Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC1765EPD8I: Xilinx Serial Configuration PROM for FPGA Applications

Product Details

The XC1765EPD8I is a high-reliability one-time programmable (OTP) serial configuration PROM manufactured by Xilinx (now AMD). This industrial-grade memory IC stores FPGA configuration bitstreams in a compact 8-pin PDIP package. Engineers worldwide trust this component for demanding embedded systems requiring reliable FPGA initialization.


XC1765EPD8I Product Overview

The XC1765EPD8I belongs to the XC1700E family of configuration PROMs. These devices provide a cost-effective method for storing large Xilinx FPGA configuration bitstreams. The XC1765EPD8I operates at 3.3V and features industrial temperature range support (-40°C to +85°C), making it ideal for harsh operating environments.

When paired with Xilinx FPGAs in Master Serial mode, this PROM automatically delivers configuration data upon power-up. The FPGA generates the configuration clock while the PROM outputs data on each rising edge. This streamlined interface requires only one user I/O pin, simplifying PCB design.


XC1765EPD8I Technical Specifications

Parameter Specification
Part Number XC1765EPD8I
Manufacturer Xilinx Inc. (AMD)
Memory Type Serial Configuration PROM
Memory Density 64 Kbit (65,536 bits)
Memory Organization 8K x 8
Supply Voltage 3.3V
Package Type 8-Pin PDIP (Plastic DIP)
Temperature Range Industrial (-40°C to +85°C)
Programming Type One-Time Programmable (OTP)
Data Retention 20 Years Guaranteed
Lead-Free Option Available

XC1765EPD8I Pin Configuration

Pin Number Pin Name Function
1 CEO Cascade Enable Output
2 CLK Serial Clock Input
3 DATA Serial Data Output
4 GND Ground
5 CE Chip Enable (Active Low)
6 OE/RESET Output Enable / Reset
7 NC No Connection
8 VCC Power Supply (3.3V)

Key Features of XC1765EPD8I

OTP Memory Architecture

The XC1765EPD8I utilizes a low-power CMOS floating-gate process. This architecture ensures long-term data retention up to 20 years. Unlike flash-based alternatives, OTP technology eliminates accidental reprogramming risks in field-deployed systems.

Simple FPGA Interface

Configuration requires minimal external components. The serial interface connects directly to the FPGA DIN pin. After successful configuration, the FPGA automatically disables the PROM, reducing standby power consumption.

Cascadable Design

Multiple XC1765EPD8I devices can be daisy-chained for larger bitstreams. The CEO (Cascade Enable Output) pin connects to the CE input of subsequent PROMs. This feature supports multi-FPGA systems or high-density configurations exceeding 64 Kbit.

Programmable Reset Polarity

The reset polarity can be programmed as active-high or active-low. This flexibility ensures compatibility with different FPGA families and system reset schemes.


XC1765EPD8I Operating Conditions

Parameter Min Typ Max Unit
Supply Voltage (VCC) 3.0 3.3 3.6 V
Operating Temperature -40 25 +85 °C
Input Low Voltage (VIL) -0.5 0.8 V
Input High Voltage (VIH) 2.0 VCC+0.5 V
Clock Frequency 10 MHz

Compatible FPGA Families

The XC1765EPD8I works seamlessly with multiple Xilinx FPGA families in Master Serial configuration mode:

FPGA Family Compatibility Configuration Mode
XC2000 Series Supported Master Serial
XC3000 Series Supported Master Serial
XC4000 Series Supported Master Serial
XC5200 Series Supported Master Serial
Spartan Supported Master Serial
Spartan-XL Supported Master Serial

XC1765EPD8I Applications

This configuration PROM excels in applications requiring reliable non-volatile FPGA initialization:

Industrial Control Systems

Factory automation equipment benefits from the industrial temperature rating. PLCs, motor controllers, and sensor interfaces use this PROM for dependable startup sequences.

Telecommunications Equipment

Network switches, routers, and base station equipment require consistent FPGA configuration across wide temperature ranges.

Medical Devices

Diagnostic instruments and patient monitoring systems demand high-reliability components with guaranteed data retention.

Aerospace and Defense

Military-grade variants serve applications requiring extreme environmental tolerance and long operational lifespans.


Design Considerations for XC1765EPD8I

PCB Layout Recommendations

Place decoupling capacitors close to the VCC and GND pins. A 0.1µF ceramic capacitor provides adequate high-frequency filtering. Keep clock traces short to minimize signal integrity issues.

Programming Requirements

Standard device programmers from leading manufacturers support the XC1765EPD8I. Xilinx Alliance software generates the programming bitstream files. Verify programmer compatibility before production programming.

Storage and Handling

Store devices in original packaging until use. Observe ESD precautions during handling. The PDIP package withstands standard reflow soldering temperatures for through-hole mounting.


Alternative Package Options

The XC1765E family offers multiple package variants:

Part Number Package Pins Temperature Range
XC1765EPD8C PDIP 8 Commercial (0°C to +70°C)
XC1765EPD8I PDIP 8 Industrial (-40°C to +85°C)
XC1765ESOG8C SOIC 8 Commercial (0°C to +70°C)
XC1765ESOG8I SOIC 8 Industrial (-40°C to +85°C)
XC1765EVO8C VOIC/TSOP 8 Commercial (0°C to +70°C)
XC1765EVO8I VOIC/TSOP 8 Industrial (-40°C to +85°C)

Ordering Information

Order Code Description
XC1765EPD8I 64Kbit Serial PROM, 8-PDIP, Industrial Temp, 3.3V

Conclusion

The XC1765EPD8I delivers proven reliability for FPGA configuration storage. Its industrial temperature rating, compact 8-pin PDIP package, and 20-year data retention make it suitable for demanding applications. Engineers seeking a dependable configuration solution will find the XC1765EPD8I meets their requirements for quality, longevity, and ease of integration.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.