Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC17S20PD8C Serial Configuration PROM | AMD Xilinx 174K-bit OTP FPGA Memory

Product Details

XC17S20PD8C Product Overview

The XC17S20PD8C is a high-performance serial configuration PROM (Programmable Read-Only Memory) manufactured by AMD, formerly known as Xilinx. This one-time programmable (OTP) memory device is specifically designed to store configuration bitstreams for Spartan and Spartan-XL FPGA families. As part of the XC17S series, the XC17S20PD8C provides engineers and designers with a reliable, cost-effective solution for FPGA configuration storage in embedded systems and industrial applications.

This configuration memory IC features a 174K-bit (174,000-bit) serial PROM architecture operating at 5V, housed in a compact 8-pin PDIP (Plastic Dual Inline Package). The commercial temperature grade version (indicated by the “C” suffix) is optimized for standard operating environments. For more information about compatible Xilinx FPGA devices and configuration solutions, engineers can explore comprehensive FPGA resources and technical documentation.


Key Features and Benefits of XC17S20PD8C

Technical Highlights

The XC17S20PD8C configuration PROM delivers exceptional performance and reliability for FPGA applications. Its one-time programmable architecture ensures permanent, secure storage of configuration data, making it ideal for production environments where data integrity is critical.

Core Advantages

  • Simple Serial Interface: Requires only one user I/O pin for FPGA configuration, minimizing board complexity and routing requirements.
  • Programmable Reset Polarity: Supports both active-high and active-low reset configurations for maximum flexibility across different FPGA platforms.
  • Low Power Consumption: CMOS technology ensures minimal power draw during both standby and active operation modes.
  • High Reliability: OTP architecture provides permanent data retention without battery backup requirements.
  • Cascadable Design: CEO (Chip Enable Output) allows multiple PROMs to be chained for larger configuration storage needs.

XC17S20PD8C Technical Specifications

Electrical and Physical Specifications

Parameter Specification
Part Number XC17S20PD8C
Manufacturer AMD (formerly Xilinx)
Memory Type Serial Configuration PROM (OTP)
Memory Density 174K-bit (174,000 bits)
Supply Voltage (VCC) 5V (4.75V – 5.25V)
Package Type 8-Pin PDIP (Plastic DIP)
Package Dimensions 9.27mm × 6.35mm × 3.30mm
Pin Count 8 Pins
Temperature Grade Commercial (0°C to +70°C)
Technology CMOS
Interface Serial
RoHS Status RoHS Compliant

Operating Conditions

Parameter Min Max
Supply Voltage (VCC) 4.75V 5.25V
Operating Temperature 0°C +70°C
Storage Temperature -65°C +150°C
Input Low Voltage (VIL) 0V 0.8V
Input High Voltage (VIH) 2.0V VCC + 0.5V

XC17S20PD8C Pin Configuration and Description

The 8-pin PDIP package provides a simple, efficient interface for FPGA configuration. Understanding the pinout is essential for proper PCB design and system integration.

Pin Name Description
1 DATA Serial Data Output – Connects to FPGA DIN pin
2 CLK Clock Input – Serial clock from FPGA CCLK
3 RESET/OE Reset/Output Enable – Controls data output
4 CE Chip Enable Input – Active low enable
5 CEO Chip Enable Output – For cascading multiple PROMs
6 VCC Power Supply – 5V
7 GND Ground Reference
8 NC/VPP No Connect / Programming Voltage

FPGA Compatibility and Configuration Modes

Supported FPGA Families

The XC17S20PD8C is specifically designed to configure Xilinx Spartan and Spartan-XL FPGA families. The 174K-bit memory capacity supports FPGAs with up to 20,000 system gates, making it suitable for small to medium-density programmable logic applications.

FPGA Family Gate Capacity Compatibility
Spartan Up to 20,000 gates Fully Compatible
Spartan-XL Up to 20,000 gates Fully Compatible
XC2S (Spartan-II) Select devices Compatible

Configuration Mode Support

Master Serial Mode: The FPGA generates the configuration clock (CCLK) that drives the PROM. After a short access time following the rising clock edge, data appears on the PROM DATA output pin connected to the FPGA DIN pin.

Slave Serial Mode: Both the PROM and FPGA are clocked by an external signal source. This mode provides flexibility for multi-device configurations and external timing control.


Target Applications for XC17S20PD8C

The XC17S20PD8C configuration PROM is well-suited for a wide range of embedded and industrial applications requiring reliable FPGA configuration storage:

Application Sector Use Cases
Industrial Automation PLC controllers, motor drives, sensor interfaces
Telecommunications Protocol converters, signal processors, interface cards
Consumer Electronics Video processing, display controllers, audio systems
Test & Measurement Data acquisition, signal generation, instrumentation
Embedded Systems Microcontroller peripherals, custom logic, co-processors
Automotive Dashboard systems, sensor networks, control modules

Design Guidelines and Best Practices

PCB Layout Recommendations

For optimal performance and reliability when integrating the XC17S20PD8C into your design, consider the following guidelines:

  • Power Supply Decoupling: Place a 0.1µF ceramic capacitor as close as possible to the VCC pin to filter high-frequency noise.
  • Signal Routing: Keep clock and data lines as short as possible to minimize signal integrity issues.
  • Ground Plane: Use a solid ground plane beneath the PROM and FPGA for optimal noise immunity.
  • Cascade Connection: When cascading multiple PROMs, connect CEO of the first device to CE of the next device.

Ordering Information and Part Number Variants

The XC17S20 series is available in multiple package options and temperature grades to meet diverse application requirements:

Part Number Package Temperature Grade
XC17S20PD8C 8-Pin PDIP Commercial (0°C to +70°C)
XC17S20PD8I 8-Pin PDIP Industrial (-40°C to +85°C)
XC17S20PC8C 8-Pin PDIP Commercial (0°C to +70°C)
XC17S20VO8C 8-Pin SOIC Commercial (0°C to +70°C)

Quality Standards and Compliance

The XC17S20PD8C meets stringent quality and environmental standards required for professional electronic designs:

  • RoHS Compliant: Meets EU Directive 2011/65/EU requirements for restriction of hazardous substances.
  • REACH Compliant: Complies with EU REACH regulations for chemical substance safety.
  • MSL Rating: Moisture Sensitivity Level 1 – unlimited floor life at ≤30°C/85% RH.

Conclusion

The XC17S20PD8C represents a proven, reliable solution for FPGA configuration in embedded systems. Its combination of adequate memory density, simple serial interface, and robust CMOS technology makes it an excellent choice for engineers designing with Spartan and Spartan-XL FPGAs. Whether for industrial automation, telecommunications, or consumer electronics applications, the XC17S20PD8C delivers the performance and reliability that professional designs demand.

For technical support and additional documentation, please refer to the AMD (formerly Xilinx) official product documentation and application notes.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.