What is XCZU29DR-1FSVF1760E?
The XCZU29DR-1FSVF1760E is a high-performance Radio Frequency System-on-Chip (RFSoC) from AMD’s Xilinx FPGA portfolio. This advanced integrated circuit belongs to the Zynq UltraScale+ RFSoC family and combines powerful programmable logic with integrated RF data converters, making it an ideal solution for next-generation wireless communications and software-defined radio (SDR) applications.
The XCZU29DR-1FSVF1760E integrates a feature-rich processing system, high-speed transceivers, and direct RF-sampling analog-to-digital converters (RF-ADCs) and digital-to-analog converters (RF-DACs) on a single chip. This integration eliminates the need for external RF components, significantly reducing system complexity, power consumption, and overall bill of materials (BOM) cost.
XCZU29DR-1FSVF1760E Key Specifications
| Parameter |
Specification |
| Manufacturer |
AMD (formerly Xilinx) |
| Part Number |
XCZU29DR-1FSVF1760E |
| Product Family |
Zynq UltraScale+ RFSoC |
| Process Technology |
20nm FinFET+ |
| Speed Grade |
-1 (Standard Performance) |
| Temperature Grade |
E (Extended: 0°C to 100°C) |
| Package Type |
FSVF1760 (1760-Pin FCBGA) |
| Operating Voltage (VCCINT) |
0.85V |
| Logic Cells |
930,300 |
| RoHS Compliant |
Yes |
Programmable Logic Resources
The XCZU29DR-1FSVF1760E offers substantial programmable logic (PL) resources for implementing custom digital signal processing, communication protocols, and hardware acceleration.
| Resource Type |
Quantity |
| System Logic Cells |
930,300 |
| CLB Flip-Flops |
850,560 |
| CLB LUTs |
425,280 |
| Distributed RAM (Kb) |
9,180 |
| Block RAM (Kb) |
22,680 |
| UltraRAM (Kb) |
36,000 |
| DSP Slices |
4,272 |
Processing System (PS) Architecture
Application Processing Unit (APU)
The XCZU29DR-1FSVF1760E features a powerful quad-core ARM Cortex-A53 application processing unit designed for high-performance computing tasks.
| APU Feature |
Specification |
| Processor Cores |
Quad-core ARM Cortex-A53 |
| Architecture |
64-bit ARMv8 |
| L1 Cache |
32KB Instruction / 32KB Data per core |
| L2 Cache |
1MB Shared |
| Features |
NEON SIMD, Single/Double Precision Floating Point |
| Debug Support |
ARM CoreSight Technology |
Real-Time Processing Unit (RPU)
For deterministic, real-time processing requirements, the device includes a dual-core ARM Cortex-R5F real-time processing unit.
| RPU Feature |
Specification |
| Processor Cores |
Dual-core ARM Cortex-R5F |
| L1 Cache |
32KB Instruction / 32KB Data per core |
| TCM (Tightly Coupled Memory) |
128KB per core |
| Features |
Single/Double Precision Floating Point |
| Lock-Step Mode |
Supported |
RF Data Converter Specifications
The integrated RF data converters are what distinguish the XCZU29DR-1FSVF1760E from standard FPGAs, enabling direct RF-to-digital conversion without external components.
RF Analog-to-Digital Converters (RF-ADC)
| RF-ADC Parameter |
Specification |
| Number of Channels |
16 |
| Resolution |
12-bit |
| Maximum Sample Rate |
2.058 GSPS |
| Input Bandwidth |
Up to 4 GHz |
| Digital Down Converter (DDC) |
Integrated |
| Decimation Rates |
Programmable |
| NCO (Numerically Controlled Oscillator) |
Included |
RF Digital-to-Analog Converters (RF-DAC)
| RF-DAC Parameter |
Specification |
| Number of Channels |
16 |
| Resolution |
14-bit |
| Maximum Sample Rate |
6.554 GSPS |
| Output Bandwidth |
>4 GHz |
| Digital Up Converter (DUC) |
Integrated |
| Interpolation Rates |
Programmable |
| NCO (Numerically Controlled Oscillator) |
Included |
High-Speed Serial Transceivers
The XCZU29DR-1FSVF1760E provides extensive high-speed connectivity options for backhaul and inter-chip communication.
| Transceiver Type |
Quantity |
Maximum Data Rate |
| GTY Transceivers |
16 |
Up to 32.75 Gb/s |
| PS-GTR Transceivers |
4 |
Up to 6 Gb/s |
Supported Protocols
- PCIe Gen3 x16 / Gen4 x8
- 100G Ethernet
- 150G Interlaken
- CPRI / eCPRI
- JESD204B/C
- SATA 3.1
- USB 3.0
- DisplayPort 1.2
Memory Interfaces
| Memory Type |
Support |
| DDR4 |
Up to 2,400 MT/s |
| DDR3/DDR3L |
Supported |
| LPDDR4 |
Supported |
| LPDDR3 |
Supported |
| On-Chip Memory |
256KB with ECC |
| Quad-SPI Flash |
Supported |
| NAND Flash |
Supported |
| eMMC |
Supported |
Package Information
| Package Parameter |
Specification |
| Package Code |
FSVF1760 |
| Package Type |
Flip-Chip Ball Grid Array (FCBGA) |
| Pin Count |
1760 |
| Ball Pitch |
1.0mm |
| Package Dimensions |
42.5mm × 42.5mm |
| Lead-Free |
Yes |
XCZU29DR-1FSVF1760E Target Applications
The XCZU29DR-1FSVF1760E is specifically designed for demanding RF and wireless communication applications:
Wireless Infrastructure
- 5G New Radio (NR) Base Stations
- 4G LTE Macro and Small Cells
- Massive MIMO Systems
- Wireless Backhaul
Cable Infrastructure
- DOCSIS 3.1 Cable Modems and CMTSs
- Remote PHY Devices (RPD)
- Distributed Access Architecture (DAA)
Defense and Aerospace
- Software-Defined Radio (SDR)
- Electronic Warfare Systems
- Radar Signal Processing
- SIGINT Applications
Test and Measurement
- RF Signal Generators
- Spectrum Analyzers
- Protocol Analyzers
- Channel Emulators
Part Number Decoder: XCZU29DR-1FSVF1760E
Understanding the part number helps identify the exact device configuration:
| Code Segment |
Meaning |
| XC |
Commercial Grade |
| ZU29DR |
Zynq UltraScale+ RFSoC, 29DR variant |
| -1 |
Speed Grade: Standard Performance |
| F |
Lead-Free Package |
| SVF |
Package Variant (Flip-Chip BGA) |
| 1760 |
Pin Count |
| E |
Extended Temperature Range (0°C to 100°C) |
Related Part Numbers
| Part Number |
Speed Grade |
Temperature |
Package |
| XCZU29DR-1FSVF1760E |
-1 |
Extended |
FSVF1760 |
| XCZU29DR-1FSVF1760I |
-1 |
Industrial |
FSVF1760 |
| XCZU29DR-1FFVF1760E |
-1 |
Extended |
FFVF1760 |
| XCZU29DR-1FFVF1760I |
-1 |
Industrial |
FFVF1760 |
| XCZU29DR-2FFVF1760I |
-2 |
Industrial |
FFVF1760 |
Development Tools and Software Support
The XCZU29DR-1FSVF1760E is fully supported by AMD’s comprehensive development ecosystem:
- Vivado Design Suite – For FPGA design, synthesis, and implementation
- Vitis Unified Software Platform – For embedded software development
- PetaLinux Tools – For Linux-based embedded systems
- Model Composer – For model-based design with MATLAB/Simulink
- System Generator for DSP – For DSP algorithm development
Why Choose XCZU29DR-1FSVF1760E?
- Integrated RF Data Converters – Eliminates external ADC/DAC components, reducing system complexity and cost
- High Channel Density – 16 RF-ADC and 16 RF-DAC channels for massive MIMO and multi-carrier applications
- Powerful Processing – Quad-core ARM Cortex-A53 + Dual-core ARM Cortex-R5F for flexible software development
- Extensive Programmable Logic – Over 930K logic cells for custom hardware acceleration
- High-Speed Connectivity – 16 GTY transceivers supporting up to 32.75 Gb/s each
- Reduced Power Consumption – 20nm FinFET+ process technology delivers excellent power efficiency
- Single-Chip Solution – Complete RF-to-baseband processing on one device
Order XCZU29DR-1FSVF1760E Today
The XCZU29DR-1FSVF1760E represents the pinnacle of RF system integration, combining high-performance computing, programmable logic, and direct RF sampling capabilities in a single device. Whether you’re developing 5G infrastructure, software-defined radios, or advanced test equipment, this RFSoC delivers the performance and flexibility needed for next-generation wireless systems.
Contact us for pricing, availability, and technical support for the XCZU29DR-1FSVF1760E and other Zynq UltraScale+ RFSoC devices.
