In the rapidly evolving landscape of Level 4 and Level 5 autonomous driving, the integrity of sensor fusion data is non-negotiable. PCBSync is proud to offer the RO4360G2 12-Layer Sensor Fusion PCB, a pinnacle of microwave-grade engineering designed specifically for the high-frequency demands of LiDAR, RADAR, and ultra-high-speed data processing units.
Engineered for Next-Generation ADAS
The RO4360G2 substrate is a 6.15 Dk, low-loss, ceramic-filled hydrocarbon thermoset material that bridges the gap between traditional FR-4 and high-end PTFE. By utilizing a 1.5mm thickness and a complex 12-layer stackup, this PCB provides the structural rigidity and thermal mass required for vehicle-integrated sensor arrays.
Autonomous systems rely on the seamless blending of disparate data streams. Our 12-layer architecture is precision-tuned for Sensor Fusion, allowing for dedicated ground planes and isolated signal layers that eliminate electromagnetic interference (EMI) and crosstalk—critical when millisecond latency can impact road safety.
Key Technical Specifications
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Base Material: Rogers RO4360G2 (High Dk for circuit miniaturization)
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Layer Count: 12-Layer Multilayer Stackup
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Finished Thickness: 1.5mm ± 10%
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Copper Weight: 2oz Finished Copper (Outer/Inner)
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Surface Finish: Immersion Silver (Ag)
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Application: Autonomous Driving, Sensor Fusion, ADAS Control Units
Why Choose RO4360G2 for Autonomous Systems?
The RO4360G2 material offers a unique advantage in thermal conductivity ($0.80 \text{ W/m/K}$) and a low coefficient of thermal expansion (CTE) in the Z-axis ($30 \text{ ppm/°C}$). This ensures that via-in-pad structures and microvias remain stable through the extreme temperature fluctuations common in automotive environments.
Immersion Silver (ImAg) Finish
We have selected Immersion Silver for this board to provide a superior, flat surface for high-density SMT components. Unlike HASL, Immersion Silver offers excellent conductivity and signal integrity for high-frequency RF signals, ensuring that your sensor data remains “clean” from the antenna to the processor.
2oz Heavy Copper Construction
With 2oz copper, this PCB handles higher current loads and provides enhanced heat dissipation. In autonomous driving computers where GPUs and FPGAs generate significant thermal output, the increased copper weight acts as an integrated heat sink, preventing localized hotspots and extending the lifespan of the hardware.
Reliability Meets Performance
At PCBSync, we understand that an Autonomous Driving Sensor Fusion PCB is a mission-critical component. Our manufacturing process includes:
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100% Automated Optical Inspection (AOI) for every layer.
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Controlled Impedance Testing to meet strict ±5% tolerances.
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Ionic Contamination Testing to ensure long-term reliability of the Immersion Silver finish.
Order Your High-Frequency Solutions from PCBSync
Whether you are developing a prototype for a startup or scaling up for an OEM production run, the RO4360G2 12-Layer PCB provides the reliability and signal performance required for the future of mobility.
Optimize your sensor fusion architecture today with the industry’s leading high-Dk thermoset solution.
