What is the XCZU29DR-1FSVF1760I?
The XCZU29DR-1FSVF1760I is a high-performance Xilinx FPGA from AMD’s Zynq UltraScale+ RFSoC family. This advanced system-on-chip combines powerful programmable logic, integrated RF data converters, and a heterogeneous processing system in a single device. Designed for demanding industrial applications, the XCZU29DR-1FSVF1760I delivers exceptional performance in 5G wireless infrastructure, software-defined radio (SDR), aerospace systems, and high-speed data acquisition.
Furthermore, this RFSoC device integrates 16 RF-ADC and 16 RF-DAC channels directly on-chip, eliminating the need for external converter ICs. As a result, engineers can significantly reduce board complexity, lower power consumption, and achieve superior signal integrity in their designs.
XCZU29DR-1FSVF1760I Key Features and Benefits
Integrated RF Data Converters
The XCZU29DR-1FSVF1760I features industry-leading integrated RF converters that set it apart from traditional FPGA solutions:
| Feature |
Specification |
| RF-ADC Channels |
16 channels |
| RF-ADC Resolution |
12-bit |
| RF-ADC Sample Rate |
Up to 2.058 GSPS |
| RF-DAC Channels |
16 channels |
| RF-DAC Resolution |
14-bit |
| RF-DAC Sample Rate |
Up to 6.554 GSPS |
| Digital Down Converter (DDC) |
Integrated |
| Digital Up Converter (DUC) |
Integrated |
| NCO Resolution |
48-bit |
Moreover, these converters include programmable digital down converters (DDC) and digital up converters (DUC) with numerically controlled oscillators (NCO). Consequently, the XCZU29DR-1FSVF1760I enables direct RF sampling architectures that simplify system design while improving performance.
Powerful Processing System
| Processing Component |
Specification |
| Application Processing Unit (APU) |
Quad-core ARM Cortex-A53 (64-bit) |
| APU Maximum Frequency |
Up to 1.5 GHz |
| Real-Time Processing Unit (RPU) |
Dual-core ARM Cortex-R5F (32-bit) |
| RPU Maximum Frequency |
Up to 600 MHz |
| L1 Cache |
32KB/32KB per core |
| L2 Cache |
1MB shared |
| On-Chip Memory |
256KB with ECC |
| FPU Support |
Single/Double Precision |
Additionally, the heterogeneous processing architecture allows developers to partition their applications between the high-performance APU for complex algorithms and the deterministic RPU for real-time control tasks.
XCZU29DR-1FSVF1760I Technical Specifications
Programmable Logic Resources
The XCZU29DR-1FSVF1760I provides extensive programmable logic resources for implementing custom hardware accelerators and signal processing algorithms:
| Resource |
Quantity |
| System Logic Cells |
930,300 |
| CLB Flip-Flops |
850,560 |
| CLB LUTs |
425,280 |
| Distributed RAM |
5.3 Mb |
| Block RAM |
38 Mb (1,080 blocks) |
| UltraRAM |
22.5 Mb (80 blocks) |
| DSP Slices |
4,272 |
In addition, the DSP slices support 18×27 signed multiplication operations, making them ideal for implementing high-performance digital filters, FFTs, and other signal processing functions.
High-Speed Connectivity
| Interface |
Specification |
| GTY Transceivers |
16 |
| Maximum Transceiver Speed |
32.75 Gbps |
| PS-GTR Transceivers |
4 |
| PCIe Support |
Gen3 x16 / Gen4 x8 |
| 100G Ethernet |
1 MAC with RS-FEC |
| 150G Interlaken |
Supported |
| Maximum HP I/O |
312 |
| Maximum HD I/O |
48 |
Memory Interface Support
| Memory Type |
Support |
| DDR4 |
Yes |
| DDR3/DDR3L |
Yes |
| LPDDR4 |
Yes |
| LPDDR3 |
Yes |
| Quad-SPI Flash |
Yes |
| NAND Flash |
Yes |
| eMMC |
Yes |
XCZU29DR-1FSVF1760I Package Information
Physical Specifications
| Parameter |
Value |
| Package Type |
FSVF1760 |
| Package Format |
Fine-pitch BGA (FCBGA) |
| Pin Count |
1,760 pins |
| Ball Pitch |
1.0 mm |
| Package Dimensions |
42.5 mm × 42.5 mm |
| Die Size |
Multi-die with SSI technology |
Operating Conditions
| Parameter |
Specification |
| Speed Grade |
-1 (Standard Performance) |
| Temperature Grade |
Industrial (I) |
| Operating Temperature |
-40°C to +100°C |
| Core Voltage (VCCINT) |
0.85V |
| Storage Temperature |
-65°C to +150°C |
XCZU29DR-1FSVF1760I Part Number Decoder
Understanding the part number structure helps engineers select the correct variant for their application:
| Segment |
Value |
Meaning |
| XC |
XC |
Xilinx Commercial |
| ZU |
ZU |
Zynq UltraScale+ |
| 29 |
29 |
Device tier identifier |
| DR |
DR |
RFSoC with RF Data converters |
| -1 |
-1 |
Speed grade (Standard) |
| FSVF |
FSVF |
Package type (Fine-pitch BGA) |
| 1760 |
1760 |
Pin count |
| I |
I |
Industrial temperature (-40°C to +100°C) |
Related Part Numbers
| Part Number |
Difference |
| XCZU29DR-1FSVF1760E |
Extended temperature (0°C to +100°C) |
| XCZU29DR-2FSVF1760I |
Higher speed grade (-2) |
| XCZU29DR-1FFVF1760I |
Alternative package (FFVF) |
| XCZU28DR-1FFVG1517I |
Lower resource variant |
| XCZU47DR-2FFVF1760I |
Higher resource variant |
Target Applications for XCZU29DR-1FSVF1760I
5G Wireless Infrastructure
The XCZU29DR-1FSVF1760I excels in 5G base station and small cell designs. Its integrated RF converters support the wide bandwidth requirements of 5G NR, while the programmable logic enables flexible beamforming and MIMO processing. Consequently, equipment manufacturers can develop unified platforms that support multiple frequency bands and standards.
Software-Defined Radio (SDR)
For SDR applications, the XCZU29DR-1FSVF1760I provides the ideal combination of wideband RF sampling, high-performance signal processing, and flexible reconfigurability. Therefore, defense contractors and commercial SDR developers choose this device for cognitive radio, spectrum monitoring, and multi-mode communication systems.
Aerospace and Defense
In aerospace and defense applications, the industrial temperature rating and robust feature set of the XCZU29DR-1FSVF1760I make it suitable for radar systems, electronic warfare, and satellite communications. Moreover, the integrated soft-decision forward error correction (SD-FEC) accelerates LDPC and Turbo decoding for reliable data links.
Test and Measurement
High-speed data acquisition systems benefit from the XCZU29DR-1FSVF1760I’s direct RF sampling capabilities. The 16-channel ADC array enables simultaneous multi-channel capture, while the programmable logic supports real-time analysis and triggering functions.
Software and Development Tools
Vivado Design Suite
AMD’s Vivado Design Suite provides the complete development environment for the XCZU29DR-1FSVF1760I:
- RTL synthesis and implementation
- Timing analysis and optimization
- Power estimation and analysis
- Hardware debugging with ILA and VIO
Vitis Unified Platform
The Vitis platform enables software development for the embedded processors:
- Bare-metal application development
- Linux kernel and driver development
- AI/ML acceleration with Vitis AI
- Hardware-software co-design
RF Data Converter IP
Dedicated IP cores simplify RF converter configuration:
- Channel enable/disable control
- Sample rate and decimation settings
- NCO frequency programming
- Calibration and monitoring
Environmental and Compliance Information
Regulatory Compliance
| Standard |
Status |
| RoHS 2011/65/EU |
Compliant |
| REACH |
Compliant |
| Lead-free |
Yes |
| Halogen-free |
Yes |
| Conflict Minerals |
Compliant |
Quality and Reliability
| Parameter |
Specification |
| Moisture Sensitivity Level |
MSL3 |
| ESD Sensitivity (HBM) |
Class 1C (>1000V) |
| Manufacturing Standard |
ISO 9001 Certified |
| Qualification |
Industrial Grade |
Export Control
| Classification |
Value |
| ECCN |
3A001.a.7 (verify current) |
| HTS Code |
8542.31.00.01 |
| Export License |
May be required |
Technical Documentation
Engineers working with the XCZU29DR-1FSVF1760I should reference the following AMD documents:
- DS889: Zynq UltraScale+ RFSoC Data Sheet: Overview
- DS926: Zynq UltraScale+ RFSoC Data Sheet: DC and AC Switching Characteristics
- UG1085: Zynq UltraScale+ Device Technical Reference Manual
- PG269: RF Data Converter LogiCORE IP Product Guide
- UG1075: Zynq UltraScale+ Package and Pinout Files
Why Choose the XCZU29DR-1FSVF1760I?
In summary, the XCZU29DR-1FSVF1760I represents the pinnacle of programmable SoC technology for RF applications. By integrating high-performance RF data converters, powerful ARM processors, and extensive programmable logic in a single device, it enables engineers to create compact, power-efficient systems that were previously impossible.
The industrial temperature rating ensures reliable operation in demanding environments, while the comprehensive development ecosystem accelerates time-to-market. Whether you’re developing next-generation 5G infrastructure, advanced radar systems, or cutting-edge test equipment, the XCZU29DR-1FSVF1760I delivers the performance, integration, and flexibility you need.
Frequently Asked Questions
What is the difference between XCZU29DR-1FSVF1760I and XCZU29DR-1FSVF1760E?
The “I” suffix indicates industrial temperature range (-40°C to +100°C), while “E” indicates extended commercial temperature (0°C to +100°C). Choose the I-grade for harsh environment applications.
How many RF-ADC and RF-DAC channels does the XCZU29DR have?
The XCZU29DR-1FSVF1760I features 16 RF-ADC channels (12-bit, up to 2.058 GSPS) and 16 RF-DAC channels (14-bit, up to 6.554 GSPS).
What development tools are required?
AMD Vivado Design Suite for FPGA development and Vitis Unified Platform for software development. Both are available from AMD’s website.
Is evaluation hardware available?
Yes, AMD offers the ZCU1275 Characterization Kit specifically designed for the XCZU29DR family, providing access to all RF converters and transceivers for evaluation.
