The XC2C512-10FG324I is a high-performance Complex Programmable Logic Device (CPLD) from Xilinx’s industry-leading CoolRunner-II family. This industrial-grade CPLD combines exceptional processing speed with ultra-low power consumption, making it the perfect choice for demanding embedded systems and portable applications. Engineers worldwide rely on the XC2C512-10FG324I for its outstanding balance of performance, reliability, and energy efficiency.
XC2C512-10FG324I Key Features and Benefits
The XC2C512-10FG324I stands out in the CPLD market due to its innovative architecture and advanced capabilities. This device delivers fast pin-to-pin timing while maintaining industry-leading low power consumption. Below are the standout features that make the XC2C512-10FG324I an excellent choice for modern electronic designs.
Ultra-Low Power Technology
The XC2C512-10FG324I utilizes Xilinx’s proprietary Fast Zero Power (FZP) technology. This 1.8V all-digital core enables standby currents as low as 14μA. The device achieves remarkable energy efficiency without sacrificing performance, extending battery life in portable applications significantly.
High-Speed Performance
Engineers appreciate the XC2C512-10FG324I for its impressive timing characteristics. The device delivers pin-to-pin delays as fast as 7.1ns. Additionally, the 128MHz system frequency ensures responsive operation for time-critical applications.
Robust Industrial-Grade Design
The “I” suffix indicates industrial temperature range support. The XC2C512-10FG324I operates reliably across the extended temperature range from -40°C to +85°C. This makes the device suitable for harsh environments and outdoor installations.
XC2C512-10FG324I Technical Specifications
Understanding the complete specifications helps engineers integrate the XC2C512-10FG324I effectively into their designs. The following tables provide comprehensive technical details.
General Specifications
| Parameter |
Value |
| Manufacturer |
Xilinx (AMD) |
| Part Number |
XC2C512-10FG324I |
| Product Family |
CoolRunner-II |
| Device Type |
CPLD |
| System Gates |
12,000 |
| Macrocells |
512 |
| Function Blocks |
32 |
| Product Terms per Macrocell |
56 |
Performance Specifications
| Parameter |
Value |
| Maximum Frequency |
128MHz |
| Pin-to-Pin Delay |
7.1ns (min) to 9.2ns |
| Process Technology |
0.18μm CMOS |
| Speed Grade |
-10 |
| P-term PLA Configuration |
40 x 56 |
Electrical Characteristics
| Parameter |
Value |
| Core Voltage |
1.8V |
| Operating Voltage Range |
1.7V to 1.9V |
| I/O Voltage Compatibility |
1.5V, 1.8V, 2.5V, 3.3V |
| Quiescent Current |
14μA (typical) |
| Standby Current |
16μA |
| Ultra-Low Power Current |
28.8μW |
Package Information
| Parameter |
Value |
| Package Type |
FBGA (Fine-pitch Ball Grid Array) |
| Package Code |
FG324 |
| Pin Count |
324 |
| Body Size |
23mm x 23mm |
| Ball Pitch |
1.0mm |
| User I/O Pins |
270 (maximum) |
| I/O Banks |
4 |
Operating Conditions
| Parameter |
Value |
| Temperature Range |
-40°C to +85°C (Industrial) |
| Temperature Grade |
I (Industrial) |
| Moisture Sensitivity Level |
MSL 3 (168 hours) |
XC2C512-10FG324I Architecture Overview
The XC2C512-10FG324I features Xilinx’s innovative Advanced Interconnect Matrix (AIM) architecture. This design efficiently routes signals between function blocks while minimizing power consumption. Understanding this architecture helps engineers optimize their designs effectively.
Function Block Structure
Each function block within the XC2C512-10FG324I contains 16 macrocells. The AIM feeds 40 true and complement inputs to each function block. This configuration provides exceptional flexibility for implementing complex logic functions. The 40 x 56 P-term PLA structure enables efficient logic synthesis.
Clock Management Features
The XC2C512-10FG324I provides sophisticated clock management capabilities. The device includes three global clocks for system-wide synchronization. Additionally, 16 product term clocks per function block enable fine-grained timing control.
Key clock features include:
- DualEDGE Flip-Flop: This feature enables high-performance synchronous operation with lower frequency clocking. Engineers can reduce total power consumption while maintaining performance.
- CoolCLOCK Technology: This innovative feature further reduces dynamic power consumption during clock distribution.
- Clock Divider: The device can divide one externally supplied global clock (GCK2) by eight different selections. This provides divide-by-2, 4, 6, 8, 10, 12, 14, or 16 options.
Advanced I/O Capabilities
The XC2C512-10FG324I supports multiple I/O standards for maximum design flexibility:
| I/O Standard |
Supported |
| LVCMOS 1.5V |
Yes |
| LVCMOS 1.8V |
Yes |
| LVCMOS 2.5V |
Yes |
| LVCMOS 3.3V |
Yes |
| SSTL2-1 |
Yes |
| SSTL3-1 |
Yes |
| HSTL-1 |
Yes |
XC2C512-10FG324I Programming and Development
Developing with the XC2C512-10FG324I is straightforward thanks to comprehensive tool support and in-system programmability. This section covers essential development information.
In-System Programming (ISP)
The XC2C512-10FG324I supports fast in-system programming through the IEEE 1532 JTAG interface. Engineers can reprogram the device without removing it from the circuit board. This capability simplifies prototyping, debugging, and field updates significantly.
Design Tools
Xilinx provides several design tools for XC2C512-10FG324I development:
| Tool |
Purpose |
| ISE Design Suite |
Legacy development environment |
| Vivado Design Suite |
Modern synthesis and implementation |
| JTAG Programming |
IEEE 1149.1 boundary scan support |
Design Security
The XC2C512-10FG324I includes four levels of design security to protect intellectual property. These security features guard against unauthorized pattern theft and reverse engineering attempts.
XC2C512-10FG324I Applications
The versatile XC2C512-10FG324I serves numerous applications across multiple industries. Its combination of high performance and low power makes it particularly valuable for the following use cases.
Communications Equipment
High-end communication systems benefit from the XC2C512-10FG324I’s fast timing and low power consumption. The device handles complex protocol conversion and signal processing tasks efficiently.
Industrial Automation
The industrial temperature range makes the XC2C512-10FG324I ideal for factory automation systems. The device operates reliably in harsh manufacturing environments with wide temperature variations.
Portable and Battery-Operated Devices
The ultra-low standby current extends battery life in handheld devices. Engineers designing portable equipment appreciate the XC2C512-10FG324I’s excellent power efficiency.
Embedded Systems
The XC2C512-10FG324I excels in embedded applications requiring reliable glue logic and interface conversion. The instant-on capability eliminates boot delays typical of FPGA-based solutions.
Telecommunications
Telecom infrastructure applications leverage the XC2C512-10FG324I for interface bridging and protocol handling. The device’s reliability ensures consistent network performance.
XC2C512-10FG324I vs Alternative Solutions
When selecting a CPLD for your project, comparing the XC2C512-10FG324I against alternatives helps ensure the best choice. The following comparison highlights key differences.
CoolRunner-II Family Comparison
| Part Number |
Macrocells |
Max I/O |
Package Options |
| XC2C32A |
32 |
33 |
QFG32, VQG44, CPG56 |
| XC2C64A |
64 |
64 |
VQG44, VQG100, CPG56 |
| XC2C128 |
128 |
100 |
TQG144, VQG100, CPG132 |
| XC2C256 |
256 |
184 |
TQG144, PQG208, VQG100 |
| XC2C384 |
384 |
240 |
TQG144, PQG208, FTG256 |
| XC2C512-10FG324I |
512 |
270 |
FG324 |
The XC2C512-10FG324I offers the highest logic density in the CoolRunner-II family. This makes it the optimal choice for complex designs requiring maximum macrocell count.
XC2C512-10FG324I Part Number Decoder
Understanding the part number helps engineers identify device variants quickly:
| Code Segment |
Meaning |
| XC2C |
Xilinx CoolRunner-II Family |
| 512 |
512 Macrocells |
| 10 |
Speed Grade (-10) |
| FG |
Fine-pitch BGA Package |
| 324 |
324-Pin Package |
| I |
Industrial Temperature Range |
Related part numbers include the XC2C512-10FG324C (commercial temperature) and XC2C512-10FGG324I (lead-free version).
How to Purchase XC2C512-10FG324I
The XC2C512-10FG324I is available through authorized distributors worldwide. When ordering, engineers should consider the following factors:
- Quantity: Volume pricing typically offers significant discounts
- Lead Time: Check current availability with distributors
- Packaging: Verify tape-and-reel or tray options for production
For comprehensive Xilinx FPGA product selection and competitive pricing, authorized distributors offer technical support and genuine components.
XC2C512-10FG324I Documentation and Resources
Xilinx provides extensive documentation for the XC2C512-10FG324I:
| Document |
Description |
| DS096 |
XC2C512 CoolRunner-II CPLD Data Sheet |
| DS090 |
CoolRunner-II CPLD Family Overview |
| UG445 |
CoolRunner-II CPLD Design Guide |
Conclusion: Why Choose XC2C512-10FG324I
The XC2C512-10FG324I represents Xilinx’s commitment to high-performance, low-power programmable logic. This industrial-grade CPLD delivers exceptional value for demanding applications. Engineers benefit from the device’s combination of 512 macrocells, ultra-low power consumption, and robust industrial temperature range support.
Key advantages of selecting the XC2C512-10FG324I include:
- Highest macrocell density in CoolRunner-II family
- Industry-leading low power consumption
- Fast pin-to-pin timing for responsive designs
- Extended industrial temperature operation
- Comprehensive tool and documentation support
The XC2C512-10FG324I continues to serve engineers worldwide as a reliable, high-performance CPLD solution for complex embedded system designs.
