Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XCF02SVOG20C: High-Performance Xilinx Configuration PROM for FPGA Applications

Product Details

Overview of XCF02SVOG20C Configuration Memory

The XCF02SVOG20C is a professional-grade configuration PROM (Programmable Read-Only Memory) manufactured by AMD Xilinx, designed specifically for storing FPGA configuration bitstreams. This 2-megabit Platform Flash PROM offers engineers and designers a reliable, cost-effective solution for in-system programmable configuration needs.

As part of the XCFxxS Platform Flash series, the XCF02SVOG20C delivers exceptional performance in a compact 20-pin TSSOP package, making it ideal for space-constrained embedded systems and industrial applications.

Key Features and Technical Specifications

Memory Configuration Details

The XCF02SVOG20C stands out with its robust memory architecture and industrial-grade reliability:

Feature Specification
Memory Size 2 Mb (256K x 8-bit)
Configuration Type In-System Programmable
Program/Erase Cycles 20,000 cycles endurance
Access Time 8 ns (high-speed configuration)
Technology Low-power advanced CMOS NOR Flash

Electrical and Operating Characteristics

Parameter Value
Supply Voltage 3.0V ~ 3.6V
Operating Temperature -40°C to +85°C (Industrial)
Standby Current 0.001A (1mA) typical
Package Type 20-TSSOP (0.173″, 4.40mm width)
Lead Finish Matte Tin (Sn) – RoHS Compliant

XCF02SVOG20C Application Areas

Primary FPGA Configuration Uses

This configuration PROM excels in multiple application scenarios:

  • FPGA Bitstream Storage: Stores configuration data for Xilinx FPGA devices including Spartan, Virtex, and other families
  • Master Serial Mode: Supports autonomous FPGA configuration without external microcontroller
  • Slave Serial Mode: Enables flexible system-level configuration architectures
  • Multi-FPGA Systems: Cascadable design allows configuration of multiple FPGAs
  • Industrial Control Systems: Reliable operation in harsh environmental conditions

Industry-Specific Applications

The XCF02SVOG20C serves various industries:

Industry Application
Telecommunications Network infrastructure, switching equipment
Aerospace/Defense Avionics systems, radar processing
Industrial Automation PLC controllers, motor drives, robotics
Medical Devices Diagnostic equipment, imaging systems
Test & Measurement Oscilloscopes, signal analyzers

Platform Flash PROM Architecture

Advanced CMOS NOR Flash Technology

The XCF02SVOG20C utilizes cutting-edge NOR Flash technology that provides:

  • Non-Volatile Storage: Retains configuration data without power
  • Fast Random Access: 8ns access time enables quick FPGA boot-up
  • High Reliability: 20,000 program/erase cycles ensure long-term durability
  • Data Retention: Maintains stored data for over 20 years

Configuration Interface Options

Interface Type Description
JTAG Boundary-Scan IEEE 1149.1 compliant for programming and testing
Serial Configuration Standard Xilinx configuration protocol
Cascade Support Connect multiple PROMs for larger designs

XCF02SVOG20C Package and Pin Configuration

20-TSSOP Package Advantages

The compact TSSOP-20 package offers several benefits:

  • Small Footprint: 4.40mm width saves valuable PCB space
  • Industry Standard: Compatible with standard PCB assembly processes
  • Thermal Performance: Excellent heat dissipation for industrial environments
  • Lead-Free Construction: RoHS compliant for environmental compliance

Pin Description Overview

Pin Function Purpose
CLK Configuration clock input
DIN/DOUT Serial data interface
CE (Chip Enable) Device selection control
RESET System reset input
VCC/GND Power supply connections
TCK/TMS/TDI/TDO JTAG interface pins

Programming and Configuration

In-System Programming Capabilities

The XCF02SVOG20C features comprehensive ISP (In-System Programming) functionality:

  • JTAG Programming: Standard IEEE 1532 in-system configuration
  • Field Updates: Update FPGA configurations without removing device
  • Design Security: Built-in protection against unauthorized access
  • Multi-Revision Storage: Store and switch between design versions

Compatible Development Tools

Tool Function
Vivado Design Suite Primary design and programming environment
iMPACT Legacy programming software
ChipScope Pro Debug and verification tool
Platform Flash PROM User Guide (UG161) Comprehensive technical reference

XCF02SVOG20C vs Alternative Configuration Solutions

Comparison with Other Platform Flash PROMs

Model Memory Voltage Package
XCF01SVOG20C 1 Mb 3.0-3.6V 20-TSSOP
XCF02SVOG20C 2 Mb 3.0-3.6V 20-TSSOP
XCF04SVOG20C 4 Mb 3.0-3.6V 20-TSSOP
XCF08PVOG48C 8 Mb 1.8V 48-TQFP

Why Choose XCF02SVOG20C?

The XCF02SVOG20C provides optimal balance for many applications:

  • Adequate Capacity: 2Mb handles most small-to-medium FPGA designs
  • 3.3V Logic: Compatible with standard FPGA I/O voltage
  • Cost-Effective: Lower cost than larger capacity alternatives
  • Proven Reliability: Established track record in production environments

Design Guidelines and Best Practices

PCB Layout Considerations

For optimal XCF02SVOG20C performance:

  • Decoupling Capacitors: Place 0.1µF ceramic capacitor close to VCC pin
  • Signal Integrity: Keep JTAG and configuration signals short
  • Ground Plane: Use solid ground plane for noise immunity
  • Thermal Management: Ensure adequate airflow for industrial temperatures

Configuration Circuit Design

Design Element Recommendation
Pull-up Resistors 4.7kΩ on DONE, PROG signals
Clock Source Use FPGA CCLK output or external oscillator
Power Sequencing VCC should rise monotonically
ESD Protection Implement TVS diodes on external connections

Quality and Compliance Standards

Manufacturing Quality

The XCF02SVOG20C meets stringent quality standards:

  • RoHS Compliant: Lead-free construction
  • EAR99 Export Classification: Standard commercial grade
  • Industrial Temperature Rating: -40°C to +85°C operation
  • Moisture Sensitivity Level: MSL 3 (168 hours at 30°C/60% RH)

Testing and Reliability

Test Parameter Specification
Endurance 20,000 program/erase cycles minimum
Data Retention 20 years at 85°C
Electrostatic Discharge 2000V HBM (Human Body Model)
Latch-Up Immunity >100mA per JEDEC standard

Ordering Information and Availability

Part Number Breakdown

XCF02S-VO-G20C decodes as:

  • XCF = Platform Flash PROM family
  • 02 = 2 Megabit density
  • S = 3.3V version (vs P = 1.8V)
  • VO = TSSOP package
  • G = Green/RoHS compliant
  • 20 = 20-pin configuration
  • C = Commercial/Industrial temperature

Package Options and Alternatives

Part Number Package Temperature Range
XCF02SVOG20C 20-TSSOP -40°C to +85°C
XCF02SVOG20I 20-TSSOP -40°C to +100°C
XCF02SVO20C 20-TSOP -40°C to +85°C

Technical Resources and Support

Documentation and Design Files

Essential resources for XCF02SVOG20C implementation:

  • DS123 Platform Flash Datasheet: Complete electrical and timing specifications
  • UG161 Platform Flash PROM User Guide: Configuration procedures and hardware connections
  • Application Notes: Design examples and troubleshooting guides
  • IBIS Models: Signal integrity simulation files
  • 3D CAD Models: Mechanical design files for PCB layout

Technical Support Channels

Support Type Access Method
Online Documentation Xilinx/AMD support portal
Community Forums Xilinx community discussion boards
FAE Support Through authorized distributors
Design Services Third-party FPGA design consultants

Frequently Asked Questions

What FPGAs are compatible with XCF02SVOG20C?

The XCF02SVOG20C works with most Xilinx FPGA families including Spartan-3, Spartan-6, Virtex-4, Virtex-5, and compatible devices supporting Master/Slave Serial configuration modes.

Can I cascade multiple XCF02SVOG20C devices?

Yes, the XCF02SVOG20C supports daisy-chain configuration, allowing multiple PROMs to be cascaded for storing larger FPGA bitstreams or multiple design revisions.

What programming hardware is required?

You’ll need a JTAG programmer such as Xilinx Platform Cable USB II, Digilent HS2/HS3, or any IEEE 1149.1-compliant JTAG adapter compatible with Vivado or iMPACT software.

How does XCF02SVOG20C compare to SPI Flash?

Platform Flash PROMs offer dedicated FPGA configuration interfaces, simpler implementation, and guaranteed compatibility with Xilinx tools, while SPI Flash provides higher density and lower cost for larger designs.

Summary: Why Choose XCF02SVOG20C for Your FPGA Design

The XCF02SVOG20C represents an ideal configuration memory solution for embedded systems requiring reliable FPGA bitstream storage. Its 2-megabit capacity, industrial temperature rating, and robust 20,000 cycle endurance make it perfect for production applications.

Whether you’re developing telecommunications equipment, industrial controllers, or test instrumentation, the XCF02SVOG20C delivers the performance and reliability demanded by professional Xilinx FPGA implementations.

Key Takeaways

  • 2Mb capacity suitable for small-to-medium FPGA configurations
  • Industrial-grade -40°C to +85°C operation
  • 20,000 cycles program/erase endurance
  • 8ns access time for fast FPGA boot-up
  • Compact 20-TSSOP package saves board space
  • RoHS compliant lead-free construction
  • Full JTAG support for in-system programming

For designers seeking a proven, cost-effective configuration memory solution, the XCF02SVOG20C continues to be a trusted choice in FPGA-based system design.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.