Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XCZU28DR-2FFVG1517E: Xilinx Zynq UltraScale+ RFSoC FPGA for 5G and Wireless Applications

Product Details

The XCZU28DR-2FFVG1517E is a high-performance Xilinx FPGA from the Zynq UltraScale+ RFSoC family. This advanced System-on-Chip (SoC) integrates RF data converters, programmable logic, and a powerful ARM-based processing system into a single 16nm FinFET+ device. Designed for 5G wireless infrastructure, software-defined radio, and cable access applications, the XCZU28DR-2FFVG1517E delivers exceptional performance with reduced power consumption and board footprint.

XCZU28DR-2FFVG1517E Key Features and Benefits

The XCZU28DR-2FFVG1517E stands out in the RFSoC product lineup by combining direct RF-sampling technology with heterogeneous processing capabilities. This integration eliminates the need for external data converters, reducing system power by up to 50-75% compared to multi-chip solutions.

Integrated RF Data Converter Subsystem

The RF data converter subsystem is the defining feature of the XCZU28DR-2FFVG1517E. It enables direct RF sampling across frequency bands up to 6 GHz, making it ideal for next-generation wireless deployments.

RF Data Converter Specification Value
RF-ADC Channels 8 Channels
RF-ADC Sampling Rate Up to 4.096 GSPS
RF-ADC Resolution 12-bit
RF-DAC Channels 8 Channels
RF-DAC Sampling Rate Up to 6.554 GSPS
RF-DAC Resolution 14-bit
Analog Bandwidth Up to 6 GHz

Digital Signal Processing Features

The RF converters include integrated digital down converters (DDCs) and digital up converters (DUCs) with programmable interpolation, decimation, NCO, and complex mixer functionality. These features support dual-band operation and efficient signal processing.

XCZU28DR-2FFVG1517E Technical Specifications

Processing System Specifications

The XCZU28DR-2FFVG1517E features a comprehensive ARM-based processing system capable of running Linux and real-time operating systems simultaneously.

Processing System Component Specification
Application Processor Quad-core ARM Cortex-A53 (64-bit)
Application Processor Speed Up to 1.5 GHz
Real-Time Processor Dual-core ARM Cortex-R5F
L1 Cache (APU) 32KB I-Cache / 32KB D-Cache per core
L2 Cache (APU) 1 MB shared
On-Chip Memory 256 KB with ECC

Programmable Logic Resources

FPGA Resource Quantity
System Logic Cells 930,300
CLB LUTs 425,280
CLB Flip-Flops 850,560
Distributed RAM 13.0 Mb
Block RAM (36Kb blocks) 1,080 blocks (38.0 Mb)
UltraRAM (288Kb blocks) 80 blocks (22.5 Mb)
DSP Slices (27×18 multipliers) 4,272

High-Speed Connectivity

Interface Type Specification
GTY Transceivers 16 channels
GTY Data Rate Up to 32.75 Gb/s
PS-GTR Transceivers 4 channels
PCIe Support Gen3 x16
100G Ethernet Hardened MAC
Interlaken Supported

XCZU28DR-2FFVG1517E Package and Electrical Characteristics

Package Information

Parameter Value
Package Type FCBGA (Flip-Chip Ball Grid Array)
Package Code FFVG1517
Pin Count 1,517 balls
Package Dimensions 40mm × 40mm
Ball Pitch 1.0 mm
Temperature Grade E (Extended: 0°C to 100°C)

Electrical Specifications

Parameter Value
Core Voltage (VCCINT) 0.85V
Process Technology 16nm FinFET+
Speed Grade -2 (Highest Performance)
Maximum PL Frequency 933 MHz
RoHS Compliance Yes
REACH Compliance Compliant

XCZU28DR-2FFVG1517E Applications

The XCZU28DR-2FFVG1517E excels in applications requiring high-bandwidth RF signal processing combined with flexible digital processing.

Primary Application Areas

  • 5G Wireless Infrastructure: Massive MIMO base stations and remote radio heads
  • Software-Defined Radio (SDR): Multi-band, multi-mode cellular radios
  • Cable Infrastructure: DOCSIS 3.1 remote PHY devices
  • Aerospace and Defense: Phased array radar and electronic warfare systems
  • Test and Measurement: High-speed data acquisition and signal generation
  • Data Centers: Accelerated computing and network processing

Soft-Decision FEC (SD-FEC) Integration

The XCZU28DR-2FFVG1517E includes hardened SD-FEC blocks supporting:

  • LDPC (Low-Density Parity Check) encode/decode for 5G NR
  • Turbo decode for LTE applications
  • Throughput exceeding 1 Gb/s
  • Lower latency than soft-logic implementations

Development Tools and Support

Vivado Design Suite Compatibility

The XCZU28DR-2FFVG1517E is fully supported by AMD Vivado Design Suite, offering:

  • IP Integrator for system-level design
  • RF Data Converter IP with evaluation tools
  • High-Level Synthesis (HLS) support
  • Simulation and verification capabilities

Evaluation Platform

The ZCU111 Evaluation Kit features the XCZU28DR-2FFVG1517E and provides:

  • Complete hardware platform for RF development
  • XM500 RFMC balun transformer add-on card
  • FMC+ interface for I/O expansion
  • Pre-built reference designs

XCZU28DR-2FFVG1517E Part Number Breakdown

Code Segment Meaning
XC Xilinx Commercial
ZU28DR Zynq UltraScale+ RFSoC, Device 28
-2 Speed Grade (-2 is fastest)
FF Flip-Chip Package
V Lead-Free (RoHS Compliant)
G Lid Material
1517 Pin Count
E Extended Temperature Grade

Ordering Information and Availability

Part Number Description Package Temp Grade
XCZU28DR-2FFVG1517E Zynq UltraScale+ RFSoC, -2 Speed 1517 FCBGA Extended
XCZU28DR-2FFVG1517I Zynq UltraScale+ RFSoC, -2 Speed 1517 FCBGA Industrial
XCZU28DR-1FFVG1517I Zynq UltraScale+ RFSoC, -1 Speed 1517 FCBGA Industrial

Why Choose the XCZU28DR-2FFVG1517E?

The XCZU28DR-2FFVG1517E offers engineers a single-chip solution that combines:

  1. Reduced System Complexity: Integrated RF converters eliminate external ADC/DAC components
  2. Lower Power Consumption: 50-75% power reduction compared to discrete solutions
  3. Smaller Form Factor: Monolithic integration minimizes board space requirements
  4. Future-Proof Architecture: Programmable logic enables adaptation to evolving standards
  5. High-Performance Computing: Quad-core ARM processors handle complex software stacks

For wireless infrastructure manufacturers deploying Massive MIMO systems, cable operators implementing remote PHY architectures, or defense contractors developing next-generation radar systems, the XCZU28DR-2FFVG1517E provides the performance, integration, and flexibility required for success.


The XCZU28DR-2FFVG1517E is manufactured by AMD (formerly Xilinx) and represents the cutting edge of adaptive RF SoC technology for demanding wireless and signal processing applications.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.