In the rapidly evolving world of Advanced Driver Assistance Systems (ADAS), precision and reliability are non-negotiable. The RO4360G2 6-Layer Blind Spot Detection (BSD) Radar Board is engineered to meet the stringent demands of automotive safety sensors, providing the high-frequency performance required for sub-millimeter wave accuracy.
Manufactured using Rogers RO4360G2 thermoset laminate, this PCB offers a unique balance of high dielectric constant (Dk) and low loss tangent, making it the premier choice for compact radar applications.
Core Technical Specifications
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Material: Rogers RO4360G2 (High-Frequency Hydrocarbon Ceramic)
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Layer Count: 6-Layer Multilayer Construction
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Thickness: 0.8mm (Optimized for low-profile automotive enclosures)
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Copper Weight: 1oz Finished Copper
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Surface Finish: ENIG (Electroless Nickel Immersion Gold)
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Technology: Blind Via support for high-density interconnects (HDI)
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Dielectric Constant (Dk): 6.15 (Design Dk 6.4)
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Dissipation Factor (Df): 0.0038 @ 10 GHz
Why Choose RO4360G2 for Radar Applications?
1. Unmatched Miniaturization
With a high Dielectric Constant of 6.15, the RO4360G2 allows for significantly smaller circuit dimensions compared to standard FR-4 or lower-Dk RF materials. This is critical for Blind Spot Detection units that must fit within side-view mirrors or rear bumper assemblies without compromising signal integrity.
2. Thermal Stability and Reliability
Automotive environments are brutal. RO4360G2 features a high glass transition temperature (Tg >280°C) and a low Z-axis Coefficient of Thermal Expansion (50 ppm/°C). This ensures that your plated through-holes (PTH) and blind vias remain stable despite the extreme thermal cycling common in automotive electronics.
3. ENIG Finish for Precision Assembly
The ENIG (Electroless Nickel Immersion Gold) surface finish provides a perfectly flat mounting surface, essential for the high-density SMT components and fine-pitch BGA packages used in modern radar SoCs. ENIG also offers excellent oxidation resistance and long shelf life, ensuring your boards are ready for assembly when you are.
Advanced Manufacturing for ADAS
This 6-layer board utilizes advanced stack-up techniques to separate sensitive RF signal layers from power and ground planes, effectively reducing EMI and cross-talk. The use of Blind Vias maximizes routing space and reduces parasitic capacitance, which is vital for maintaining the phase accuracy required in BSD radar beamforming.
Key Benefits
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Superior Signal Integrity: Low-loss materials minimize signal attenuation at 24GHz and 77GHz frequencies.
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Rigid Processability: Unlike PTFE-based materials, RO4360G2 processes similarly to FR-4, reducing fabrication costs and lead times.
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Lead-Free Compatible: Fully compliant with RoHS standards and high-temperature lead-free soldering processes.
Applications
Beyond Blind Spot Detection (BSD), this high-performance board is ideal for:
Order your RO4360G2 Radar PCBs from PCBSync today. We specialize in high-frequency laminates and precision automotive PCB fabrication.
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