The XCZU27DR-1FFVE1156I is a high-performance Xilinx FPGA from the Zynq UltraScale+ RFSoC family. This industrial-grade System-on-Chip (SoC) combines programmable logic, advanced RF data converters, and a powerful multicore processing system into a single 16nm FinFET device. Designed for demanding wireless infrastructure, aerospace, and defense applications, the XCZU27DR-1FFVE1156I delivers exceptional performance for software-defined radio (SDR) systems.
XCZU27DR-1FFVE1156I Key Features Overview
The XCZU27DR-1FFVE1156I integrates multiple critical subsystems that enable complete RF-to-baseband signal processing on a single chip. This monolithic integration eliminates external data converters, reducing system power consumption by up to 50-75% compared to discrete multi-chip solutions.
Processing System Highlights
- 64-bit Quad-Core Arm Cortex-A53 MPCore with CoreSight debug capability
- Dual-Core Arm Cortex-R5F real-time processor with floating-point unit
- 256KB On-Chip Memory with ECC protection
- 32KB/32KB L1 Cache and 1MB L2 Cache for APU
RF Data Converter Integration
The XCZU27DR-1FFVE1156I features integrated RF-class analog-to-digital and digital-to-analog converters, enabling direct RF sampling without external components.
XCZU27DR-1FFVE1156I Specifications Table
| Parameter |
Specification |
| Manufacturer |
Xilinx (AMD) |
| Part Number |
XCZU27DR-1FFVE1156I |
| Family |
Zynq UltraScale+ RFSoC |
| Logic Cells |
930,300 |
| Process Technology |
16nm FinFET |
| Package Type |
1156-Ball FCBGA |
| Speed Grade |
-1 (Standard Performance) |
| Temperature Grade |
Industrial (-40°C to +100°C) |
| Core Voltage (VCCINT) |
0.85V |
| Operating Voltage |
1V nominal |
XCZU27DR-1FFVE1156I Processor Specifications
| Component |
Specification |
| Application Processing Unit (APU) |
Quad-Core Arm Cortex-A53 (64-bit) |
| APU Features |
NEON SIMD, Single/Double Precision FPU |
| APU L1 Cache |
32KB Instruction / 32KB Data per core |
| APU L2 Cache |
1MB Shared |
| Real-Time Processing Unit (RPU) |
Dual-Core Arm Cortex-R5F |
| RPU Features |
Single/Double Precision FPU, CoreSight |
| RPU L1 Cache |
32KB Instruction / 32KB Data |
| On-Chip Memory |
256KB with ECC |
| Processor Speed |
Up to 1.333 GHz (APU) / 533 MHz (RPU) |
XCZU27DR-1FFVE1156I RF Data Converter Specifications
The integrated RF data converters in the XCZU27DR-1FFVE1156I enable direct RF sampling capabilities critical for 5G, radar, and electronic warfare systems.
| RF Converter |
Specification |
| RF-ADC Resolution |
12-bit / 14-bit |
| RF-ADC Sample Rate |
Up to 4.096 GSPS |
| RF-DAC Resolution |
14-bit |
| RF-DAC Sample Rate |
Up to 6.554 GSPS |
| Analog Bandwidth |
Up to 6 GHz |
| RF Input Frequency |
Up to 6 GHz direct sampling |
| DDC/DUC |
Integrated Digital Down/Up Converters |
| NCO |
Programmable Numerically Controlled Oscillator |
XCZU27DR-1FFVE1156I Connectivity & Peripherals
Supported Interface Protocols
| Interface Category |
Supported Protocols |
| Serial Communication |
UART/USART, SPI, I²C |
| Storage Interfaces |
MMC/SD/SDIO, NAND Flash, Quad-SPI |
| Network Connectivity |
Gigabit Ethernet, USB OTG |
| Industrial Protocols |
CANbus |
| Memory Interface |
EBI/EMI, External DDR4 |
| System Control |
DMA Controller, Watchdog Timer (WDT) |
| High-Speed Serial |
PS-GTR Transceivers |
Multiplexed I/O (MIO)
The XCZU27DR-1FFVE1156I provides up to 78 dedicated multiplexed I/O pins with flexible peripheral assignment. Extended MIO (EMIO) enables routing additional peripheral signals through programmable logic.
XCZU27DR-1FFVE1156I Programmable Logic Resources
| Resource |
Quantity |
| System Logic Cells |
930,300 |
| CLB Flip-Flops |
High Density |
| CLB LUTs |
High Density |
| DSP Slices |
4,272 |
| Block RAM |
Available |
| UltraRAM |
Available |
| PCIe Blocks |
Gen3 Integrated |
| 100G Ethernet |
Hardened MAC |
XCZU27DR-1FFVE1156I SD-FEC (Soft Decision Forward Error Correction)
The XCZU27DR-1FFVE1156I includes hardened SD-FEC blocks supporting advanced error correction algorithms essential for wireless communications.
| SD-FEC Feature |
Specification |
| LDPC Decode/Encode |
Supported (5G, DOCSIS) |
| Turbo Decode |
Supported (LTE, WiMAX) |
| Throughput |
Over 1 Gb/s |
| Latency |
Low latency operation |
| Power Efficiency |
Lower than soft logic implementations |
XCZU27DR-1FFVE1156I Target Applications
Wireless Infrastructure
- 5G New Radio (NR) base stations
- Massive MIMO systems
- LTE/LTE-Advanced equipment
- Small cells and macro cells
- Remote radio heads (RRH)
Aerospace & Defense
- Software-defined radio (SDR) platforms
- Electronic warfare (EW) systems
- Phased array radar systems
- SIGINT and communications intelligence
- Satellite communications
Cable Infrastructure
- DOCSIS 3.1 cable modems
- Remote PHY nodes
- Cable access network equipment
- CMTS equipment
Test & Measurement
- RF signal analyzers
- Arbitrary waveform generators
- High-speed data acquisition systems
- Wireless protocol testers
XCZU27DR-1FFVE1156I Package Information
| Package Parameter |
Specification |
| Package Type |
FCBGA (Flip-Chip Ball Grid Array) |
| Pin Count |
1156 Balls |
| Ball Pitch |
Fine pitch |
| Package Code |
FFVE1156 |
| Moisture Sensitivity |
MSL-3 (typical) |
| Lead-Free |
RoHS Compliant |
XCZU27DR-1FFVE1156I Part Number Breakdown
Understanding the XCZU27DR-1FFVE1156I part number helps identify device specifications:
| Code Segment |
Meaning |
| XC |
Xilinx Commercial |
| ZU27 |
Zynq UltraScale+ Device 27 |
| DR |
RFSoC (RF Data Converter) variant |
| -1 |
Speed Grade 1 (Standard) |
| FFV |
Package Style (FCBGA) |
| E |
Ball arrangement/version |
| 1156 |
Pin Count |
| I |
Industrial Temperature Grade |
XCZU27DR-1FFVE1156I Development Tools & Software
Vivado Design Suite
The XCZU27DR-1FFVE1156I is fully supported by AMD Vivado Design Suite, providing:
- IP Integrator for system-level design
- High-Level Synthesis (HLS) support
- RF Data Converter IP core
- SD-FEC IP integration
- Comprehensive timing analysis
Vitis Software Platform
- Embedded software development
- AI/ML acceleration frameworks
- Hardware-software co-design
- Debug and profiling tools
XCZU27DR-1FFVE1156I Ordering Information
| Order Code |
Description |
| XCZU27DR-1FFVE1156I |
Industrial temp, Speed Grade -1 |
| XCZU27DR-2FFVE1156I |
Industrial temp, Speed Grade -2 |
| XCZU27DR-1FFVE1156E |
Extended temp, Speed Grade -1 |
| XCZU27DR-2FFVE1156E |
Extended temp, Speed Grade -2 |
Why Choose XCZU27DR-1FFVE1156I?
The XCZU27DR-1FFVE1156I represents the pinnacle of RF-capable SoC technology. By integrating high-speed RF data converters, powerful processing, and flexible programmable logic, this device enables:
- Reduced System Complexity – Single-chip RF-to-baseband solution
- Lower Power Consumption – 50-75% reduction vs. discrete solutions
- Smaller Form Factor – Eliminates external ADC/DAC components
- Faster Time-to-Market – Comprehensive IP ecosystem
- Future-Proof Design – Software-defined flexibility
XCZU27DR-1FFVE1156I Technical Support Resources
- AMD/Xilinx Technical Documentation
- Zynq UltraScale+ RFSoC Data Sheet (DS889)
- DC and AC Switching Characteristics (DS926)
- RF Data Converter IP Product Guide
- Vivado Design Suite User Guides
