The XC2C384-7FGG324C is a high-performance Complex Programmable Logic Device (CPLD) from the Xilinx CoolRunner-II family, featuring 384 macrocells, 9K gates, and ultra-low power consumption. This in-system programmable CPLD delivers exceptional performance with a 7.1ns propagation delay, making it ideal for industrial control, telecommunications, and embedded system applications.
XC2C384-7FGG324C Product Overview
The XC2C384-7FGG324C represents Xilinx’s commitment to delivering programmable logic solutions that balance high performance with minimal power consumption. Built on 0.18µm CMOS technology, this CPLD operates at 1.8V core voltage while supporting multiple I/O voltage standards including 3.3V, 2.5V, 1.8V, and 1.5V through its dual I/O banking architecture.
This device belongs to the renowned CoolRunner-II CPLD family, which has become the industry standard for battery-powered and portable electronic applications. The XC2C384-7FGG324C comes in a 324-pin Fine-pitch Ball Grid Array (FBGA) package with dimensions of 23mm x 23mm, providing 240 user I/O pins for extensive connectivity options.
For engineers seeking reliable programmable logic solutions, explore the complete range of Xilinx FPGA products to find the perfect match for your design requirements.
XC2C384-7FGG324C Key Specifications
| Parameter |
Value |
| Manufacturer |
Xilinx (AMD) |
| Product Family |
CoolRunner-II CPLD |
| Part Number |
XC2C384-7FGG324C |
| Number of Macrocells |
384 |
| Number of Gates |
9,000 |
| Number of I/O |
240 |
| Maximum Frequency |
217 MHz |
| Propagation Delay (tpd) |
7.1 ns |
| Package Type |
324-FBGA (23×23) |
| Mounting Type |
Surface Mount |
| Operating Temperature |
0°C to +70°C (Commercial) |
| RoHS Compliance |
Yes |
| Lifecycle Status |
Active |
XC2C384-7FGG324C Electrical Characteristics
Power Supply Requirements
| Parameter |
Minimum |
Typical |
Maximum |
Unit |
| Core Supply Voltage (VCCINT) |
1.7 |
1.8 |
1.9 |
V |
| I/O Supply Voltage (VCCIO1) |
1.4 |
– |
3.6 |
V |
| I/O Supply Voltage (VCCIO2) |
1.4 |
– |
3.6 |
V |
| Standby Current (ISB) |
– |
24 |
100 |
µA |
Timing Parameters
| Parameter |
Symbol |
Value |
Unit |
| Pin-to-Pin Delay |
tpd |
7.1 |
ns |
| Clock-to-Output Delay |
tco |
5.3 |
ns |
| Setup Time |
tsu |
3.5 |
ns |
| Hold Time |
th |
0 |
ns |
| Maximum Clock Frequency |
fmax |
217 |
MHz |
XC2C384-7FGG324C Architecture Features
Advanced Interconnect Matrix (AIM) Technology
The XC2C384-7FGG324C utilizes Xilinx’s proprietary Advanced Interconnect Matrix (AIM) architecture, which provides low-power signal routing between function blocks. The AIM feeds 40 true and complement inputs to each of the eight Function Blocks, enabling flexible logic implementation while minimizing power consumption.
Function Block Configuration
| Component |
Specification |
| Number of Function Blocks |
8 |
| PLA Size per Function Block |
40 x 56 P-terms |
| Macrocells per Function Block |
48 |
| Product Terms |
56 per Function Block |
| Input Signals |
40 (true and complement) |
Macrocell Features
Each macrocell in the XC2C384-7FGG324C offers extensive configurability:
- Flip-Flop Types: D-type or T-type configuration
- Latch Mode: D-latch functionality available
- Clock Options: Global clocks, local product term clocks, or DualEDGE clocking
- Reset/Preset: Global set/reset with asynchronous control
- Power-Up State: Configurable to logic 0 or 1
XC2C384-7FGG324C Advanced Power Management
CoolCLOCK Technology
The CoolCLOCK feature combines clock division and DualEDGE flip-flop technology to achieve significant power savings. By using both rising and falling clock edges for data capture, the device can operate at half the clock frequency while maintaining the same data throughput.
DataGATE Function
The DataGATE feature allows selective disabling of unused input signals during specific operational phases. This capability reduces unnecessary signal switching, thereby lowering dynamic power consumption during periods of reduced activity.
Clock Division Capabilities
| Division Factor |
Output Frequency (100MHz Input) |
| ÷2 |
50 MHz |
| ÷4 |
25 MHz |
| ÷6 |
16.67 MHz |
| ÷8 |
12.5 MHz |
| ÷10 |
10 MHz |
| ÷12 |
8.33 MHz |
| ÷14 |
7.14 MHz |
| ÷16 |
6.25 MHz |
XC2C384-7FGG324C I/O Features and Standards
Supported I/O Standards
| Standard |
Voltage Level |
Support |
| LVTTL |
3.3V |
✓ |
| LVCMOS33 |
3.3V |
✓ |
| LVCMOS25 |
2.5V |
✓ |
| LVCMOS18 |
1.8V |
✓ |
| LVCMOS15 |
1.5V |
✓ |
| SSTL2-I |
2.5V |
✓ |
| SSTL3-I |
3.3V |
✓ |
| HSTL-I |
1.5V |
✓ |
I/O Banking Architecture
The XC2C384-7FGG324C features two independent I/O banks, allowing designers to interface with devices operating at different voltage levels within a single design. This flexibility simplifies voltage translation requirements in mixed-voltage systems.
Output Configuration Options
| Feature |
Description |
| Slew Rate Control |
Programmable fast/slow edge rates |
| Bus Hold |
Maintains last driven state |
| Pull-Up Resistor |
Internal weak pull-up |
| Open Drain |
For wired-OR applications |
| Programmable Ground |
Output driver disabled |
| Schmitt Trigger |
Noise-immune input threshold |
XC2C384-7FGG324C Programming and Development
In-System Programming (ISP) Support
The XC2C384-7FGG324C supports IEEE 1149.1 and IEEE 1532 boundary-scan (JTAG) standards for:
- In-system programming
- Device configuration
- Board-level testing
- Production programming
Development Tools Compatibility
| Tool |
Version |
Support |
| Xilinx ISE Design Suite |
14.7 |
Full |
| Xilinx Vivado |
Limited |
Schematic Only |
| iMPACT Programmer |
All |
Full |
| ChipScope Pro |
14.7 |
Full |
Programming Specifications
| Parameter |
Value |
| Programming Technology |
Flash |
| Endurance |
20,000 Program/Erase Cycles |
| Data Retention |
20 Years |
| Configuration Time |
< 1 ms |
XC2C384-7FGG324C Package Information
324-FBGA Package Specifications
| Parameter |
Value |
| Package Type |
Fine-pitch Ball Grid Array |
| Pin Count |
324 |
| Body Size |
23mm x 23mm |
| Ball Pitch |
1.0 mm |
| Ball Diameter |
0.5 mm |
| Package Height |
2.3 mm (max) |
| Weight |
~2.5 g |
Thermal Characteristics
| Parameter |
Symbol |
Value |
Unit |
| Junction-to-Ambient (Still Air) |
θJA |
28 |
°C/W |
| Junction-to-Case |
θJC |
8 |
°C/W |
| Maximum Junction Temperature |
TJ |
125 |
°C |
XC2C384-7FGG324C Application Areas
Industrial Control Systems
The XC2C384-7FGG324C excels in industrial automation applications where reliable logic implementation, instant-on operation, and low power consumption are critical requirements.
Telecommunications Equipment
With its high-speed performance and multi-voltage I/O support, this CPLD is ideal for telecommunications infrastructure, including base stations, routers, and network switches.
Consumer Electronics
The ultra-low standby power makes the XC2C384-7FGG324C perfect for battery-powered consumer devices, portable equipment, and IoT applications.
Automotive Electronics
Commercial temperature grade versions serve automotive infotainment systems, instrument clusters, and body electronics applications.
Medical Devices
The device’s reliability and deterministic timing characteristics make it suitable for medical instrumentation and diagnostic equipment.
XC2C384-7FGG324C Part Number Decoder
| Part Segment |
Meaning |
| XC2C |
CoolRunner-II CPLD Family |
| 384 |
384 Macrocells |
| -7 |
Speed Grade (7.1ns tpd) |
| FGG |
Fine-pitch BGA Package |
| 324 |
324 Pins |
| C |
Commercial Temperature (0°C to +70°C) |
Related Part Numbers
| Part Number |
Temperature Grade |
Package |
| XC2C384-7FGG324C |
Commercial (0°C to +70°C) |
324-FBGA |
| XC2C384-7FGG324I |
Industrial (-40°C to +85°C) |
324-FBGA |
| XC2C384-7FT256C |
Commercial (0°C to +70°C) |
256-FTBGA |
| XC2C384-7FT256I |
Industrial (-40°C to +85°C) |
256-FTBGA |
Why Choose XC2C384-7FGG324C for Your Design
Performance Benefits
- Fast Propagation Delay: 7.1ns pin-to-pin ensures high-speed logic operation
- High Clock Frequency: 217MHz maximum frequency for demanding applications
- Instant-On Operation: No configuration time required at power-up
- Deterministic Timing: Predictable delays simplify timing analysis
Power Efficiency Advantages
- Ultra-Low Standby Current: Less than 100µA in standby mode
- CoolCLOCK Technology: Reduces dynamic power by up to 50%
- DataGATE Feature: Minimizes unnecessary switching activity
- Low Voltage Operation: 1.8V core reduces overall system power
Design Flexibility Benefits
- Multi-Voltage I/O: Dual I/O banks support mixed-voltage designs
- 240 User I/O: Extensive connectivity for complex interfaces
- In-System Programmable: Field updates without hardware changes
- JTAG Support: Easy integration into test infrastructure
XC2C384-7FGG324C Ordering Information
| Order Code |
Description |
| XC2C384-7FGG324C |
Commercial temp, 324-FBGA, Pb-free |
| XC2C384-7FGG324I |
Industrial temp, 324-FBGA, Pb-free |
Quality and Compliance
| Standard |
Compliance |
| RoHS |
Compliant |
| REACH |
Compliant |
| Halogen-Free |
Yes |
| MSL Rating |
Level 3 |
XC2C384-7FGG324C Technical Documentation
For complete design implementation, the following documentation resources are essential:
- DS095: CoolRunner-II CPLD Family Data Sheet
- UG445: CoolRunner-II CPLD Design Considerations
- XAPP378: CoolRunner-II Advanced Design Techniques
- XAPP389: CoolRunner-II Power Estimation
Conclusion
The XC2C384-7FGG324C stands as a versatile and reliable CPLD solution for engineers requiring high-performance programmable logic with minimal power consumption. Its combination of 384 macrocells, 7.1ns propagation delay, and advanced power management features makes it an excellent choice for applications ranging from industrial control to battery-powered portable devices.
With comprehensive I/O voltage support, robust programming endurance, and proven reliability, the XC2C384-7FGG324C continues to serve as a trusted component in mission-critical designs worldwide.
