The XC7S50-1FGA484I is a premier field-programmable gate array (FPGA) from the Xilinx Spartan-7 family, engineered specifically to address low-power, high-cost-efficiency, and small-footprint application requirements. Offering an exceptional balance of high I/O throughput and dense logic cells, this component is ideal for modern industrial automation, edge computing, automotive infotainment, and medical imaging devices.
By leveraging the advanced 28nm artix-architecture optimization, this Xilinx FPGA provides hardware designers with an agile platform to accelerate system-level performance without compromising thermal or power budgets.
Technical Specifications and Architecture
The XC7S50-1FGA484I operates within an industrial temperature range (-40°C to 100°C), housing 52,160 logic cells and 4,075 Logic Array Blocks (LABs/CLBs). It interfaces smoothly with legacy and next-generation peripherals via 250 available single-ended I/O pins or 120 differential pairs.
To help you evaluate its compatibility with your hardware schematics, the exact technical matrix is broken down below:
Core Hardware Parameters
| Parameter |
Specifications |
| Manufacturer |
AMD / Xilinx |
| Part Number |
XC7S50-1FGA484I |
| Product Series |
Spartan-7 |
| Logic Cells |
52,160 |
| Total RAM Bits |
2,764,800 Bits (2.7 Mb) |
| Number of I/Os |
250 |
| Package / Case |
FBGA-484 (Fine-Pitch Ball Grid Array) |
| Operating Supply Voltage |
0.95 V to 1.05 V |
| Operating Temperature |
-40°C ~ 100°C (TA) |
Memory, DSP, and Interface Ratings
| Resource Type |
Capacity / Performance |
| Distributed RAM |
600 Kb |
| Block RAM (BRAM) |
2,160 Kb |
| DSP Slices (18 x 25 Multipliers) |
120 Slices |
| Maximum Data Rate |
1,250 Mb/s (LVDS) |
| Speed Grade |
-1 |
| Mounting Type |
Surface Mount Technology (SMT) |
Key Applications for the Spartan-7 Series
Thanks to its low-power footprint and high differential I/O density, this IC is heavily utilized across several embedded system categories:
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Industrial Control Systems: Used in programmable logic controllers (PLCs), motor drive controllers, and sensor fusion modules.
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Automotive Electronics: Embedded in ADAS video processing units, infotainment interfaces, and vehicle-to-everything (V2X) nodes.
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Consumer Edge AI: Perfect for lightweight machine learning inference, smart display driving, and IoT gateway encryption layers.
PCBSYNC Turnkey SMT Assembly for Xilinx Components
Deploying dense Fine-Pitch Ball Grid Array (FBGA-484) packages requires rigorous manufacturing controls. At PCBSYNC, we provide comprehensive EMS and PCBA services tailored for high-density components like the XC7S50. Our processing includes automated 3D X-ray inspection (AXI) to guarantee perfect solder ball alignment and zero voiding beneath the chip matrix, ensuring industrial-grade reliability for your finished product.
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