Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

Buy Xilinx XC7S15-1CSGA225Q Field Programmable Gate Array (FPGA)

Product Details

AMD Xilinx XC7S15-1CSGA225Q Spartan-7 FPGA Overview

The XC7S15-1CSGA225Q is a highly efficient, low-power Field Programmable Gate Array (FPGA) from the AMD Xilinx Spartan-7 family. Built on a advanced 28nm High-Performance Low-Power (HPL) process technology, this integrated circuit balances small form-factor packaging with high I/O counts per square millimeter. Designed with the stringent automotive Q-grade qualification, it operates seamlessly across an expanded temperature range from -40°C to +125°C, making it exceptionally reliable for critical applications.

This semiconductor component addresses complex system integration requirements. It features a high pin-count to logic ratio optimized for cost-sensitive markets. Hardware designers frequently select this device to scale modern digital architectures where board space and power efficiency are primary constraints.

Key Technical Specifications of XC7S15-1CSGA225Q

Understanding the exact architecture of an IC helps ensure software and hardware compatibility. This Spartan-7 device contains 12,800 logic cells and 1,000 Configurable Logic Blocks (CLBs) to handle concurrent hardware description processing. It includes a built-in MicroBlaze™ soft processor core capable of running over 200 DMIPs, giving engineers an accessible path to implement embedded control systems directly within the programmable fabric.

Technical Attribute Specific Parameter Value
Manufacturer AMD / Xilinx
Product Part Number XC7S15-1CSGA225Q
Product Category Xilinx FPGA
Family Series Spartan-7
Number of Logic Elements / Cells 12,800 LE
Number of LABs / CLBs 1,000
Total Block RAM Bits 360 kbit (368,640 Bits)
Number of User I/Os 100 I/O Pins
Core Supply Operating Voltage 0.95V to 1.05V (1.0V Nominal)
I/O Bank Supply Voltage Up to 3.3V
Operating Temperature Range ($T_J$) -40°C to +125°C (Automotive Q-Grade)
Mounting Style Surface Mount (SMD / SMT)
Package / Case Material 225-LFBGA, CSPBGA (13mm x 13mm Layout)
Terminal Pitch Size 0.8 mm

Advanced Processing Performance & Interface Capabilities

Beyond basic logic processing, this structural chip integrates 20 dedicated DSP (Digital Signal Processing) slices to manage high-speed algorithms. This makes it a great choice for localized sensor filtering, compute-heavy conversions, and real-time processing.

The physical configuration supports data transfer bandwidth up to 800 Mb/s for DDR3 interfaces via a flexible, soft memory controller. For high-speed differential signal transfer, the structural interface pins support up to 1.25 Gb/s LVDS (Low-Voltage Differential Signaling) lines.

Common Target Industrial Applications

The balance of lower structural power consumption and reliable environmental ratings makes this hardware ideal for:

  • Industrial Automation: Sensor fusion, robotics motor control systems, and machinery IO breakout interfaces.

  • Automotive Subsystems: Advanced Driver Assistance Systems (ADAS) data aggregation, camera integration modules, and in-vehicle networking.

  • Consumer & Test Devices: Smart displays, medical monitoring interfaces, and communications test infrastructure.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.