Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

Xilinx XC7Z014S-1CLG400C Zynq-7000 SoC: Technical Overview & Design Guide

Product Details

XC7Z014S-1CLG400C: High-Performance SoC FPGA Overview

The Xilinx XC7Z014S-1CLG400C stands as a cornerstone in the Zynq-7000 SoC family, expertly blending a robust processing system with programmable logic. Designed for engineers and developers requiring high computational density, this System-on-Chip (SoC) provides a seamless integration that accelerates development cycles in industrial, automotive, and communications sectors.

By combining an ARM Cortex-A9 processor with 28nm Artix-7 programmable logic, the XC7Z014S-1CLG400C delivers the perfect balance of software-defined flexibility and hardware-accelerated performance. If you are looking to integrate advanced processing power into your next embedded design, explore our selection of high-quality Xilinx FPGA components to ensure your project is built on reliable hardware.

Unmatched Integration for Modern Embedded Systems

The primary advantage of the XC7Z014S-1CLG400C is its ability to offload time-critical tasks to the programmable logic fabric while maintaining a high-level operating system on the ARM core. This architecture significantly reduces latency and power consumption compared to discrete multi-chip solutions.

The CLG400 package ensures a compact footprint, making it an ideal candidate for space-constrained applications without compromising on I/O bandwidth or processing throughput. Its wide range of interfaces allows for easy connectivity to various sensors, memory modules, and peripheral devices, providing the scalability needed for sophisticated industrial control systems.

Technical Specifications

The table below outlines the core technical parameters for the XC7Z014S-1CLG400C. Understanding these specifications is vital for selecting the right SoC for your design requirements.

Feature Specification
Product Series Zynq-7000 SoC
Processor Core ARM Cortex-A9 (Single Core)
Programmable Logic Artix-7 FPGA Fabric
Package CLG400 (400-pin BGA)
Operating Temp. 0°C to 85°C (Commercial)
Logic Cells 43K
Max I/O Pins 200
Memory Integrated Block RAM (BRAM)

Key Design Considerations

When implementing this device in your hardware architecture, consider the following performance optimization strategies:

  • Thermal Management: Ensure adequate heat dissipation, especially when utilizing the logic fabric for high-speed signal processing.

  • Power Delivery: Implement a robust power distribution network to satisfy the varying current demands of the SoC and its peripherals.

  • Interconnect Optimization: Utilize the AXI (Advanced eXtensible Interface) protocol to maximize throughput between the processing system and the programmable logic.

By leveraging the unique capabilities of the XC7Z014S-1CLG400C, developers can streamline the integration of complex algorithms, ensuring their systems are both powerful and efficient. Whether you are building advanced robotics or high-bandwidth communication infrastructure, this SoC offers the reliability and performance required for competitive market success.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.