Meta Description: XCZU29DR-1FFVF1760I is a high-performance AMD Xilinx Zynq UltraScale+ RFSoC featuring 930K logic cells, 16-channel RF-ADC/DAC, quad-core ARM Cortex-A53, and 4,272 DSP slices in 1760-pin FCBGA package.
What is the XCZU29DR-1FFVF1760I?
The XCZU29DR-1FFVF1760I is a cutting-edge Radio Frequency System-on-Chip (RFSoC) from the AMD Xilinx Zynq UltraScale+ family. This advanced Xilinx FPGA device integrates high-speed RF data converters with powerful programmable logic. Additionally, it features a heterogeneous processing system based on ARM Cortex processors.
Designed for demanding wireless infrastructure applications, the XCZU29DR-1FFVF1760I delivers exceptional performance. It is ideal for 5G cellular base stations, phased array radar systems, and software-defined radio platforms. Furthermore, this industrial-grade device operates reliably across extended temperature ranges.
XCZU29DR-1FFVF1760I Key Features and Benefits
High-Performance Programmable Logic
The XCZU29DR-1FFVF1760I offers massive programmable logic resources. Consequently, engineers can implement complex signal processing algorithms directly in hardware. The device includes advanced clock management and routing capabilities.
Integrated RF Data Converters
One of the most significant advantages of this RFSoC is the integrated RF subsystem. Therefore, designers can reduce system complexity significantly. The on-chip converters eliminate the need for external ADC and DAC components.
Heterogeneous Processing System
The processing system combines application and real-time processors. As a result, the XCZU29DR-1FFVF1760I handles both high-level software tasks and time-critical operations efficiently.
XCZU29DR-1FFVF1760I Technical Specifications
Programmable Logic Resources
| Parameter |
Specification |
| Logic Cells |
930,300 |
| CLB Flip-Flops |
850,560 |
| CLB LUTs |
425,280 |
| DSP Slices |
4,272 |
| Block RAM |
38 Mb |
| UltraRAM |
22.5 Mb |
| Total Internal Memory |
60.5 Mb |
RF Data Converter Specifications
| Parameter |
RF-ADC |
RF-DAC |
| Number of Channels |
16 |
16 |
| Resolution |
12-bit |
14-bit |
| Maximum Sample Rate |
2 GSPS |
6.4 GSPS |
| Noise Spectral Density |
Excellent |
Excellent |
| DDC/DUC Support |
Yes |
Yes |
| NCO and Mixer |
Integrated |
Integrated |
Processing System Architecture
| Component |
Specification |
| Application Processing Unit (APU) |
Quad-core ARM Cortex-A53 (64-bit) |
| Real-Time Processing Unit (RPU) |
Dual-core ARM Cortex-R5F |
| APU L1 Cache |
32KB/32KB (I/D) |
| APU L2 Cache |
1 MB Shared |
| On-Chip Memory |
256KB with ECC |
| Floating Point |
Single/Double Precision |
XCZU29DR-1FFVF1760I Package and Electrical Specifications
Package Information
| Parameter |
Specification |
| Part Number |
XCZU29DR-1FFVF1760I |
| Package Type |
FCBGA (Flip-Chip Ball Grid Array) |
| Pin Count |
1760 |
| Package Dimensions |
42.5mm × 42.5mm |
| Ball Pitch |
1.0mm |
| Process Technology |
16nm FinFET+ |
Electrical Characteristics
| Parameter |
Specification |
| Core Voltage (VCCINT) |
0.85V |
| Speed Grade |
-1 (Standard Performance) |
| Temperature Grade |
I (Industrial) |
| Operating Temperature |
-40°C to +100°C |
| Maximum I/O Voltage |
3.3V |
XCZU29DR-1FFVF1760I Connectivity and Interfaces
High-Speed Serial Transceivers
The XCZU29DR-1FFVF1760I includes multiple high-speed GTY transceivers. Moreover, these transceivers support various industry-standard protocols.
| Feature |
Specification |
| GTY Transceivers |
8 |
| Maximum Line Rate |
32.75 Gb/s |
| Supported Protocols |
PCIe Gen3/Gen4, 100G Ethernet, 150G Interlaken |
| Reference Clock Range |
60 MHz to 820 MHz |
Processing System Peripherals
| Interface |
Quantity/Specification |
| DDR4 Memory Controller |
64-bit with ECC |
| USB 2.0 |
2 (Host/Device/OTG) |
| Gigabit Ethernet |
4 Triple-Speed MACs |
| UART |
2 |
| CAN 2.0B |
2 |
| I2C |
2 |
| SPI |
2 |
| GPIO |
128-bit (78 MIO + 96 EMIO) |
| SD/SDIO |
2 |
| NAND Controller |
Yes |
| Quad SPI |
Yes |
XCZU29DR-1FFVF1760I Applications
5G Wireless Infrastructure
The XCZU29DR-1FFVF1760I excels in next-generation wireless applications. Specifically, it supports multiband and multi-mode cellular radio implementations. The integrated RF converters and SD-FEC blocks accelerate 5G NR processing.
Phased Array Radar Systems
For defense and aerospace applications, this RFSoC provides exceptional capabilities. In particular, the 16-channel RF-ADC supports direct RF sampling architectures. This approach simplifies radar front-end designs considerably.
Software-Defined Radio (SDR)
The XCZU29DR-1FFVF1760I is an excellent choice for SDR platforms. The combination of programmable logic and RF converters enables flexible waveform implementation. Additionally, the ARM processors handle protocol stack processing efficiently.
Cable Infrastructure (DOCSIS)
Cable network equipment benefits from this device’s capabilities. The high-speed DACs support multiple DOCSIS channels simultaneously. Furthermore, the FPGA logic handles channel bonding and modulation tasks.
Test and Measurement Equipment
Engineers designing RF test equipment appreciate this RFSoC’s versatility. The wide-bandwidth converters enable high-frequency signal analysis. Meanwhile, the processing system manages instrument control and data logging.
XCZU29DR-1FFVF1760I vs Similar Devices
Comparison with Related Part Numbers
| Feature |
XCZU29DR-1FFVF1760I |
XCZU29DR-2FFVF1760I |
XCZU49DR-1FFVF1760I |
| Speed Grade |
-1 (Standard) |
-2 (High Performance) |
-1 (Standard) |
| Logic Cells |
930,300 |
930,300 |
930,300+ |
| RF-ADC Channels |
16 |
16 |
16 |
| RF-DAC Channels |
16 |
16 |
16 |
| Temperature Grade |
Industrial |
Industrial |
Industrial |
Part Number Decoder
Understanding the XCZU29DR-1FFVF1760I part number helps with device selection:
| Code |
Meaning |
| XC |
Xilinx Commercial |
| ZU |
Zynq UltraScale+ |
| 29 |
Device Size (29-series) |
| DR |
RFSoC with RF Data Converters |
| -1 |
Speed Grade 1 (Standard) |
| FF |
Flip-Chip Package |
| VF |
Package Variant |
| 1760 |
Pin Count |
| I |
Industrial Temperature (-40°C to +100°C) |
XCZU29DR-1FFVF1760I Development Tools and Resources
Vivado Design Suite
AMD provides the Vivado Design Suite for XCZU29DR-1FFVF1760I development. This comprehensive toolchain includes synthesis, implementation, and debugging capabilities. Vivado’s IP integrator simplifies system design significantly.
Vitis Software Platform
The Vitis unified software platform supports application development. It includes compilers, libraries, and debugging tools for ARM processors. Additionally, Vitis supports AI engine programming and acceleration.
Reference Designs and Documentation
| Resource |
Description |
| DS889 |
Zynq UltraScale+ RFSoC Data Sheet: Overview |
| UG1085 |
Technical Reference Manual |
| UG1287 |
RF Data Converter LogiCORE IP Product Guide |
| PG269 |
Soft-Decision FEC Product Guide |
XCZU29DR-1FFVF1760I Design Considerations
Power Supply Requirements
Proper power sequencing is essential for reliable operation. The XCZU29DR-1FFVF1760I requires multiple voltage rails with specific sequencing. Power management ICs from AMD partners simplify this implementation.
Thermal Management
Given the device’s high performance, thermal design requires careful attention. Heat sinks or active cooling may be necessary in demanding applications. AMD provides thermal models and guidelines for system design.
PCB Design Guidelines
High-speed signal integrity demands proper PCB design practices. Consider using controlled impedance traces for high-speed interfaces. Additionally, ensure adequate decoupling capacitor placement near power pins.
Why Choose the XCZU29DR-1FFVF1760I?
The XCZU29DR-1FFVF1760I stands out as a premier RFSoC solution. Its integration of RF converters, programmable logic, and processors reduces system complexity. Consequently, designers can achieve faster time-to-market with lower development costs.
For applications requiring high-performance RF signal processing combined with flexible programmable logic, the XCZU29DR-1FFVF1760I delivers exceptional value. Whether developing 5G infrastructure, radar systems, or test equipment, this RFSoC provides the performance and integration necessary for success.
XCZU29DR-1FFVF1760I Ordering Information
| Part Number |
Description |
Temperature |
Package |
| XCZU29DR-1FFVF1760I |
Zynq UltraScale+ RFSoC, Speed -1 |
Industrial (-40°C to +100°C) |
1760-pin FCBGA |
| XCZU29DR-1FFVF1760E |
Zynq UltraScale+ RFSoC, Speed -1 |
Extended (0°C to +100°C) |
1760-pin FCBGA |
| XCZU29DR-2FFVF1760I |
Zynq UltraScale+ RFSoC, Speed -2 |
Industrial (-40°C to +100°C) |
1760-pin FCBGA |
Frequently Asked Questions (FAQ)
What is the XCZU29DR-1FFVF1760I used for?
The XCZU29DR-1FFVF1760I is used for high-performance RF applications. These include 5G base stations, phased array radar, software-defined radio, and DOCSIS cable infrastructure.
What is the difference between XCZU29DR and XCZU49DR?
Both devices belong to the Zynq UltraScale+ RFSoC family. However, they differ in RF-ADC and RF-DAC specifications. The XCZU49DR may offer higher sample rates for certain converter channels.
Does the XCZU29DR-1FFVF1760I include ARM processors?
Yes, the XCZU29DR-1FFVF1760I includes a quad-core ARM Cortex-A53 APU. Additionally, it features a dual-core ARM Cortex-R5F RPU for real-time processing tasks.
What development tools support the XCZU29DR-1FFVF1760I?
AMD’s Vivado Design Suite and Vitis software platform support this device. These tools provide comprehensive design, implementation, and debugging capabilities.
What is the operating temperature range?
The “I” suffix indicates industrial temperature grade. Therefore, the XCZU29DR-1FFVF1760I operates from -40°C to +100°C junction temperature.
