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  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
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Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

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AMD Xilinx XC7S25-1CSGA324C Spartan-7 FPGA: Specs & Features

Product Details

Product Description

Are you seeking a high-performance, cost-effective programmable logic solution for your next embedded electronic project? The XC7S25-1CSGA324C is an advanced integrated circuit from the highly regarded Spartan-7 series, designed to deliver exceptional processing capabilities within a compact physical footprint. Whether you are engineering industrial control systems, automotive electronics, or sensor fusion applications, this powerful component provides the flexibility and efficiency that modern designs demand.

Unleash High Performance with the XC7S25-1CSGA324C

Manufactured by AMD/Xilinx, this device is engineered on a 28nm HPL process, perfectly balancing robust logic density with strict power efficiency. It serves as an ideal upgrade for legacy low-density programmable logic devices, offering developers modern features such as reduced power consumption, improved resource utilization, and seamless peripheral integration.

Core Architecture and Logic Capabilities

At the computational heart of the XC7S25-1CSGA324C are 23,360 logic elements organized into 1,825 Configurable Logic Blocks (CLBs). This dense architecture allows hardware developers to implement complex digital signal processing (DSP), run real-time control algorithms, and create custom bridging solutions without lag.

Furthermore, the device is equipped with over 1.6 Mbit of total RAM and 150 configurable I/O pins, ensuring extensive connectivity for a wide array of external sensors, memory modules, and communication interfaces. When you integrate a high-quality Xilinx FPGA into your system architecture, you benefit from a highly reconfigurable digital logic solution that vastly outperforms traditional fixed-function microprocessors.

Technical Specifications

To help hardware engineers and system designers quickly understand the core capabilities of this Spartan-7 component, here is a detailed breakdown of its primary technical attributes:

Specification Technical Value / Details
Manufacturer AMD / Xilinx
Series Family Spartan®-7
Part Number XC7S25-1CSGA324C
Logic Elements / Cells 23,360
Configurable Logic Blocks (CLBs) 1,825
Total Embedded RAM 1,658,880 bits (~1.62 Mb)
Available I/O Pins 150
Operating Voltage Supply 0.95V to 1.05V
Operating Temperature 0°C to 85°C (Commercial Grade)
Package / Footprint 324-CSGA (15×15 mm)
Mounting Configuration Surface Mount / BGA

Diverse Applications and Industry Use Cases

The raw processing versatility of the XC7S25-1CSGA324C makes it highly suitable for numerous demanding industries. Its primary real-world applications include:

  • Industrial Automation: Essential for real-time motor control, robotics, and rapid machine vision processing.

  • Consumer Electronics: Empowers smart home displays, IoT gateway hubs, and advanced audio/video signal processing.

  • Automotive Systems: Utilized heavily in Advanced Driver Assistance Systems (ADAS) and integrated in-vehicle infotainment.

  • Communications Infrastructure: Supports software-defined radio (SDR) and complex custom protocol implementations.

Why Choose This Spartan-7 Component?

Hardware designers often face the difficult challenge of fitting powerful processing units into tight physical spaces without exceeding critical thermal limits. The XC7S25-1CSGA324C addresses these engineering issues directly. Its compact 15x15mm 324-ball CSGA package utilizes a surface-mount Ball Grid Array (BGA) layout, saving crucial printed circuit board (PCB) space while simultaneously enabling excellent thermal heat dissipation.

Additionally, by operating within the standard commercial temperature range and drawing a low 0.95V to 1.05V supply voltage, it successfully minimizes overall system power consumption. By choosing the XC7S25-1CSGA324C, you guarantee long-term reliability, scalability, and adaptability for your next-generation digital hardware projects.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.