Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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XC17256EPD8I: AMD Xilinx 256Kb Serial Configuration PROM for FPGA Applications

Product Details

The XC17256EPD8I is a high-performance 256Kb serial configuration PROM manufactured by AMD (formerly Xilinx). This one-time programmable (OTP) memory device is specifically designed to store configuration bitstreams for Xilinx FPGA devices. With its industrial-grade temperature rating and reliable 8-pin PDIP package, the XC17256EPD8I delivers exceptional performance for embedded systems, industrial automation, telecommunications, and aerospace applications.

XC17256EPD8I Key Features and Benefits

The XC17256EPD8I configuration PROM offers several advantages that make it an ideal choice for FPGA configuration storage:

One-Time Programmable (OTP) Technology

The XC17256EPD8I utilizes OTP technology, providing secure and permanent storage for FPGA configuration data. Once programmed, the bitstream cannot be altered, ensuring data integrity and protection against unauthorized modifications.

Simple FPGA Interface Design

This configuration PROM requires only one user I/O pin for interfacing with Xilinx FPGAs, simplifying PCB layout and reducing design complexity. The straightforward serial interface makes integration seamless across various applications.

Cascadable Architecture

Multiple XC17256EPD8I devices can be cascaded together using the CEO (Chip Enable Output) and CE (Chip Enable) pins. This feature allows storage of longer bitstreams or multiple configuration files for larger FPGA designs.

Programmable Reset Polarity

The XC17256EPD8I supports both active-high and active-low reset configurations, providing flexibility to match different FPGA reset requirements and system architectures.

XC17256EPD8I Technical Specifications

Parameter Specification
Manufacturer AMD (Xilinx)
Part Number XC17256EPD8I
Memory Type Serial Configuration PROM
Memory Size 256Kb (262,144 bits)
Memory Organization 256K x 1
Programmable Type OTP (One-Time Programmable)
Supply Voltage 4.5V to 5.5V
Operating Frequency 15 MHz
Operating Temperature -40°C to +85°C (Industrial)
Package Type 8-Pin PDIP
Mounting Type Through-Hole

XC17256EPD8I Package Information

Specification Details
Package Style PDIP (Plastic Dual In-Line Package)
Pin Count 8 Pins
Package Width 0.300″ (7.62mm)
Lead Pitch 2.54mm
Lead Type Through-Hole
Packaging Method Tube

XC17256EPD8I Pin Configuration

Pin Number Pin Name Function
1 DATA Serial Data Output
2 CLK Clock Input
3 RESET/OE Reset/Output Enable
4 GND Ground
5 CEO Chip Enable Output (for cascading)
6 CE Chip Enable Input
7 NC No Connection
8 VCC Power Supply (5V)

XC17256EPD8I Operating Conditions

Recommended Operating Parameters

Parameter Minimum Typical Maximum Unit
Supply Voltage (VCC) 4.5 5.0 5.5 V
Operating Temperature -40 25 +85 °C
Clock Frequency DC 15 MHz
Input Voltage (VIH) 2.0 VCC+0.5 V
Input Voltage (VIL) -0.5 0.8 V

XC17256EPD8I Applications

The XC17256EPD8I serial configuration PROM is ideal for numerous applications requiring reliable FPGA configuration storage:

Industrial Automation Systems

Industrial control systems benefit from the XC17256EPD8I’s extended temperature range (-40°C to +85°C), ensuring reliable operation in harsh manufacturing environments.

Telecommunications Equipment

Network equipment and communication devices utilize the XC17256EPD8I for storing FPGA configurations that handle signal processing and data routing functions.

Aerospace and Defense

The industrial-grade specifications make the XC17256EPD8I suitable for avionics and defense applications where reliability is paramount.

Medical Devices

Medical imaging and diagnostic equipment employ this configuration PROM for storing FPGA bitstreams that control critical device functions.

Test and Measurement Equipment

Laboratory instruments and testing devices use the XC17256EPD8I for reliable FPGA configuration in precision measurement applications.

XC17256EPD8I Part Number Decoder

Understanding the XC17256EPD8I part number helps identify specific device characteristics:

Code Segment Meaning
XC17 Xilinx Configuration PROM Family
256 Memory Density (256Kb)
E Extended Voltage Range (5V)
PD Plastic DIP Package
8 8-Pin Configuration
I Industrial Temperature (-40°C to +85°C)

XC17256EPD8I vs Similar Configuration PROMs

Part Number Memory Size Package Temp Range Voltage
XC17256EPD8I 256Kb 8-PDIP -40°C to +85°C 5V
XC17256EPD8C 256Kb 8-PDIP 0°C to +70°C 5V
XC17256EVO8I 256Kb 8-SOIC -40°C to +85°C 5V
XC17128EPD8I 128Kb 8-PDIP -40°C to +85°C 5V
XC17512EPD8I 512Kb 8-PDIP -40°C to +85°C 5V

Programming the XC17256EPD8I

Compatible Programming Tools

The XC17256EPD8I can be programmed using:

  • Xilinx iMPACT Programming Software
  • Third-party PROM programmers supporting JEDEC standard
  • Compatible device programmers from Data I/O, BP Microsystems, and others

Programming File Format

The Xilinx ISE or Vivado design software generates programming files in standard formats:

  • PROM files (.mcs, .exo)
  • JEDEC files (.jed)
  • Intel HEX format

Design Considerations for XC17256EPD8I

Power Supply Requirements

Ensure a stable 5V power supply with appropriate decoupling capacitors (0.1µF ceramic recommended) placed close to the VCC and GND pins.

PCB Layout Guidelines

  • Keep clock traces short and away from noise sources
  • Maintain proper ground plane underneath the device
  • Use standard through-hole pad dimensions for 8-pin PDIP

Cascading Multiple Devices

When cascading multiple XC17256EPD8I devices:

  1. Connect CEO of the first device to CE of the next device
  2. Parallel all CLK inputs
  3. Connect DATA outputs in a daisy-chain configuration

XC17256EPD8I Quality and Compliance

Standard Status
Lead-Free Contact manufacturer for RoHS-compliant alternatives
Moisture Sensitivity Level MSL 1 (Unlimited floor life)
Quality Certification ISO 9001 manufacturing
ESD Protection Class 1C (HBM)

How to Order XC17256EPD8I

When ordering the XC17256EPD8I, specify:

  • Complete part number: XC17256EPD8I
  • Quantity required
  • Packaging preference (tube or tape-and-reel if available)
  • Required certifications or documentation

XC17256EPD8I Summary

The XC17256EPD8I is a reliable 256Kb serial configuration PROM designed for storing Xilinx FPGA bitstreams. Its industrial temperature rating, simple interface, and cascadable architecture make it suitable for demanding applications across multiple industries. The 8-pin PDIP package enables straightforward through-hole mounting, while the 5V operation ensures compatibility with standard logic levels.

For engineers designing FPGA-based systems requiring robust configuration storage, the XC17256EPD8I delivers proven performance backed by AMD’s extensive experience in programmable logic solutions.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.