XC3SD3400A-4CSG484I Part Number Decoding:

  • XC3SD3400A: Device family and density (3.4M gates)
  • -4: Speed grade (standard performance)
  • CSG484: Package type (484-pin CSPBGA)
  • I: Industrial temperature range (-40°C to +100°C)

Thermal Characteristics

Parameter Value
Junction Temperature Range -40°C to +100°C
Ambient Operating Temperature 0°C to +70°C (C grade) / -40°C to +85°C (I grade)
Thermal Resistance Package dependent
Recommended Heat Sink Optional based on application

Getting Started with XC3SD3400A-4CSG484I

Development Resources

  1. Reference Designs: Pre-built designs accelerate development time
  2. IP Cores: Licensed and free IP available through Xilinx ecosystem
  3. Technical Documentation: Comprehensive datasheets and user guides
  4. Community Support: Active developer forums and technical assistance

Design Considerations

  • Ensure proper power supply sequencing and decoupling
  • Follow PCB layout guidelines for signal integrity
  • Implement proper thermal management for sustained operation
  • Utilize configuration memory protection features

Product Availability and Support

The XC3SD3400A-4CSG484I is available through authorized distributors worldwide. For volume pricing, custom programming services, and technical support, contact qualified semiconductor distributors or AMD directly.

Competitive Advantages Summary

✓ High gate density (3.4M system gates) for complex designs
✓ Integrated DSP blocks reduce external component count
✓ Cost-optimized for high-volume production
✓ Industrial temperature range for harsh environments
✓ Comprehensive development tool support
✓ Proven 90nm manufacturing process
✓ Extensive I/O flexibility (309 user I/Os)
✓ Large on-chip memory resources (283.5 kB)

Conclusion

The XC3SD3400A-4CSG484I Spartan-3A DSP FPGA delivers an optimal balance of performance, features, and cost-effectiveness for demanding embedded applications. With its robust architecture, extensive DSP capabilities, and flexible I/O configuration, this programmable logic device serves as an excellent foundation for next-generation digital systems requiring high-performance signal processing in a cost-conscious package.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.