Product Description
Maximize Performance with the Xilinx XC7Z010-3CLG400E SoC
The Xilinx XC7Z010-3CLG400E is a highly versatile and powerful System on Chip (SoC) belonging to the industry-leading Zynq-7000 architecture. By seamlessly combining a robust ARM® Cortex™-A9 dual-core processing system with 28nm programmable logic, this component bridges the gap between software flexibility and hardware acceleration. Whether you are developing advanced industrial automation tools, precision robotics, or high-frequency communication systems, the XC7Z010-3CLG400E provides the exact processing bandwidth required for complex, real-time edge computing.
Why Choose the Zynq-7000 Architecture?
The primary advantage of the Zynq-7000 family is its tightly coupled architecture. Traditional systems often require a separate processor and FPGA, which increases board space, power consumption, and bill of materials (BOM) costs. The XC7Z010-3CLG400E integrates these elements onto a single die. This eliminates the bottleneck of off-chip communication, significantly increasing data transfer speeds between the processor and custom logic blocks.
Furthermore, this specific model features the “-3” speed grade, which is the highest performance tier available for this device, ensuring maximum clock frequencies and reduced logic delays for your most demanding applications.
Key Applications and PCB Integration
The XC7Z010-3CLG400E is engineered for environments that demand rapid processing and high reliability. Common applications include:
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Machine Vision & Robotics: Handling complex motor control algorithms and processing LiDAR or 2D camera point clouds in real-time.
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Medical Equipment: High-speed data acquisition for diagnostic imaging.
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Industrial Internet of Things (IIoT): Edge analytics and secure gateway routing.
When designing your high-density interconnect (HDI) stackups, selecting the right programmable logic is just the first step. Utilizing a reliable Xilinx FPGA ensures that your final electronic manufacturing service (EMS) output meets rigorous quality standards. The 400-pin CSPBGA (Chip-Scale Package Ball Grid Array) offers an excellent balance between a compact footprint and accessible routing for complex PCB designs.
Technical Specifications
To aid in your engineering and hardware design process, below are the core technical specifications for the XC7Z010-3CLG400E.
| Feature |
Specification |
| Manufacturer |
AMD / Xilinx |
| Product Family |
Zynq-7000 |
| Part Number |
XC7Z010-3CLG400E |
| Processor Type |
Dual-Core ARM® Cortex®-A9 MPCore™ |
| Maximum Clock Frequency |
866 MHz (Speed Grade -3) |
| Programmable Logic Cells |
28K Logic Equivalent Cells |
| DSP Slices |
80 |
| On-Chip Memory (SRAM) |
256 KB |
| Block RAM (BRAM) |
2.1 Mb |
| Package / Case |
400-LFBGA, CSPBGA (17×17 mm) |
| Operating Temperature |
0°C to +100°C (Extended) |
| I/O Count |
130 Programmable I/O Pins |
Streamline Your Hardware Development
By leveraging the hardware-software co-design capabilities of the XC7Z010-3CLG400E, engineering teams can drastically reduce time-to-market. Developers can rely on the rich ecosystem of Xilinx Vivado Design Suite and Vitis software platforms to configure the dual-core processor and synthesize the programmable logic efficiently.
For developers looking to push the boundaries of embedded systems, this Zynq-7000 SoC offers unmatched scalability, power efficiency, and processing capability in a highly reliable package.
