XCVU45P-2FSVH2104E: High-Performance Virtex UltraScale+ FPGA for Advanced Computing Applications
Overview of XCVU45P-2FSVH2104E FPGA
The XCVU45P-2FSVH2104E is a cutting-edge field-programmable gate array (FPGA) from AMD’s Virtex UltraScale+ family, designed to deliver exceptional processing power for demanding computational workloads. This advanced FPGA combines massive parallel processing capabilities with flexible programmability, making it an ideal solution for data centers, aerospace applications, high-performance computing (HPC), and advanced signal processing systems.
As part of the premium Xilinx FPGA portfolio, the XCVU45P-2FSVH2104E represents the pinnacle of programmable logic technology, offering engineers and system designers unparalleled flexibility and performance for next-generation applications.
Key Technical Specifications
| Specification |
Details |
| Part Number |
XCVU45P-2FSVH2104E |
| Manufacturer |
AMD (formerly Xilinx) |
| Product Series |
Virtex UltraScale+ |
| Logic Elements/Cells |
1,906,800 |
| RAM Bits |
49,597,645 |
| LABs/CLBs |
108,960 |
| I/O Count |
416 user I/O pins |
| Package Type |
2104-BBGA, FCBGA |
| Mounting Type |
Surface Mount |
| Operating Voltage |
0.825V ~ 0.876V |
| Operating Temperature |
0°C ~ 100°C (TJ) |
| Speed Grade |
-2 (Standard Performance) |
| Process Technology |
20nm FinFET |
| RoHS Compliance |
ROHS3 Compliant |
| Product Status |
Active |
Advanced Features and Capabilities
Ultra-High Logic Density
The XCVU45P-2FSVH2104E features an impressive 1.9 million logic cells, providing extensive resources for implementing complex digital designs. This massive logic capacity enables designers to integrate multiple functions into a single FPGA, reducing system complexity and improving overall performance.
Extensive Memory Resources
With nearly 50 million RAM bits, this FPGA offers substantial on-chip memory for data-intensive applications. The distributed memory architecture ensures high-bandwidth access to data, critical for applications requiring fast data processing and low-latency operations.
High-Speed I/O Capabilities
The XCVU45P-2FSVH2104E provides 416 user I/O pins with support for multiple high-speed serial protocols, enabling seamless integration with various peripherals and communication interfaces. This extensive I/O capability makes it suitable for applications requiring multiple high-bandwidth data channels.
Advanced Package Technology
Housed in a 2104-ball FCBGA package, this FPGA utilizes flip-chip ball grid array technology for superior electrical performance and thermal management. The compact package design enables high-density board layouts while maintaining excellent signal integrity.
Performance Characteristics
Processing Speed
| Performance Metric |
Specification |
| Speed Grade |
-2 (Commercial) |
| Maximum Frequency |
Up to 600 MHz (fabric dependent) |
| DSP Slices |
High-performance DSP48E2 blocks |
| Processing Throughput |
Multi-terabit per second |
Power Efficiency
The XCVU45P-2FSVH2104E operates at a core voltage of 0.825V to 0.876V, optimized for power efficiency without compromising performance. The 20nm FinFET process technology delivers excellent power-per-performance ratio, making it suitable for applications where power consumption is a critical consideration.
Target Applications
Data Center Acceleration
The XCVU45P-2FSVH2104E excels in data center environments, providing hardware acceleration for:
- Machine learning inference
- Network packet processing
- Database acceleration
- Video transcoding
- Compression/decompression engines
High-Performance Computing
This FPGA is ideal for HPC applications requiring:
- Scientific simulations
- Financial modeling
- Computational fluid dynamics
- Seismic data processing
- Bioinformatics analysis
Aerospace and Defense
The robust design and high reliability make the XCVU45P-2FSVH2104E suitable for:
- Radar signal processing
- Software-defined radio (SDR)
- Electronic warfare systems
- Satellite communications
- Image processing and recognition
Test and Measurement
Engineers utilize this FPGA for:
- High-speed data acquisition systems
- Protocol analyzers
- Signal generators
- Logic analyzers
- Automated test equipment (ATE)
Design Support and Development Tools
Vivado Design Suite
The XCVU45P-2FSVH2104E is fully supported by AMD’s Vivado Design Suite, which provides:
- Advanced synthesis and implementation
- High-level synthesis (HLS) support
- Integrated logic analyzer
- Power analysis tools
- Timing closure optimization
IP Core Library
Access to extensive IP cores including:
- Memory controllers (DDR4, DDR3)
- PCIe Gen3/Gen4 interfaces
- 100G/400G Ethernet MACs
- Video processing pipelines
- Cryptographic engines
Package and Pin Information
| Package Details |
Specifications |
| Package Type |
FCBGA (Flip-Chip Ball Grid Array) |
| Total Balls |
2104 |
| Ball Pitch |
1.0mm |
| Package Size |
45mm × 45mm (approximate) |
| Thermal Solution |
Heat sink recommended |
| Moisture Sensitivity |
Level 3 |
Environmental and Compliance Standards
Temperature Ratings
- Junction Temperature: 0°C to 100°C
- Storage Temperature: -40°C to 125°C
- Recommended Operating Ambient: 0°C to 85°C
Compliance Certifications
- RoHS Compliance: RoHS3 Compliant (lead-free)
- REACH Compliant: Yes
- Conflict Minerals: Compliant
- Country of Origin: Varies by manufacturing site
Ordering and Availability
Part Number Nomenclature
XCVU45P-2FSVH2104E breakdown:
- XCVU45P: Device family and density
- 2: Speed grade (-2 = standard performance)
- FSVH: Package designation
- 2104: Pin count
- E: Environmental grade (commercial)
Lead Time and Packaging
- Standard Lead Time: 25 weeks (subject to change)
- Packaging Type: Tray
- Minimum Order Quantity: Contact distributor
- Extended Temperature: Available in -I grade
Power Supply Requirements
Voltage Rails
| Power Rail |
Voltage Range |
Typical Current |
Purpose |
| VCCINT |
0.825V – 0.876V |
High |
Core logic |
| VCCAUX |
1.8V |
Medium |
Auxiliary circuits |
| VCCO |
1.2V – 3.3V |
Variable |
I/O banks |
| VCCBRAM |
0.825V – 0.876V |
Medium |
Block RAM |
Power Consumption Estimates
- Typical Static Power: 5-10W (design dependent)
- Dynamic Power: Varies with design utilization
- Maximum Power: Up to 100W+ (fully loaded)
- Power Management: Multiple power domains supported
Comparison with Similar FPGAs
Within Virtex UltraScale+ Family
| Model |
Logic Cells |
RAM Bits |
I/O Pins |
Package |
| XCVU33P |
961,800 |
~33M |
416 |
2104-FCBGA |
| XCVU35P |
1,143,000 |
~40M |
416 |
2104-FCBGA |
| XCVU45P |
1,906,800 |
~50M |
416 |
2104-FCBGA |
| XCVU47P |
2,072,100 |
~57M |
432 |
2892-FCBGA |
Design Considerations
Thermal Management
The XCVU45P-2FSVH2104E requires proper thermal management:
- Heat Sink: Required for most applications
- Airflow: Forced air cooling recommended
- Thermal Interface: High-quality TIM essential
- Junction Temperature Monitoring: Built-in sensors available
PCB Design Guidelines
Critical considerations for board design:
- Power plane design: Low-impedance power distribution
- Decoupling: Multiple capacitor values required
- Signal integrity: Controlled impedance traces
- Layer stackup: 10+ layers recommended
- Via technology: Micro-vias for high-density routing
Configuration Options
- Configuration modes: JTAG, SelectMAP, SPI, BPI
- Bitstream encryption: AES-256 supported
- Partial reconfiguration: Supported
- Configuration time: Milliseconds to seconds (mode dependent)
Why Choose XCVU45P-2FSVH2104E?
Unmatched Performance
The XCVU45P-2FSVH2104E delivers exceptional processing capabilities with nearly 2 million logic cells, making it one of the most powerful FPGAs available for commercial applications.
Flexibility and Scalability
Field-programmable architecture allows for design updates and customization without hardware changes, providing future-proof solutions for evolving requirements.
Proven Reliability
Built on AMD’s mature 20nm process technology with extensive qualification and testing, ensuring reliable operation in mission-critical applications.
Comprehensive Ecosystem
Extensive tool support, IP libraries, reference designs, and technical documentation accelerate development and reduce time-to-market.
Getting Started
Evaluation and Development
- Development Boards: VCU118 evaluation kit available
- Reference Designs: Multiple application-specific examples
- Documentation: Comprehensive datasheets and user guides
- Technical Support: AMD design support available
Resources and Documentation
Access technical resources at:
- Product datasheets and specifications
- Application notes and white papers
- Design constraint files
- Package information and pinouts
- Power estimator tools
Conclusion
The XCVU45P-2FSVH2104E Virtex UltraScale+ FPGA represents a premium solution for applications demanding maximum processing capability and flexibility. With 1.9 million logic cells, extensive memory resources, and advanced features, this FPGA enables engineers to tackle the most challenging computational problems in data centers, aerospace, test equipment, and high-performance computing applications.
Whether accelerating machine learning workloads, processing high-speed data streams, or implementing complex signal processing algorithms, the XCVU45P-2FSVH2104E provides the performance, flexibility, and reliability required for next-generation systems.
For procurement information, technical support, or design assistance with the XCVU45P-2FSVH2104E, contact authorized AMD distributors or visit the official AMD website for the latest product information and resources.
