The XC2C512-10FGG324C is a premium Complex Programmable Logic Device (CPLD) from Xilinx’s renowned CoolRunner-II family. This high-capacity CPLD delivers exceptional performance while maintaining ultra-low power consumption, making it the perfect solution for demanding embedded applications.
Designed with advanced 0.18μm CMOS technology, the XC2C512-10FGG324C offers engineers 512 macrocells and 12,000 equivalent gates. Whether you’re developing communication equipment, industrial controls, or battery-powered devices, this CPLD provides the performance and flexibility your design requires.
Looking for more programmable logic solutions? Explore our complete Xilinx FPGA product lineup.
XC2C512-10FGG324C Key Specifications
| Parameter |
Value |
| Manufacturer |
Xilinx (AMD) |
| Product Family |
CoolRunner-II |
| Part Number |
XC2C512-10FGG324C |
| Device Type |
CPLD (Complex Programmable Logic Device) |
| Macrocells |
512 |
| Equivalent Gates |
12,000 (12K) |
| Function Blocks |
32 |
| Maximum User I/O |
270 |
| Maximum Frequency |
128 MHz |
| Speed Grade |
-10 (9.2ns Tpd) |
XC2C512-10FGG324C Electrical Characteristics
| Parameter |
Specification |
| Core Voltage (VCC) |
1.8V |
| I/O Voltage Support |
1.5V, 1.8V, 2.5V, 3.3V |
| Standby Current (ICC) |
Ultra-low (μA range) |
| Process Technology |
0.18μm CMOS |
| Power Management |
DataGATE Technology |
XC2C512-10FGG324C Package Information
| Parameter |
Specification |
| Package Type |
FBGA (Fine Ball Grid Array) |
| Pin Count |
324 Pins |
| Package Code |
FGG324 |
| Body Size |
23mm × 23mm |
| Ball Pitch |
1.0mm |
| Mounting Type |
Surface Mount (SMD) |
| Lead-Free |
Yes (RoHS Compliant) |
XC2C512-10FGG324C Operating Conditions
| Parameter |
Commercial Grade (C) |
| Operating Temperature |
0°C to +70°C |
| Storage Temperature |
-65°C to +150°C |
| Junction Temperature |
125°C Maximum |
| Humidity Rating |
MSL 3 |
Why Choose XC2C512-10FGG324C CoolRunner-II CPLD?
Ultra-Low Power Consumption
The XC2C512-10FGG324C leverages Xilinx’s revolutionary CoolRunner-II architecture. This design achieves near-zero standby power while delivering full-speed performance when active. Battery-powered applications benefit tremendously from this power efficiency.
Advanced Interconnect Matrix (AIM) Technology
Every XC2C512-10FGG324C features the proprietary Advanced Interconnect Matrix. The AIM feeds 40 true and complement inputs to each of the 32 Function Blocks. This architecture ensures predictable timing and optimal routing for complex designs.
DualEDGE Flip-Flop Feature
The DualEDGE capability enables high-performance synchronous operation using lower-frequency clocking. Engineers can reduce system clock speeds by 50% while maintaining equivalent throughput. This translates directly to reduced power consumption and EMI.
Flexible Clock Management
The XC2C512-10FGG324C provides three global clocks with advanced features. Clock division circuitry supports eight different frequency selections. Both even and odd divider ratios are available for maximum flexibility.
Comprehensive I/O Standard Support
Modern system designs require multiple voltage interfaces. The XC2C512-10FGG324C supports 1.5V, 1.8V, 2.5V, and 3.3V I/O standards. Engineers can interface directly with various logic families without external level shifters.
XC2C512-10FGG324C Architecture Overview
Function Block Structure
Each XC2C512-10FGG324C contains 32 Function Blocks (FBs). Every Function Block includes a 40×56 product-term PLA feeding 16 macrocells. This structure provides substantial logic density for complex applications.
Macrocell Configuration
The 512 macrocells offer extensive configuration options. Each macrocell supports combinational or registered outputs with configurable polarity. Asynchronous set/reset and clock-enable functions operate on a per-macrocell basis.
Global Resources
| Resource |
Quantity |
| Global Clocks (GCK) |
3 |
| Global Set/Reset (GSR) |
1 |
| Global Output Enable (GTS) |
4 |
| Product Terms per FB |
56 |
XC2C512-10FGG324C Application Areas
Communication Equipment
High-speed networking equipment demands reliable glue logic. The XC2C512-10FGG324C handles protocol conversion, bus bridging, and timing generation. Its low power consumption reduces thermal management requirements.
Industrial Automation
Factory automation systems require deterministic timing behavior. The predictable delays of the XC2C512-10FGG324C ensure reliable machine control. Industrial temperature ranges are covered by the XC2C512-10FGG324I variant.
Consumer Electronics
Portable devices benefit from the CoolRunner-II’s standby power characteristics. The XC2C512-10FGG324C extends battery life while providing complex logic functions. DataGATE technology further optimizes power consumption.
Medical Devices
Medical equipment requires reliable and certifiable components. The XC2C512-10FGG324C provides non-volatile configuration storage. Instant-on capability eliminates boot-up delays in critical applications.
Automotive Systems
Infotainment and body control modules use CPLDs for interface logic. The XC2C512-10FGG324C handles CAN bus interfaces and sensor signal conditioning. Automotive-grade variants offer extended temperature operation.
XC2C512-10FGG324C Development Tools
Software Support
Xilinx ISE Design Suite provides complete development capability for the XC2C512-10FGG324C. The WebPACK edition offers free access to CPLD design tools. HDL synthesis supports both VHDL and Verilog languages.
Programming Options
| Method |
Description |
| JTAG (IEEE 1149.1) |
In-System Programming via boundary scan |
| Platform Cable USB |
Standard Xilinx programming hardware |
| Third-Party Programmers |
Gang programming for production |
| ISP Interface |
Four-wire programming interface |
Design Resources
Xilinx provides comprehensive documentation for the XC2C512-10FGG324C. The DS096 datasheet contains complete electrical specifications. Application notes cover common design scenarios and best practices.
XC2C512-10FGG324C Part Number Decoder
Understanding the part number helps specify the correct variant:
| Segment |
Code |
Meaning |
| Family |
XC2C |
CoolRunner-II CPLD |
| Density |
512 |
512 Macrocells |
| Speed Grade |
-10 |
Standard Speed (9.2ns) |
| Package |
FGG |
Fine Pitch BGA Lead-Free |
| Pin Count |
324 |
324 Balls |
| Temperature |
C |
Commercial (0°C to +70°C) |
Related Part Numbers
| Part Number |
Variant Description |
| XC2C512-10FGG324I |
Industrial Temperature (-40°C to +100°C) |
| XC2C512-7FGG324C |
Faster Speed Grade (-7) |
| XC2C512-10FTG256C |
Smaller 256-Pin FTBGA Package |
| XC2C512-10PQG208C |
208-Pin PQFP Package |
XC2C512-10FGG324C vs. Alternative CPLDs
| Feature |
XC2C512-10FGG324C |
XC2C384-10FGG324C |
XC2C256-7TQG144C |
| Macrocells |
512 |
384 |
256 |
| Gates |
12K |
9K |
6K |
| Max I/O |
270 |
240 |
118 |
| Function Blocks |
32 |
24 |
16 |
| Package |
324 FBGA |
324 FBGA |
144 TQFP |
| Best For |
High-Density |
Mid-Range |
Cost-Sensitive |
XC2C512-10FGG324C Compliance and Certifications
| Standard |
Status |
| RoHS Directive |
Compliant |
| REACH Regulation |
Compliant |
| Lead-Free (Pb-Free) |
Yes |
| Halogen-Free |
Available |
| MSL Rating |
Level 3 |
| JTAG (IEEE 1149.1) |
Supported |
XC2C512-10FGG324C Technical Highlights Summary
The XC2C512-10FGG324C represents Xilinx’s commitment to high-performance, low-power programmable logic. Its 512 macrocells provide ample logic density for complex designs. The CoolRunner-II architecture delivers industry-leading power efficiency without compromising speed.
Key advantages include instant-on operation, non-volatile configuration, and broad I/O voltage compatibility. The 324-pin FBGA package maximizes routing flexibility with 270 user I/O pins. In-system programmability enables field updates and design iterations.
For engineers requiring reliable CPLD solutions, the XC2C512-10FGG324C offers proven performance. Its combination of logic density, speed, and power efficiency makes it suitable for diverse applications across multiple industries.
Frequently Asked Questions About XC2C512-10FGG324C
What is the maximum operating frequency of XC2C512-10FGG324C?
The XC2C512-10FGG324C supports clock frequencies up to 128 MHz. Actual achievable frequency depends on the specific design implementation and routing.
Is the XC2C512-10FGG324C suitable for new designs?
Yes, the XC2C512-10FGG324C remains a viable choice for appropriate applications. However, designers should verify current availability and consider lifecycle status with their distributor.
What software do I need to program XC2C512-10FGG324C?
Xilinx ISE Design Suite supports XC2C512-10FGG324C development. The free WebPACK edition includes full CPLD design capabilities including synthesis, simulation, and programming.
Can XC2C512-10FGG324C operate at 3.3V I/O?
Yes, the XC2C512-10FGG324C supports multiple I/O standards including 1.5V, 1.8V, 2.5V, and 3.3V. Different I/O banks can operate at different voltage levels.
What is the difference between FGG324 and FG324 packages?
The “G” in FGG324 indicates lead-free (green) packaging. FGG324 is RoHS compliant while FG324 may contain lead-based solder balls.
