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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XCF02SVOG20C: Platform Flash Configuration PROM for Xilinx FPGA – Complete Technical Guide

Product Details

What is XCF02SVOG20C?

The XCF02SVOG20C is a high-performance Platform Flash in-system programmable configuration PROM manufactured by AMD (formerly Xilinx). This 2Mb serial configuration memory device provides reliable, cost-effective storage solutions for Xilinx FPGA bitstreams, enabling seamless FPGA configuration in embedded systems and industrial applications.

Key Features and Specifications

Core Technical Specifications

Parameter Specification
Memory Density 2 Megabits (Mb)
Supply Voltage (VCCINT) 3.3V
I/O Voltage Range (VCCO) 1.8V to 3.3V (input), 2.5V to 3.3V (output)
Operating Temperature -40°C to +85°C (Industrial Grade)
Package Type 20-Pin TSSOP (Thin Shrink Small Outline Package)
Package Dimensions 0.173″ (4.40mm) Width
Mounting Type Surface Mount Technology (SMT)
Manufacturer AMD (formerly Xilinx Inc.)

Advanced Performance Characteristics

The XCF02SVOG20C configuration memory offers exceptional reliability and performance for FPGA configuration applications:

  • In-System Programmability: JTAG-based programming enables field updates without board removal
  • Serial Configuration Support: Compatible with Master Serial and Slave Serial modes
  • Fast Configuration: Efficient bitstream loading for rapid system startup
  • Non-Volatile Storage: Retains configuration data without power
  • RoHS Compliant: Lead-free packaging meets environmental standards

Technical Comparison Table

Platform Flash PROM Series Comparison

Device Density VCCINT VCCO Range Package Options Serial Config Parallel Config Design Revisioning
XCF01S 1Mb 3.3V 1.8V – 3.3V VO20/VOG20
XCF02S 2Mb 3.3V 1.8V – 3.3V VO20/VOG20
XCF04S 4Mb 3.3V 1.8V – 3.3V VO20/VOG20
XCF08P 8Mb 1.8V 1.8V – 3.3V VO48/VOG48/FS48
XCF16P 16Mb 1.8V 1.8V – 3.3V VO48/VOG48/FS48
XCF32P 32Mb 1.8V 1.8V – 3.3V VO48/VOG48/FS48

Applications and Use Cases

Primary Application Areas

Industrial Automation Systems: The XCF02SVOG20C provides reliable configuration storage for FPGA-based control systems in manufacturing, process control, and automation equipment.

Telecommunications Equipment: Ensures consistent FPGA configuration in networking hardware, base stations, and communication infrastructure.

Medical Devices: Offers dependable configuration memory for FDA-compliant medical instrumentation requiring stable, non-volatile storage.

Aerospace and Defense: Industrial temperature range and robust performance make it suitable for mission-critical applications.

Embedded Systems: Ideal for IoT devices, smart sensors, and edge computing platforms requiring compact configuration solutions.

Pin Configuration and Interface

TSSOP-20 Package Layout

The 20-pin TSSOP package provides a compact footprint while maintaining robust electrical characteristics:

  • JTAG Programming Interface: TDI, TDO, TCK, TMS pins for in-system programming
  • Serial Configuration Pins: CCLK, DIN, DOUT for FPGA interface
  • Power Pins: VCC (3.3V supply), GND (ground reference)
  • Control Signals: CEO (Chip Enable Output), OE (Output Enable)

Configuration Modes Supported

Serial Configuration Options

Master Serial Mode: The XCF02SVOG20C controls the configuration process, generating the clock signal and sending configuration data to the FPGA.

Slave Serial Mode: The FPGA generates the clock signal while the PROM provides configuration data serially.

Both modes ensure reliable bitstream loading with minimal external components required.

Programming and Development

In-System Programming via JTAG

The XCF02SVOG20C supports JTAG boundary-scan programming, allowing:

  • Field Updates: Reprogram configuration without physical access to the device
  • Rapid Prototyping: Update bitstreams during development and testing
  • Production Programming: Efficient manufacturing flow with automated programming
  • Remote Updates: Enable firmware updates in deployed systems

Compatible Development Tools

  • Xilinx Vivado Design Suite
  • ISE Design Tools (legacy support)
  • JTAG programming cables and adapters
  • Third-party programming solutions

Electrical Specifications

Power Consumption Characteristics

Parameter Typical Maximum Unit
Active Current (Read) 20 40 mA
Standby Current 50 100 μA
Programming Current 30 50 mA

Timing Parameters

  • Programming Time: Approximately 20-30 seconds for full 2Mb
  • Configuration Clock Frequency: Up to 33 MHz
  • Access Time: Fast read performance for rapid FPGA configuration

Package and Ordering Information

Part Number Breakdown

XCF02S-VO-G20C

  • XCF: Platform Flash PROM family
  • 02: 2 Megabit density
  • S: 3.3V VCCINT version
  • VO: Package type identifier
  • G: Green/RoHS compliant
  • 20: Pin count
  • C: Commercial temperature grade (-40°C to +85°C)

Environmental Compliance

  • RoHS Compliant: Lead-free package meets EU directives
  • Halogen-Free Option: Available for environmentally sensitive applications
  • MSL Rating: Moisture Sensitivity Level 3 (168 hours at 30°C/60% RH)

Design Considerations

PCB Layout Recommendations

Decoupling Capacitors: Place 0.1μF ceramic capacitors close to each VCC pin for optimal noise filtering and stable operation.

Trace Routing: Keep JTAG and configuration signal traces short and away from high-speed signals to minimize crosstalk and interference.

Ground Plane: Implement solid ground plane beneath the PROM for improved signal integrity and thermal performance.

Programming Header: Include JTAG programming header for convenient in-circuit programming during development and production.

Quality and Reliability

Manufacturing Standards

The XCF02SVOG20C undergoes rigorous quality control testing:

  • 100% Functional Testing: Every device tested before shipment
  • Temperature Cycling: Validated for industrial temperature extremes
  • ESD Protection: Built-in protection circuits for handling robustness
  • Long-Term Reliability: Designed for 20+ year data retention

Industry Certifications

  • ISO 9001 manufacturing facilities
  • Automotive-grade options available (AEC-Q100)
  • REACH compliant materials

Comparison with Alternative Solutions

XCF02SVOG20C vs. External Flash Memory

Advantages of Configuration PROM:

  • Dedicated configuration interface reduces FPGA pin usage
  • Simplified design with fewer external components
  • Optimized for FPGA configuration timing requirements
  • Lower system cost for configuration-only applications

When to Consider Flash:

  • Applications requiring larger storage (>4Mb)
  • Systems needing both configuration and data storage
  • Designs utilizing parallel configuration modes

Storage and Handling

Proper Component Storage

Temperature: Store in sealed containers at 15-30°C with <40% relative humidity to prevent moisture absorption and oxidation.

Handling: Use ESD-safe workstations and wrist straps when handling bare devices to prevent electrostatic damage.

Shelf Life: Unopened moisture barrier bags maintain reliability for 12 months from manufacture date.

Purchasing and Availability

Authorized Distributors

The XCF02SVOG20C is available from major electronics distributors worldwide:

  • DigiKey Electronics (Part: 122-1287-5-ND)
  • Mouser Electronics
  • Arrow Electronics
  • Avnet
  • Future Electronics

Pricing and Lead Time

Pricing varies based on order quantity, typically ranging from $3-6 per unit in moderate volumes. Lead times depend on current demand, with standard delivery ranging from 6-12 weeks for factory orders. Stock availability varies by distributor.

Technical Support and Resources

Datasheet and Documentation

Complete technical documentation including:

  • Detailed electrical specifications
  • Timing diagrams and AC characteristics
  • Programming algorithms and sequences
  • Application notes and design guides
  • IBIS models for signal integrity analysis

Getting Technical Assistance

For technical support regarding the XCF02SVOG20C:

  • AMD/Xilinx Technical Support Portal
  • Authorized distributor technical teams
  • Online community forums and discussion boards
  • Application engineers for design consultation

Frequently Asked Questions

What FPGAs are compatible with XCF02SVOG20C?

The XCF02SVOG20C is compatible with Xilinx Spartan, Virtex, and other FPGA families supporting serial configuration modes. Verify specific FPGA compatibility in device documentation.

Can I reprogram the XCF02SVOG20C multiple times?

Yes, the device supports thousands of program/erase cycles, making it suitable for development environments and field updates throughout the product lifecycle.

What is the difference between XCF02S and XCF02P series?

The XCF02S operates at 3.3V core voltage while the XCF02P series uses 1.8V. The P-series also offers larger densities and additional configuration modes.

How do I program the XCF02SVOG20C?

Programming is accomplished via JTAG interface using Xilinx iMPACT software or compatible third-party programmers. The device can be programmed in-circuit or using a device programmer.

Conclusion

The XCF02SVOG20C represents a proven, reliable solution for FPGA configuration storage in industrial and embedded applications. Its combination of 2Mb capacity, 3.3V operation, industrial temperature range, and compact TSSOP-20 package makes it an excellent choice for cost-sensitive designs requiring dependable configuration memory. With comprehensive tool support and availability from major distributors, the XCF02SVOG20C continues to serve as a cornerstone component in FPGA-based system designs worldwide.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.