Overview of XC1701PD8I Configuration Memory

The XC1701PD8I is a high-performance 1 megabit serial configuration PROM (Programmable Read-Only Memory) manufactured by AMD (formerly Xilinx). This configuration memory device is specifically designed to store and deliver configuration bitstreams for Xilinx FPGA and CPLD devices, making it an essential component in FPGA-based system designs.

Key Applications

• FPGA configuration storage
• Industrial control systems
• Telecommunications equipment
• Automotive electronics
• Medical device systems
• Aerospace and defense applications

Technical Specifications

XC1701PD8I Core Features

Electrical Characteristics

XC1701PD8I Pin Configuration

Pin Description Table

Pin Functions Explained

CE (Chip Enable): Active-low chip enable signal that activates the device for read operations.

CLK (Clock): Serial clock input for synchronous data transfer, typically driven by the FPGA during configuration.

DATA: Serial data output pin that delivers configuration bitstream to the target FPGA device.

OE/RESET: Dual-function pin for output enable control and device reset operations.

Performance Characteristics

Timing Specifications

Memory Architecture

The XC1701PD8I features a simple serial architecture optimized for FPGA configuration:

• Sequential read-only access
• Automatic address increment
• Power-on reset capability
• TTL-compatible inputs and outputs
• Low-power CMOS technology

Programming and Configuration

Programming Methods

The XC1701PD8I can be programmed using several methods:

1. In-System Programming (ISP): Program the device while installed on the target board
2. Standalone Programmers: Use dedicated PROM programmer devices
3. Development Software: Xilinx ISE or Vivado design tools with appropriate hardware

Configuration Process

1. FPGA powers up and enters configuration mode
2. FPGA drives CLK signal to XC1701PD8I
3. CE and OE pins are asserted (logic low)
4. XC1701PD8I outputs configuration data on DATA pin
5. FPGA receives and processes bitstream
6. Configuration completes when entire bitstream is transferred

Package Information

8-PDIP Package Details

Ordering and Availability

Part Number Breakdown

XC1701PD8I

• XC = Xilinx product family
• 1701 = 1Mbit configuration PROM series
• P = Plastic package
• D = DIP package style
• 8 = 8-pin package
• I = Industrial temperature range (-40°C to +85°C)

Package Options Comparison

Design Considerations

PCB Layout Guidelines

When designing with the XC1701PD8I, consider these best practices:

1. Decoupling: Place 0.1μF ceramic capacitor close to Vcc pin
2. Signal Integrity: Keep clock and data traces short and away from high-speed signals
3. Pull-ups: Add 4.7kΩ pull-up resistors on CE and OE pins if needed
4. Ground Plane: Use solid ground plane for noise immunity
5. Trace Impedance: Maintain 50Ω characteristic impedance for high-speed signals

Power Supply Recommendations

Quality and Reliability

Environmental Specifications

Industry Compliance

• RoHS compliant (lead-free)
• REACH compliant
• Conflict minerals free
• JEDEC standards compliant
• ISO 9001 certified manufacturing

Competitive Advantages

Why Choose XC1701PD8I

1. Proven Reliability: Decades of field-proven performance in critical applications
2. Easy Integration: Simple serial interface requires minimal support circuitry
3. Low Power: CMOS technology ensures minimal power consumption
4. Wide Temperature: Industrial temperature range suitable for harsh environments
5. Cost-Effective: Economical solution for FPGA configuration storage
6. Legacy Support: Compatible with extensive Xilinx FPGA device families

Comparison with Alternatives

Troubleshooting Guide

Common Issues and Solutions

Storage and Handling

Proper Device Handling

• Store in anti-static packaging when not installed
• Handle with ESD-safe procedures and equipment
• Avoid exposure to extreme temperatures during storage
• Keep away from moisture and contaminants
• Use within manufacturer’s shelf life recommendations

Soldering Recommendations

Technical Support Resources

Documentation Available

• Datasheet (detailed electrical specifications)
• Application notes for FPGA configuration
• Programming specifications
• PCB layout guidelines
• Reference designs and schematics

Development Tools

Compatible with these Xilinx development tools:

• Xilinx ISE Design Suite
• Vivado Design Suite
• iMPACT configuration software
• Third-party PROM programmers

Frequently Asked Questions

Q: Can I reprogram the XC1701PD8I multiple times? A: Yes, the device supports at least 10,000 program/erase cycles.

Q: What’s the maximum configuration speed? A: The device supports clock frequencies up to 20 MHz for fast configuration.

Q: Is this compatible with modern Xilinx FPGAs? A: Yes, it’s compatible with many Xilinx FPGA families, though newer devices may use alternative configuration methods.

Q: Can I use this in automotive applications? A: The industrial temperature range (-40°C to +85°C) makes it suitable for many automotive applications, though automotive-grade versions may be available for critical systems.

Q: What’s the difference between commercial and industrial versions? A: The industrial version (I suffix) operates from -40°C to +85°C, while commercial (C suffix) operates from 0°C to +70°C.

Conclusion

The XC1701PD8I remains a reliable and cost-effective solution for FPGA configuration storage, particularly in industrial environments requiring proven performance across wide temperature ranges. Its simple serial interface, low power consumption, and robust design make it an excellent choice for both new designs and legacy system support.

For designers working with Xilinx FPGA platforms, the XC1701PD8I offers a straightforward path to reliable configuration management with minimal external components and proven field reliability.