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Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC18V512PCG20C: In-System Programmable Configuration PROM for FPGA Applications

Product Details

Overview of XC18V512PCG20C Configuration Memory

The XC18V512PCG20C is a high-performance in-system programmable configuration PROM manufactured by AMD Xilinx, specifically designed for FPGA configuration storage and programming. This 512-kilobit memory device operates within the 2.5V to 3.3V voltage range and comes in a compact 20-pin PLCC package, making it an ideal solution for embedded systems and programmable logic applications.

Key Features and Technical Specifications

Core Performance Characteristics

The XC18V512PCG20C configuration PROM delivers reliable performance for FPGA bitstream storage with the following specifications:

Specification Details
Memory Capacity 512 Kilobit (512Kb)
Supply Voltage 2.5V / 3.3V
Package Type 20-Pin PLCC (9x9mm)
Operating Temperature 0°C to 70°C (Commercial Grade)
Interface Type Parallel/Serial
Programmability In-System Programmable
Manufacturer AMD Xilinx

Advanced Programming Capabilities

This configuration PROM supports multiple programming modes, providing flexibility for various FPGA implementation scenarios. The device seamlessly integrates with Xilinx FPGA designs, offering both Master Serial and Slave Parallel configuration modes.

Application Modes and Configuration Options

Master Serial Mode Configuration

When operating in Master Serial mode, the FPGA generates the configuration clock that drives the XC18V512PCG20C PROM. After the chip enable and output enable signals are activated, configuration data becomes available on the DATA output pin, which connects directly to the FPGA’s data input pin. This mode simplifies system design by eliminating the need for external clock generation.

Slave Parallel and SelectMAP Mode

In Slave Parallel or Slave SelectMAP configurations, an external oscillator provides the configuration clock for both the PROM and FPGA. This mode enables faster configuration times and supports data transfer across multiple parallel data lines, making it suitable for applications requiring rapid system initialization.

Cascading Multiple Devices

The XC18V512PCG20C supports device cascading through its CEO (Chip Enable Output) signal, which can drive the CE (Chip Enable) input of subsequent PROMs. This feature allows designers to expand memory capacity beyond 512Kb for larger FPGA bitstreams without additional control logic.

Technical Advantages for FPGA Design

In-System Programmability Benefits

The in-system programmable nature of the XC18V512PCG20C eliminates the need for device removal during firmware updates. Engineers can reprogram configuration data while the device remains soldered to the PCB, significantly reducing maintenance costs and downtime in deployed systems.

Voltage Compatibility and Power Efficiency

Supporting both 2.5V and 3.3V operation, this configuration PROM offers excellent compatibility with various FPGA families and system architectures. The flexible voltage support enables power-optimized designs while maintaining reliable data retention and access performance.

Package and Pin Configuration Details

20-Pin PLCC Package Specifications

Package Feature Specification
Package Style Plastic Leaded Chip Carrier (PLCC)
Physical Dimensions 9mm x 9mm
Lead Type J-Lead
Pin Count 20 Pins
Mounting Type Surface Mount Technology (SMT)
Industry Standard JEDEC Compliant

The compact PLCC-20 footprint minimizes board space requirements while providing robust mechanical connections suitable for high-reliability applications.

Compatible FPGA Families and Integration

The XC18V512PCG20C configuration PROM maintains compatibility with various Xilinx FPGA families, including Spartan, Virtex, and other programmable logic devices requiring external configuration memory. The device integrates seamlessly with industry-standard FPGA development tools, including Xilinx Vivado Design Suite and ISE software.

Performance Specifications and Timing

Access Time and Clock Frequency

Performance Parameter Typical Value
Access Time Fast access after CE/OE enable
Configuration Clock FPGA-generated or external
Data Output Delay Minimal propagation delay
Power Consumption Low-power operation

Quality and Reliability Standards

Industrial Grade Specifications

The commercial temperature grade version operates reliably across the 0°C to 70°C range, making it suitable for standard industrial and commercial applications. The device employs proven PROM technology ensuring data retention and configuration reliability over extended operational periods.

RoHS Compliance Status

Verification of environmental compliance status is recommended through official AMD Xilinx documentation or authorized distributors to ensure adherence to current regulations and standards.

Design Implementation Guidelines

Integration with FPGA Development Workflow

Engineers implementing the XC18V512PCG20C should follow these design considerations:

  1. Configuration Mode Selection: Choose between Master Serial and Slave Parallel based on system clock requirements
  2. Power Supply Design: Ensure clean 2.5V or 3.3V supply with adequate decoupling capacitors
  3. Signal Routing: Maintain proper trace lengths between PROM and FPGA for timing integrity
  4. Programming Interface: Implement JTAG or dedicated programming connections for in-system updates

PCB Layout Recommendations

Optimal PCB design for the XC18V512PCG20C includes positioning the device close to the target FPGA, implementing proper ground planes, and using appropriate trace impedance for high-speed configuration signals.

Ordering Information and Part Number Breakdown

Part Number Nomenclature

The complete part number XC18V512PCG20C breaks down as follows:

Code Segment Meaning
XC18V Configuration PROM family identifier
512 Memory density (512 Kilobit)
P Plastic package
C Package pin count indicator
G Lead-free package option
20 Pin count (20 pins)
C Commercial temperature grade (0°C to 70°C)

Alternative Solutions and Cross-Reference

Engineers seeking alternatives may consider other memory densities within the XC18V family, including 1-megabit, 2-megabit, and 4-megabit options. Different package variants such as SOIC are also available for designs with specific form factor requirements.

Storage and Handling Requirements

Environmental Considerations

Proper storage conditions for the XC18V512PCG20C include moisture-sensitive device precautions, ESD-safe handling procedures, and temperature-controlled environments prior to PCB assembly. Following industry-standard MSL (Moisture Sensitivity Level) guidelines ensures optimal soldering results and long-term reliability.

Conclusion

The XC18V512PCG20C represents a proven configuration memory solution for FPGA-based designs requiring reliable, reprogrammable bitstream storage. Its combination of in-system programmability, flexible voltage operation, compact packaging, and industry-standard interfaces makes it an excellent choice for embedded systems, telecommunications equipment, industrial automation, and other applications utilizing programmable logic devices.

For detailed technical specifications, timing diagrams, and application notes, designers should reference the official AMD Xilinx datasheet and integration guides to ensure optimal implementation in their specific applications.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.