Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

Xilinx XC7Z035-3FFG676E: High-Performance Zynq-7000 SoC

Product Details

Introduction to the XC7Z035-3FFG676E

The Xilinx XC7Z035-3FFG676E is a premium, high-performance System on Chip (SoC) belonging to the renowned Zynq®-7000 family. Designed for applications demanding immense processing power and tight hardware-software integration, this device seamlessly merges a dual-core ARM Cortex-A9 processor with advanced programmable logic.

Whether you are designing for aerospace, defense, high-end medical imaging, or next-generation industrial automation, this SoC provides the scalability and efficiency required for modern embedded systems. By choosing this industrial-grade component, developers can significantly reduce system power consumption, bill-of-materials (BOM) costs, and time-to-market.

Key Features and Technical Specifications

When sourcing a dependable Xilinx FPGA, understanding the exact hardware capabilities is crucial for system architecture. The XC7Z035-3FFG676E stands out due to its high-density logic cells and blazing-fast transceivers.

Processing System (PS) & Programmable Logic (PL)

The core architecture splits workloads efficiently between a dedicated hard processor system and customizable FPGA fabric. This hybrid approach ensures deterministic real-time performance alongside massive parallel processing capabilities.

Detailed Technical Specifications

For a deeper look into the hardware capabilities, review the comprehensive technical data below:

Parameter Specification
Manufacturer AMD / Xilinx
Part Number XC7Z035-3FFG676E
Architecture Core Architecture: Dual ARM® Cortex®-A9 MPCore™
Processor Speed Up to 1 GHz
Programmable Logic Cells 275,000 Logic Cells
Look-Up Tables (LUTs) 171,900
Block RAM (BRAM) 17.6 Mb
DSP Slices 900 Slices
PCI Express (PCIe) Gen2 x8
Package / Case FCBGA-676 (27mm x 27mm)
Operating Temperature Extended (0°C to 100°C)
Speed Grade -3 (Highest Performance)

Why Choose the XC7Z035-3FFG676E?

Unmatched Performance via Speed Grade -3

The “-3” speed grade signifies that this chip is bin-sorted for maximum clock frequencies and the lowest possible latency. If your application handles high-bandwidth data streaming, complex digital signal processing (DSP), or hardware-accelerated algorithms, this speed grade ensures your system operates without bottlenecks.

Robust Connectivity and I/O Flexibility

Equipped with high-speed serial transceivers and a rich set of peripheral interfaces (including Gigabit Ethernet, USB, and SDIO), this SoC simplifies complex networking tasks. The FCBGA-676 packaging balances high I/O density with manageable PCB routing, making it a favorite for multi-layer high-speed board designs.

Applications of the Zynq-7000 XC7Z035 SoC

The versatility of the Kintex-7 based programmable fabric combined with the ARM processing system makes this part ideal for:

  • Advanced Driver Assistance Systems (ADAS) and autonomous driving compute nodes.

  • Software-Defined Radio (SDR) and wireless baseband processing.

  • High-Resolution Medical Imaging (Ultrasound, MRI data acceleration).

  • Smart Grid and Industrial Automation requiring real-time motor control and edge AI.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.