The RO4830 4-Layer 5G Small Cell Backhaul Board is a high-performance circuit solution specifically engineered for the rigorous demands of millimeter-wave and 5G telecommunications. Designed for RF engineers and network hardware developers, this board utilizes Rogers RO4830 thermoset laminates to ensure low insertion loss and exceptional signal stability. With a 0.8mm thickness and 4-layer stackup, it provides the structural integrity and electrical performance required for dense, small-cell deployments.
Key Features
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Material: Rogers RO4830 high-frequency laminate for superior dielectric constant (Dk) control.
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Layer Count: 4-layer precision stackup for optimised impedance and grounding.
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Board Thickness: 0.8mm slim profile for compact hardware integration.
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Copper Weight: 2oz finished copper for enhanced power handling and thermal dissipation.
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Surface Finish: ENIG (Immersion Gold) for excellent solderability and oxidation resistance.
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Signal Integrity: Low dissipation factor (Df) tailored for 5G backhaul applications.
Applications
The RO4830 4-Layer 5G Small Cell Backhaul Board is a critical component for high-bandwidth infrastructure. Primary use cases include:
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5G Small Cell base stations and outdoor units.
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Point-to-point microwave backhaul systems.
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Millimeter-wave (mmWave) RF front-end modules.
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High-speed wireless digital data links.
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Satellite communication ground equipment.
Why Choose PCBSYNC
PCBSYNC is a professional PCB fabrication, PCBA, and EMS manufacturer delivering precision-built electronics for aerospace, medical, automotive, industrial, and smart energy applications. We handle everything from rapid prototyping to mass production — including rigid, flexible, and rigid-flex PCBs, full turnkey assembly, component sourcing, AOI and X-ray inspection, and OEM/ODM support. Reliable boards. Consistent quality. From prototype to production — PCBSYNC.
For detailed technical specifications or to discuss your custom RF project requirements, please contact our engineering team or request a formal quote today.