The XCVU35P-L2FSVH2104E is a high-performance Field Programmable Gate Array (FPGA) from AMD’s Virtex UltraScale+ HBM family. This advanced 16nm FinFET FPGA integrates 8GB of High Bandwidth Memory (HBM2) with 460 GB/s memory bandwidth, making it an ideal solution for AI inference, data center acceleration, video transcoding, and high-performance computing applications. Whether you’re working on complex signal processing or next-generation networking solutions, this Xilinx FPGA delivers exceptional performance with optimized power efficiency.
XCVU35P-L2FSVH2104E Key Specifications Overview
The XCVU35P-L2FSVH2104E belongs to the Virtex UltraScale+ HBM series, featuring industry-leading logic density combined with revolutionary in-package memory technology. Below is a comprehensive specifications table for this FPGA device.
General Device Information
| Parameter |
Specification |
| Manufacturer |
AMD (formerly Xilinx) |
| Part Number |
XCVU35P-L2FSVH2104E |
| Series |
Virtex UltraScale+ HBM |
| Product Status |
Active |
| Technology Node |
16nm FinFET |
| Package Type |
2104-FCBGA (Flip-Chip BGA) |
| Mounting Type |
Surface Mount |
| Packaging |
Tray |
XCVU35P-L2FSVH2104E Logic Resources
| Resource Type |
Value |
| System Logic Cells |
1,906,800 |
| CLB Flip-Flops |
1,743,000 |
| CLB LUTs |
872,000 |
| Number of CLBs |
108,960 |
| Number of I/O |
416 |
| DSP Slices |
5,952 |
| Clock Management Tiles (CMTs) |
8 |
Memory Specifications
| Memory Type |
Capacity |
| HBM2 DRAM (In-Package) |
8 GB |
| HBM Memory Bandwidth |
460 GB/s |
| HBM AXI Interfaces |
32 |
| Total Block RAM |
47.3 Mb |
| UltraRAM |
180.0 Mb |
| Maximum Distributed RAM |
24.6 Mb |
| Total On-Chip Memory |
Up to 500 Mb |
Electrical & Operating Characteristics
| Parameter |
Value |
| Core Voltage (VCCINT) |
0.72V / 0.85V |
| Voltage Supply Range |
0.698V ~ 0.742V |
| Operating Temperature (TJ) |
0°C to 100°C |
| Speed Grade |
-L2 (Low Power) |
| Moisture Sensitivity Level (MSL) |
4 |
Understanding the XCVU35P-L2FSVH2104E Part Number
The AMD part numbering system provides important information about device configuration and capabilities.
Part Number Breakdown
| Code Segment |
Meaning |
| XC |
Xilinx Commercial Grade |
| VU |
Virtex UltraScale+ Family |
| 35P |
Device Size with HBM Support |
| -L2 |
Low-Power Speed Grade (-2 equivalent at 0.85V) |
| FSVH |
Package Type (Fine-pitch BGA) |
| 2104 |
Pin Count |
| E |
Extended Temperature Range |
XCVU35P-L2FSVH2104E Speed Grade Options
The VU35P device family offers multiple speed grade variants to accommodate different performance and power requirements.
| Speed Grade |
Performance Level |
VCCINT Voltage |
Power Profile |
| -3 |
Highest Performance |
0.85V |
Standard |
| -2 |
High Performance |
0.85V |
Standard |
| -1 |
Standard Performance |
0.85V |
Standard |
| -L2 (This Device) |
Optimized Performance |
0.72V or 0.85V |
Low Power |
The -L2 speed grade in the XCVU35P-L2FSVH2104E provides excellent flexibility. When operated at VCCINT = 0.85V, performance matches the -2I industrial grade specifications. At 0.72V operation, both static and dynamic power consumption are significantly reduced.
High Bandwidth Memory (HBM) Technology Benefits
The XCVU35P-L2FSVH2104E integrates HBM2 memory directly in the package using AMD’s chip-on-wafer-on-substrate (CoWoS) technology. This architecture delivers transformative advantages for memory-intensive applications.
HBM2 Performance Advantages
| Feature |
Benefit |
| 460 GB/s Bandwidth |
20X more bandwidth than DDR4 DIMM |
| 8 GB Integrated Memory |
Eliminates external memory bottlenecks |
| 32 AXI Interfaces |
Flexible any-port-to-any-address access |
| Low Power (~7 pJ/bit) |
Optimized energy efficiency |
| Integrated HBM Controller |
Reduces logic utilization by ~250K LUTs |
Target Applications for XCVU35P-L2FSVH2104E
The combination of massive logic resources, high-bandwidth memory, and low power consumption makes the XCVU35P-L2FSVH2104E suitable for demanding applications across multiple industries.
Primary Application Areas
| Application |
Key Benefits |
| AI/ML Inference |
Process large datasets at maximum speed with in-package memory |
| Data Center Acceleration |
Scalable, reconfigurable platform for complex workloads |
| Video Transcoding |
High-throughput encoding with 58G PAM4 serial interfaces |
| Network Security (NGFW) |
80X more search entries than commercial TCAMs |
| 5G Infrastructure |
Flexible hardware acceleration with low latency |
| High-Performance Computing |
Massive parallel processing capabilities |
| RADAR/Signal Processing |
Enhanced DSP resources for precision tracking |
| Financial Trading Systems |
Ultra-low latency data processing |
Development Tools & Design Resources
AMD provides comprehensive development support for the XCVU35P-L2FSVH2104E through the Vivado Design Suite ecosystem.
Available Resources
| Resource Type |
Description |
| Vivado Design Suite |
Complete FPGA development environment |
| IP Catalog |
Pre-verified intellectual property cores |
| Reference Designs |
Pre-built designs for common applications |
| VCU128 Evaluation Kit |
Hardware platform for prototyping |
| Technical Documentation |
Datasheets, user guides, and application notes |
Why Choose XCVU35P-L2FSVH2104E for Your Design?
The XCVU35P-L2FSVH2104E stands out in the FPGA market by combining exceptional processing power with revolutionary memory integration. The 460 GB/s HBM bandwidth eliminates traditional memory bottlenecks, while the low-power -L2 speed grade optimizes energy consumption for thermally constrained designs. With AMD’s commitment to extending UltraScale+ support through 2045, engineers can confidently design products with long lifecycle requirements.
Frequently Asked Questions (FAQ)
What is the difference between XCVU35P-L2FSVH2104E and XCVU35P-2FSVH2104E?
The primary difference is the speed grade designation. The -L2 variant offers low-power operation at 0.72V or 0.85V VCCINT, while the -2 variant operates at standard 0.85V with slightly higher performance characteristics.
How much HBM memory does the XCVU35P-L2FSVH2104E include?
This device integrates 8 GB of HBM2 DRAM in-package with 32 AXI interfaces, providing 460 GB/s of memory bandwidth.
What development software supports this FPGA?
AMD’s Vivado Design Suite is the primary development environment, offering synthesis, implementation, and debugging tools optimized for Virtex UltraScale+ devices.
