Product Description Content
What is the Xilinx XC7Z035-1FFG676I?
The Xilinx XC7Z035-1FFG676I is a high-performance System on Chip (SoC) belonging to the highly regarded Zynq-7000 family. By seamlessly integrating a feature-rich dual-core ARM Cortex-A9 processor with 28nm Kintex-7 programmable logic, this component delivers unparalleled flexibility. When designing complex embedded systems, engineers frequently turn to a robust Xilinx FPGA architecture to bridge the gap between software programmability and powerful hardware acceleration.
This specific part number is engineered for demanding environments, making it a top choice for developers who need immense processing power alongside hardware flexibility.
Key Features of the XC7Z035-1FFG676I SoC
To understand why this specific SoC stands out in the market, it helps to break down its core capabilities into processing power and environmental endurance.
High-Performance Processing Architecture
At the heart of the XC7Z035-1FFG676I lies a processing system (PS) paired with programmable logic (PL). The dual-core ARM Cortex-A9 MPCore operates efficiently alongside approximately 275K logic cells. This dual architecture allows developers to offload intensive tasks from the CPU directly to the programmable logic, drastically reducing latency and increasing overall system throughput.
Robust Industrial Grade Reliability
The “I” at the end of the XC7Z035-1FFG676I part number signifies its industrial temperature rating. Unlike commercial-grade alternatives, this IC is rated to operate flawlessly in extreme temperatures ranging from -40°C to +100°C. Furthermore, the 676-pin Flip-Chip BGA (FFG676) package ensures a secure, high-density connection suitable for rugged physical environments subject to vibration and thermal stress.
XC7Z035-1FFG676I Technical Specifications
For hardware engineers and procurement specialists, quick access to exact technical parameters is vital. Below is a comprehensive overview of the component’s datasheet specifications.
| Specification |
Detail |
| Manufacturer |
Xilinx (AMD) |
| Product Family |
Zynq-7000 SoC |
| Core Processor |
Dual-Core ARM® Cortex®-A9 MPCore™ |
| Programmable Logic (PL) |
Kintex-7 architecture (~275K Logic Cells) |
| Speed Grade |
-1 (Standard) |
| Package / Case |
676-BBGA, FCBGA (27×27 mm) |
| Mounting Type |
Surface Mount |
| Number of I/O |
130 |
| RAM Capacity |
256KB (On-Chip) |
| Operating Temperature |
-40°C ~ 100°C (TJ) – Industrial Grade |
| RoHS Status |
Pb-Free / RoHS Compliant |
Common Applications for the Zynq-7000 Series
Because of its unique blend of sequential processing and parallel logic acceleration, the XC7Z035-1FFG676I is heavily utilized across several advanced industries. Common applications include:
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Industrial Automation: Motor control, machine vision, and real-time industrial networking.
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Aerospace and Defense: Secure communications, radar processing, and navigation systems requiring wide temperature tolerances.
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Medical Imaging: High-speed data acquisition and image processing for ultrasound and MRI equipment.
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Broadcast and Video: High-definition video processing, encoding, and live streaming hardware.
By combining the software ecosystem of an ARM processor with the hardware adaptability of Kintex-7 logic, the XC7Z035-1FFG676I remains a premier choice for next-generation system design.
