The RO3200 16-Layer Defense Command Control PCB is engineered to meet the stringent demands of modern electronic warfare and command infrastructure. Built on high-performance Rogers RO3200 series ceramic-filled laminates, this 16-layer stackup provides exceptional dimensional stability and low thermal expansion. Designed for engineers and procurement managers in the defense sector, this board facilitates high-density interconnects while maintaining signal purity across a wide temperature range.

Key Features

• Substrate Material: Rogers RO3200 (Ceramic-filled PTFE) for superior high-frequency electrical properties.

• Layer Count: 16-layer high-density multilayer construction.

• Board Thickness: 2.0mm for enhanced mechanical rigidity.

• Copper Weight: 3oz finished copper to support high current loads and efficient thermal dissipation.

• Surface Finish: 3u Hard Gold plating over Nickel (ENIG/Hard Gold) for maximum corrosion resistance and durability.

• Compliance: Built to IPC Class 3 standards for mission-critical reliability.

Applications

• Defense Systems: Command and control (C2) modules and signal processing units.

• Aerospace: Avionics, radar systems, and satellite communication arrays.

• Telecommunications: High-speed base stations and RF power amplifiers.

• Industrial: Robust power distribution and control systems in harsh environments.

Why Choose PCBSYNC

PCBSYNC is a professional PCB fabrication, PCBA, and EMS manufacturer delivering precision-built electronics for aerospace, medical, automotive, industrial, and smart energy applications. We handle everything from rapid prototyping to mass production — including rigid, flexible, and rigid-flex PCBs, full turnkey assembly, component sourcing, AOI and X-ray inspection, and OEM/ODM support. Reliable boards. Consistent quality. From prototype to production — PCBSYNC.

Contact the PCBSYNC technical team today to discuss your project requirements or to request a detailed quotation for your custom 16-layer PCB designs.