Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

Xilinx XC7Z035-L2FFG676I Zynq-7000 SoC: High-Performance Embedded Excellence

Product Details

Introduction: Powering Next-Gen Embedded Systems

The Xilinx XC7Z035-L2FFG676I is a premier system-on-chip (SoC) belonging to the renowned Zynq®-7000 family. Built on a groundbreaking architecture, this device integrates the software programmability of a dual-core ARM® Cortex™-A9 processor with the hardware programmability of a high-performance 28nm FPGA.

Engineered for power-sensitive, high-throughput applications, the “L2” low-power variant delivers exceptional performance-per-watt. For engineering teams looking to design robust industrial, medical, or defense systems, securing a reliable supply of this Xilinx FPGA is the first step toward unlocking unparalleled processing efficiency.

Key Features of the XC7Z035-L2FFG676I

Why choose this specific Zynq-7000 SoC for your next hardware deployment? The answer lies in its balanced, hybrid architecture.

Integrated Dual-Core ARM Cortex-A9 Processor

At the heart of the XC7Z035-L2FFG676I is an application processor unit capable of running complex operating systems like Linux or VxWorks. This allows developers to handle high-level application software, network stacks, and user interfaces seamlessly on a single chip.

Advanced 28nm Programmable Logic

Surrounding the processor is Xilinx’s Kintex®-7 equivalent programmable fabric. Packed with thousands of logic cells and DSP slices, it allows you to offload math-intensive algorithms, custom communication protocols, and real-time data processing directly into hardware.

Technical Specifications & Details

To help you evaluate compatibility with your current PCB designs, the technical specifications for the XC7Z035-L2FFG676I are detailed below.

Core Architecture Specifications

Parameter Specification
Processor Core Dual-core ARM® Cortex™-A9 MPCore™
Maximum Processor Frequency Up to 800 MHz
Programmable Logic Cells 275,000
Look-Up Tables (LUTs) 171,900
Flip-Flops 343,800
Block RAM (BRAM) 17.6 Mb
DSP Slices 900

Electrical and Package Dynamics

Parameter Specification
Package / Case FCBGA-676 (27mm x 27mm)
Speed Grade -L2 (Low Power, High Performance)
Operating Temperature Industrial (-40°C to 100°C)
I/O Pins 200 Max
Transceiver Count 16 GTX Transceivers (Up to 12.5 Gbps)

Target Applications

Thanks to its hybrid nature, the XC7Z035-L2FFG676I is widely utilized in sectors requiring massive data parallelism alongside deterministic software control:

  • Aviation and Defense: Software-defined radio (SDR) and radar processing.

  • Industrial Automation: Multi-axis motor control and machine vision systems.

  • Medical Imaging: Real-time ultrasound and CT scan data acceleration.

Conclusion: Accelerate Your Time-to-Market

The Xilinx XC7Z035-L2FFG676I eliminates the bottleneck between hardware and software. By leveraging its low-power architecture and extensive DSP resources, you can drastically minimize power budgets while maximizing processing throughput. Ensure your supply chain remains uninterrupted by sourcing authentic components early in your design cycle.

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Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.