Overview of XCZU27DR-2FFVE1156I FPGA
The XCZU27DR-2FFVE1156I is a cutting-edge System-on-Chip (SoC) from AMD Xilinx’s Zynq UltraScale+ RFSoC family, designed to revolutionize wireless communications and RF signal processing applications. This powerful Xilinx FPGA integrates RF data converters, programmable logic, and processing systems into a single, highly efficient platform, making it ideal for 5G infrastructure, software-defined radio, and high-speed data acquisition systems.
Key Features and Specifications
Core Architecture
| Feature |
Specification |
| Logic Cells |
930,300 cells |
| Technology Node |
16nm FinFET |
| Package Type |
1156-Ball FCBGA (FFVE1156) |
| Operating Voltage |
0.85V core |
| Speed Grade |
-2 (Industrial grade) |
| Temperature Range |
Industrial (I-grade): -40°C to 100°C |
Processing System
| Component |
Details |
| Application Processor |
Quad-core ARM Cortex-A53 (64-bit) up to 1.5 GHz |
| Real-Time Processor |
Dual-core ARM Cortex-R5 (32-bit) up to 600 MHz |
| GPU |
Mali-400 MP2 Graphics Processing Unit |
| Memory Interfaces |
DDR4, DDR3L, LPDDR4 support |
RF Data Converter Subsystem
| Converter Type |
Quantity |
Maximum Sample Rate |
Resolution |
| RF-ADC |
8 channels |
4.096 GSPS |
12-bit with DDC |
| RF-DAC |
8 channels |
6.554 GSPS |
14-bit with DUC |
| Soft-Decision FEC |
8 engines |
N/A |
Integrated |
Programmable Logic Resources
| Resource |
Count |
| CLB Flip-Flops |
744,960 |
| CLB LUTs |
372,480 |
| Block RAM (Mb) |
25.9 Mb |
| UltraRAM (Mb) |
27 Mb |
| DSP Slices |
4,272 |
| PCIe Gen2/Gen3/Gen4 |
Integrated |
| 100G Ethernet |
Integrated MAC |
Technical Advantages
High-Speed RF Signal Processing
The XCZU27DR-2FFVE1156I excels in direct RF sampling applications, eliminating the need for external mixers and significantly reducing system complexity. With eight 12-bit RF-ADCs capable of sampling at up to 4.096 GSPS and eight 14-bit RF-DACs operating at 6.554 GSPS, this FPGA enables:
- Direct RF-to-baseband conversion
- Multi-band, multi-mode radio implementations
- Reduced power consumption and board space
- Enhanced signal integrity and performance
Advanced Digital Signal Processing
The device features 4,272 DSP slices optimized for high-performance signal processing tasks including FFT operations, digital filtering, and channel estimation. Combined with integrated digital down-converters (DDC) and digital up-converters (DUC), the XCZU27DR-2FFVE1156I provides complete signal chain functionality on a single chip.
Versatile Processing Capabilities
The heterogeneous processing architecture combines:
- ARM Cortex-A53 for complex software applications and operating systems
- ARM Cortex-R5 for deterministic real-time control
- Programmable Logic for custom hardware acceleration
- GPU for graphics and parallel processing workloads
Target Applications
5G Wireless Infrastructure
The XCZU27DR-2FFVE1156I is specifically designed for next-generation wireless base stations and radio units. Key applications include:
- Massive MIMO systems
- Beamforming implementations
- Multi-carrier radio systems
- CPRI/eCPRI fronthaul interfaces
- O-RAN compliant radio units
Cable Infrastructure (DOCSIS)
Ideal for cable modem termination systems (CMTS) and distributed access architecture (DAA) implementations, supporting:
- DOCSIS 3.1 and 4.0 standards
- Full duplex DOCSIS
- Remote PHY and MAC-PHY architectures
- High-density channel processing
Aerospace and Defense
The industrial-grade temperature range and radiation-tolerant options make this device suitable for:
- Phased array radar systems
- Electronic warfare applications
- Satellite communications
- Software-defined radio platforms
- Secure communications systems
Test and Measurement
Professional test equipment manufacturers utilize the XCZU27DR-2FFVE1156I for:
- Vector signal generators
- Spectrum analyzers
- Oscilloscopes with RF analysis
- Protocol analyzers
- Network testing equipment
Design Ecosystem and Development Tools
Vivado Design Suite
AMD provides comprehensive development tools including:
- Vivado ML Standard/Enterprise editions
- High-Level Synthesis (HLS) for C/C++ design entry
- Model Composer for MATLAB/Simulink integration
- Vitis Unified Software Platform
- PetaLinux for embedded Linux development
IP Core Portfolio
Access to extensive IP libraries including:
- RF data converter IP
- Soft-decision FEC encoders/decoders
- DSP algorithms (FFT, FIR, etc.)
- Communication protocols
- Memory controllers
- High-speed transceivers
Power and Thermal Management
| Parameter |
Typical Value |
Maximum Value |
| Static Power |
~5-8W |
Varies by configuration |
| Dynamic Power |
15-25W |
Design dependent |
| Junction Temperature |
<85°C recommended |
100°C maximum |
| Thermal Resistance (θJA) |
~7-10°C/W |
Package dependent |
Effective thermal solutions such as heat sinks, air flow management, and thermal interface materials are recommended for optimal performance and reliability.
Package and Physical Specifications
FFVE1156 Package Details
| Specification |
Value |
| Package Style |
Flip-Chip BGA |
| Pin Count |
1156 balls |
| Body Size |
42.5mm × 42.5mm |
| Ball Pitch |
1.0mm |
| Height |
~3.2mm typical |
| Weight |
~8-10 grams |
PCB Design Considerations
- Minimum 10-layer PCB recommended
- Controlled impedance traces for high-speed signals
- Multiple ground and power planes
- Via-in-pad technology for optimal signal integrity
- DDR4 routing requires length matching within ±5 mils
Comparison: XCZU27DR vs XCZU47DR
| Feature |
XCZU27DR-2FFVE1156I |
XCZU47DR-2FFVE1156I |
| Logic Cells |
930,300 |
930,300 |
| RF-ADC Channels |
8 (12-bit @ 4.096 GSPS) |
0 |
| RF-DAC Channels |
8 (14-bit @ 6.554 GSPS) |
0 |
| SD-FEC Engines |
8 |
8 |
| Target Applications |
RF-centric wireless/cable |
Signal processing intensive |
| Typical Use Cases |
Base stations, DOCSIS |
Data centers, ML inference |
The XCZU47DR variant focuses more on compute-intensive applications without RF converters, while the XCZU27DR excels in direct RF sampling applications.
Ordering Information and Part Number Breakdown
Part Number: XCZU27DR-2FFVE1156I
- XCZU27DR – Device family and size
- -2 – Speed grade (industrial temperature range performance)
- FF – Flip-chip package
- VE – Package variant
- 1156 – Ball count
- I – Industrial temperature grade (-40°C to 100°C)
Related Part Numbers
- XCZU27DR-1FFVE1156I (Speed grade -1)
- XCZU27DR-2FFVE1156E (Extended temperature grade)
- XCZU27DR-L2FFVE1156E (Low-power version)
- XCZU27DR-2FSVE1156I (Different package variant)
Quality and Reliability
Manufacturing Standards
- ISO 9001:2015 certified manufacturing
- JEDEC qualification standards
- RoHS compliant
- Lead-free (Pb-free) package options
- MSL (Moisture Sensitivity Level) rating: Level 3
Reliability Metrics
| Parameter |
Value |
| MTBF |
>1,000,000 hours |
| FIT Rate |
<100 FITs @ 55°C |
| Lifecycle |
10+ years production |
| AEC-Q100 Option |
Available for automotive |
Getting Started
Evaluation Platforms
Several development kits support the XCZU27DR family:
- ZCU111 Evaluation Kit – Full-featured RFSoC development platform
- RFSoC Explorer Kit – Cost-optimized evaluation board
- Third-Party Boards – Available from ecosystem partners
Documentation Resources
- Product Brief and Data Sheet (DS889)
- Technical Reference Manual (UG1085)
- PCB Design Guide
- Thermal Design Guide
- Power Estimator Spreadsheet
Supply Chain and Availability
The XCZU27DR-2FFVE1156I is available through:
- Authorized distributors (Digi-Key, Mouser, Avnet, Arrow)
- Direct from AMD Xilinx
- Franchise distributors globally
- Lead times: typically 16-26 weeks (subject to market conditions)
Storage and Handling
- Store in moisture barrier bag with desiccant
- Baking required if MSL exposure exceeded
- ESD precautions mandatory (Class 1 HBM rating)
- Recommended shelf life: 12 months in sealed bag
Frequently Asked Questions
Q: What is the difference between the XCZU27DR and XCZU29DR?
The XCZU29DR features additional RF-DAC channels and enhanced processing capabilities, making it suitable for more demanding applications requiring higher channel density.
Q: Can I use this device for commercial temperature applications?
Yes, the “I” grade designation indicates this device is qualified for industrial temperature range (-40°C to 100°C), which encompasses commercial applications (0°C to 85°C).
Q: What programming languages are supported?
The device supports multiple design entry methods including Verilog, VHDL, SystemVerilog, C/C++ (via HLS), and MATLAB/Simulink (via Model Composer).
Q: Is there a radiation-hardened version available?
While the commercial XCZU27DR is not radiation-hardened, AMD Xilinx offers XQRKU060 and other space-grade devices with similar capabilities for aerospace applications.
Q: What is the approximate cost?
Pricing varies based on volume and distributor but typically ranges from $3,000 to $5,000 per unit in moderate quantities. Contact authorized distributors for current pricing and volume discounts.
Conclusion
The XCZU27DR-2FFVE1156I represents a significant advancement in programmable RF system integration, combining high-performance RF data converters, advanced processing capabilities, and flexible programmable logic in a single device. Whether you’re designing next-generation 5G infrastructure, implementing software-defined radio solutions, or developing high-performance test equipment, this Zynq UltraScale+ RFSoC provides the performance, integration, and flexibility required for today’s most demanding applications.
For technical support, design resources, and purchasing information, consult with authorized Xilinx FPGA distributors or visit the official AMD Xilinx website for comprehensive documentation and design tools.
